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ROHM Semiconductor
Short Form Catalog

Short Form Catalog

Product catalog summary

Overview: The ROHM Group Short Form Catalog 2021 Edition provides a comprehensive listing of electronic components and devices offered by ROHM, LAPIS Technology, and Kionix. The catalog is organized into sections based on product categories, with specific pages dedicated to each type of component.

Key Sections:

ICs Memory: Includes various types of memory products such as SDRAM, EEPROM, and FeRAM, with specific applications for industrial, automotive, and standard uses.
Amplifiers & Linear: Covers operational amplifiers, comparators, and transistor arrays, highlighting standard, high-speed, low power, and low noise options.
Clocks & Timers: Features high-performance clock generators and CR control timer ICs for various applications including digital cameras and A/V equipment.
Switch & IPD & Multiplexer & Logic: Details standard logic, analog switches, multiplexers, and intelligent power devices (IPD).
Data Converter: Focuses on D/A converters with 8-bit and 10-bit options.
Interface: Includes LVDS interface ICs, timing controllers, and various transceivers for communication protocols like LIN, CAN, and USB Type-C.
Power Management: Encompasses linear and switching regulators, battery management, and wireless power solutions.
Motor/Actuator Drivers: Provides drivers for DC brush motors, stepper motors, and fan motors, with options for high performance and reliability.
LED Drivers: Lists various LED driver types including boost, buck, and buck-boost converters.
Display Drivers: Covers drivers for LCD and VFD displays, including segment and controller drivers.
Sensors & MEMS: Includes Hall ICs, geomagnetic sensors, current sensors, and accelerometers, with applications in ambient light and heart rate monitoring.
Communication LSI: Features wireless communication LSIs and car communication LSIs.
Audio & Video: Details audio amplifiers, processors, and video interfaces, with a focus on automotive and high-fidelity applications.
Speech Synthesis LSI: Offers LSIs for automotive-grade speech synthesis and playback.
Microcontroller: Lists general-purpose, low power, and USB interface MCUs, with options for 8-bit, 16-bit, and 32-bit architectures.
IC Packages: Describes various package types including SOP, QFP, and BGA, with explanations of part numbers.
Power Devices: Includes SiC Schottky barrier diodes, MOSFETs, and full SiC power modules.
Discrete Devices: Covers transistors, diodes, and protection devices, with a focus on automotive applications.
Passive Devices: Lists resistors and capacitors, including chip resistors and tantalum capacitors.
Opto Devices: Features LEDs, LED displays, and laser diodes.
Modules: Includes wireless modules and thermal printheads.

Conclusion: The catalog serves as a detailed reference for engineers and designers, providing essential information on a wide range of electronic components and their applications.

Overview: The document provides detailed specifications for various operational amplifiers, focusing on their electrical characteristics, package types, and automotive grade compliance. It categorizes amplifiers based on their power consumption, noise levels, and operational capabilities.

Specifications: Each amplifier is described with parameters such as supply voltage, circuit current, input offset voltage, input bias current, output current, input and output voltage ranges, voltage gain, common-mode rejection ratio (CMRR), power supply rejection ratio (PSRR), slew rate, gain bandwidth product, and operating temperature range. The document also specifies the package type and automotive grade compliance (AEC-Q100).

Key Sections:

High Speed Automotive Ground Sense Operational Amplifiers: These amplifiers are designed for high-speed applications with excellent EMI characteristics. They operate over a wide supply voltage range and are suitable for automotive applications.
Low Power Consumption Amplifiers: These amplifiers are optimized for low power consumption, making them ideal for battery-powered devices. They offer full input-output voltage swing capabilities.
Low Noise Amplifiers: These amplifiers are designed to minimize noise, providing high fidelity in audio and precision measurement applications.
Dual Supply Voltage Operational Amplifiers: These amplifiers support dual supply voltages, offering flexibility in various circuit designs.

Recommendations: The document suggests selecting amplifiers based on specific application requirements such as power consumption, noise levels, and operational speed. It emphasizes the importance of considering automotive grade compliance for applications in the automotive sector.

Conclusion: The document serves as a comprehensive guide for selecting operational amplifiers based on detailed electrical specifications and application needs. It highlights the versatility and performance of ROHM's amplifier products across different sectors.

Overview: The document provides detailed specifications and features of various Low Quiescent Current Low Dropout (LDO) Regulators. These components are essential in power management for automotive and industrial applications, offering different output currents, voltage ranges, and protection features.

Key Sections:

Specifications: The document lists multiple LDO regulators with varying input and output voltage ranges, output current capabilities, and precision levels. It highlights the importance of ensuring the input voltage exceeds the sum of the output voltage and dropout voltage.
Protection Features: Most regulators include over-current and over-temperature protection circuits, ensuring reliability and safety in various operating conditions.
Automotive Grade Compliance: Many of the listed regulators comply with the AEC-Q100 standard, indicating suitability for automotive applications.
Package Types: The document details various package options such as TO252, TO263, and TO220, which cater to different mounting and space requirements.
Operating Conditions: The regulators are designed to operate across a wide temperature range, typically from -40°C to +150°C, making them suitable for harsh environments.

Tables and Data: The document includes extensive tables listing part numbers, voltage specifications, current ratings, and package types. These tables serve as a quick reference for selecting the appropriate regulator based on specific application needs.

Recommendations: Users are advised to ensure that the input voltage always exceeds the sum of the output voltage and dropout voltage to maintain optimal performance.

Overview: This document provides detailed specifications and features of various integrated MOSFET switching regulators, including buck converters, boost converters, and buck-boost converters. It categorizes the products based on input voltage, output current, and other critical parameters.

Single Output Buck Converters: These converters are designed for applications requiring a single output. Key specifications include input voltage ratings ranging from 7V to 80V, output currents from 0.5A to 8A, and switching frequencies from 0.1MHz to 2.5MHz. Features such as over-current protection, thermal protection, and recovery modes are common across models.

Dual Output Buck Converters: These converters provide dual outputs with varying input voltage ratings and output currents. They are equipped with features like latch and recovery modes, and are available in compact packages like VQFN and HTSOP.

Boost and Buck-Boost Converters: The document lists both single and dual output configurations. These converters support input voltages up to 62V and offer features such as synchronous rectification and light-load efficiency. They are suitable for applications requiring voltage boosting or inversion.

External Switch Switching Regulators: These include both buck and boost controllers, designed for applications needing external synchronization and adjustable soft start. They support high input voltages and offer robust protection features.

Technological Features: The document highlights the use of Nano EnergyTM, Nano Pulse ControlTM, and Nano CapTM technologies, which are trademarks of ROHM Co., Ltd., enhancing efficiency and performance in power management applications.

Overview: This document provides detailed specifications for various integrated circuits (ICs) used in power management applications, including AC/DC converters, gate drivers, and high-side switch ICs. The document is structured into sections based on the type of IC and its application.

1. AC/DC Converter ICs:

Primary Side Control: Includes models like BD7692FJ and BM1050AF, which operate within a supply voltage range of 8.9 to 26.0V, utilizing PFC and QR control methods. These ICs are packaged in SOP-J8 and SOP24 formats.
Secondary Side Synchronous Rectification: Models such as BM1R00146F operate from 2.7 to 32.0V with a shunt regulator accuracy of ±0.5% and are packaged in SOP8.

2. AC Voltage Zero Cross Detection ICs:

These ICs, including BM1Z001FJ, are designed for high precision AC voltage zero cross timing detection, operating from 10 to 28V with a maximum AC input voltage of 600V. They feature pulse output waveform and are packaged in SOP-J7S and SOP-J11.

3. Isolated DC/DC Converter ICs:

Models like BD7F100EFJ-LB offer output power ranging from 1W to 10W, with input voltage ratings up to 80V. They utilize adaptive on-time control mode and are packaged in HTSOP-J8 and HSON8.

4. Isolated Gate Drivers:

These drivers, such as BM6101FV-C, support input-side supply voltages of 4.5 to 5.5V and output-side voltages up to 24V. They feature active miller clamping and fault signal output, with isolation voltages up to 3,750Vrms, packaged in SSOP-B20W.

5. High-Side Switch ICs:

Models like BD2051AFJ operate from 2.7 to 5.5V with ON resistance as low as 80mΩ. They support output currents up to 2.1A and feature recovery mechanisms for overcurrent protection, packaged in SOP-J8 and TSSOP-B8J.

Key Features and Applications:

These ICs are designed for high efficiency and reliability in power management systems, suitable for automotive and industrial applications.
They offer features like UVLO, SCP, DESAT, and thermal protection to ensure safe operation under various conditions.

Overview: The document provides detailed specifications and features of various integrated circuits (ICs) used in power management applications, including high side switch ICs, load switch ICs, battery management ICs, and voltage detectors. These components are essential for managing power distribution, protection, and monitoring in electronic devices.

1. High Side Switch ICs:

These ICs are designed for automotive and industrial equipment applications, offering features like overcurrent protection (OCP), thermal shutdown, and recovery mechanisms.
Specifications include input voltage range (2.7 to 5.5V), ON resistance (70 to 110 mΩ), and output current capabilities (0.9 to 2.0A).
Automotive-grade ICs comply with AEC-Q100 standards, ensuring reliability in automotive environments.

2. Load Switch ICs:

These ICs manage power distribution with features like low ON resistance, active control logic, and thermal shutdown.
They are available in single and dual-channel configurations, suitable for compact and high-efficiency applications.
Specifications include input voltage range (2.7 to 5.5V), current consumption (20 to 70 µA), and discharge resistance (70 to 350 Ω).

3. Battery Management ICs:

Includes battery charger ICs and charge protection ICs, designed to ensure safe and efficient battery charging and protection.
Charger ICs offer precise charge voltage and current accuracy, with switching frequencies up to 1,200 kHz.
Protection ICs provide overvoltage, undervoltage, and overcurrent protection, with built-in status flags and recovery features.

4. Voltage Detectors (Reset ICs):

These ICs monitor voltage levels to ensure system stability and prevent damage from overvoltage or undervoltage conditions.
Available in various configurations, including standard CMOS, low voltage detection, and bipolar types.
Specifications include voltage detection precision (±1%), detection range (0.9 to 6.0V), and output types (open drain, CMOS).

5. Wireless Power and Battery Monitoring:

Wireless power ICs support 13.56MHz wireless charging, with features like NFC compatibility and adjustable output voltage.
Battery monitoring ICs provide comprehensive protection and monitoring for multi-cell battery packs, with options for standalone or MCU-controlled configurations.

Conclusion: The document outlines a comprehensive range of power management ICs, each tailored for specific applications and environments. These components are critical for ensuring efficient power distribution, protection, and monitoring in modern electronic systems.

Overview: This document provides detailed specifications and features of various audio and video components, including video amplifiers, video drivers, video switches, video encoders, and image correction ICs. It is intended for use in audio and video applications, particularly in automotive and consumer electronics.

Video Amplifiers: The document lists several ultra-compact video amplifiers with specifications such as supply voltage, circuit current, amplifier gain, frequency characteristics, and package dimensions. These amplifiers are designed for composite video applications and feature output capacitor-less designs.

Video Drivers: Various 1-channel video drivers are detailed, highlighting their supply voltage, circuit current, amplifier gain, frequency characteristics, and package types. These drivers are suitable for compact and low-current applications.

Video Switches: The document includes specifications for video switches with wide bandwidth, detailing supply voltage, circuit current, amplifier gain, frequency characteristics, and crosstalk levels. These switches support multiple input-output configurations.

Video Encoders and Decoders: Specifications for video encoders and decoders are provided, including supply voltage, input/output types, pixel frequency, and package details. These components support various video standards such as NTSC, PAL, and SECAM.

Image Correction ICs: The document outlines image correction ICs for panel applications, detailing supply voltage, image data size, control interfaces, and package types. These ICs support image quality adjustments and are suitable for automotive-grade applications.

Additional Features: The document also mentions speech synthesis LSI with long-time playback capabilities, highlighting internal flash memory types and operating voltage ranges.

Key Considerations: The document emphasizes the importance of halogen-free support and automotive-grade compliance, indicating that these products are suitable for environmentally conscious and high-reliability applications.

Overview: This document provides detailed specifications for various IC packages offered by ROHM, including QFP, TQFP, VQFP, HTQFP, HQFP, SQFN, UQFN, VQFN, WQFN, BGA, and power packages. It includes dimensions, pin numbers, and packaging options for each type.

QFP Packages: These packages are available in different pin pitches and sizes. For example, the SQFP-T52 has 52 pins with dimensions of 12.0mm x 12.0mm x 1.5mm, and is available in trays and taping of 1,000 pieces each.

TQFP and VQFP Packages: These packages have a pin pitch of 0.5mm and vary in pin count and dimensions. The TQFP100V, for instance, has 100 pins and measures 16.0mm x 16.0mm x 1.2mm.

HTQFP and HQFP Packages: These packages include a back heat sink and are available in various sizes. The HTQFP64AV has 64 pins and measures 12.0mm x 12.0mm x 1.0mm with a 4.3mm x 4.3mm heat sink.

QFN Packages: These include SQFN, UQFN, VQFN, and WQFN types, with pin pitches ranging from 0.4mm to 0.65mm. The UQFN28V4040A, for example, has 28 pins and measures 4.0mm x 4.0mm x 1.0mm.

BGA Packages: These packages, such as the SBGA072T070A, have a pin pitch of 0.65mm and dimensions of 7.0mm x 7.0mm x 1.2mm, available in taping of 1,500 pieces.

Power Packages: These include various pin configurations and dimensions, such as the TO220CP-3 with dimensions of 10.0mm x 15.2mm x 5.61mm, available in taping of 500 pieces.

Product Naming Convention: The document explains the naming convention for semiconductor devices, starting with the character 'M', and includes device code, option classification, and package symbol to indicate specific functions and modifications.

Note: For detailed dimensions and additional information, the document advises checking the ROHM website or referring to the LAPIS Technology Packages.

Overview: The document provides detailed technical specifications and packaging information for various semiconductor components, including IGBT modules, MOSFETs, and Intelligent Power Modules (IPMs). It includes data on package types, electrical characteristics, and thermal protection features.

Packaging Information: The document lists different package codes and styles, such as TO-252, TO-263S, TO-263L, TO-262, TO-220NFM, TO-247N, TO-247GE, and TO-3PFM. Each package type is associated with a specific basic ordering unit, indicating the number of pieces per package.

Ignition IGBT Specifications: This section provides specifications for various Ignition IGBT parts, including part numbers, voltage ratings (VCES, VGES), current (Ic), power dissipation (PD), energy (Eas), and typical saturation voltage (VCE(sat)). The document also indicates whether each part meets the AEC-Q101 automotive grade standard.

Intelligent Power Modules (IPMs): The document outlines the specifications for IGBT-IPM and MOS-IPM, including generation, part numbers, power device type, voltage (VCES or VDS), current (IC or ID), PWM input frequency, isolation voltage, and thermal protective functions like Thermal Shut Down (TSD) and Analog Temperature Output (VOT). It also provides a quick reference for IPMs, detailing the package type and protective features.

Small Signal MOSFET Series: This section lists various MOSFET products, detailing their package type, polarity, voltage (VDSS), current (ID), power dissipation (PD), and on-resistance (RDS(on)) at different gate-source voltages (VGS). It also includes the gate charge (Qg) for specific VGS values.

Block Diagram: A block diagram is provided for the IGBT-IPM, illustrating the high-side and low-side gate drivers, inverter part, and protective functions such as UVLO, SCP, TSD, and VOT. The diagram highlights the integration of low-loss field stop trench IGBTs and ultra-low VF fast recovery diodes.

Key Notes: The document includes notes on package codes, indicating JEDEC and ROHM package codes, and highlights parts under development. It also provides explanations for part numbers and packaging specifications.

Overview: This document provides a comprehensive reference for various types of bipolar transistors, including power bipolar transistors, complex bipolar transistors, and digital transistors. It includes technical specifications, package types, applications, and performance parameters.

1. Power Bipolar Transistors:

Packages: Various package types such as DFN2020-3S, SOT-89, TO-252, and TO-263AB are mentioned, each with specific applications and size dimensions.
Polarity and Applications: Transistors are categorized by polarity (PNP, NPN) and applications such as gate drivers and high-speed switching.
Specifications: Key parameters include VCEO (collector-emitter voltage), IC (collector current), and hFE (current gain). For example, the 2SAR642P (PNP) and 2SCR642P (NPN) are gate drivers with VCEO of 30V and IC of 10A.

2. Complex Bipolar Transistors:

Configurations: Includes configurations like PNP×2, NPN×2, and PNP+NPN for pre-amplifiers and current mirror circuits.
Packages: Various package sizes such as VMT6, SOT-553, and SOT-363 are used for different applications.
Specifications: Parameters include VCEO, IC, and hFE, with specific applications like pre-amplifiers and drivers.

3. Digital Transistors:

Automotive Use: Digital transistors for automotive applications are highlighted, with specifications for R1 and R2 resistances, VCC, and IO.
Packages: SOT-723 is a common package for these transistors, with a power dissipation of 150mW.
Specifications: Examples include DTA123EM with R1 and R2 of 2.2kΩ, VCC of -50V, and IO of -0.1A.

Notes:

JEDEC, ROHM, and JEITA codes are used for package identification.
Technical specifications provide detailed information on hFE ranges and internal circuits.

Overview: This document provides detailed specifications for various digital transistors, including PNP and NPN types, across different package sizes and configurations. The transistors are categorized based on their resistance values (R1 and R2), voltage ratings (VCC), current ratings (IO), and gain (GI).

Specifications:

Package Types: The document lists several package types such as SOT-723, SOT-416FL, SOT-323FL, SOT-23, SOT-346, SOT-563, SOT-363, and SOT-457, each with specific size and power dissipation (PD) ratings.
Transistor Types: Both PNP and NPN transistors are covered, with configurations where R1 equals R2, R1 differs from R2, and R1 or R2 alone.
Resistance Values: R1 and R2 values range from 1 kΩ to 100 kΩ, affecting the transistor's performance characteristics.
Voltage and Current Ratings: VCC (VCEO) values are typically ±50V or ±12V, with current ratings (IO) ranging from 0.02A to 0.5A.
Gain (hFE): The gain values vary, with some transistors offering a gain of 20 or more, while others provide a gain of up to 600.

Key Features:

Automotive Grade: Some transistors are marked as automotive grade, compliant with AEC-Q101 standards, indicating suitability for automotive applications.
Complex Configurations: The document includes complex digital transistors with configurations like PNP×2, NPN×2, and complementary PNP+NPN types.
Applications: These transistors are designed for consumer electronics and automotive applications, offering various configurations to meet specific circuit requirements.

Notes:

Reference land installation is required for certain specifications.
Package codes follow JEDEC and JEITA standards, with specific codes for ROHM packages.

Overview: This document provides detailed specifications and characteristics of various series of chip resistors, including LTR, KTR, SFR, MCR, UCR, and LHR series. These resistors are designed for high reliability, anti-surge capabilities, and current detection applications, suitable for automotive and other demanding environments.

Specifications:

Resistance Range: Varies across series, generally from 1Ω to 10MΩ, with specific low ohmic options available.
Tolerance: Typically ±1% (F) or ±5% (J).
Rated Power: Ranges from 0.05W to 2W, depending on the series and size.
Temperature Coefficient: Varies, with some series offering coefficients as low as ±100 ppm/°C.
Operating Temperature: Generally from -55°C to +155°C.
Automotive Grade: Most series are AEC-Q200 qualified, ensuring suitability for automotive applications.

Dimensions: Each series and part number has specific dimensions, typically provided in millimeters, with variations in length, width, and thickness to accommodate different applications and power ratings.

Packaging: Resistors are available in various packaging options, including paper and embossed tape, compatible with JEITA standards, and typically supplied in reels of 5,000 to 15,000 units.

Key Features:

High Reliability: Designed for long-term stability and performance in harsh environments.
Anti-Surge Capability: Certain series are specifically designed to handle surge currents, making them ideal for applications like camera flash circuits.
Low Ohmic Options: Available for current detection applications, with resistances as low as 10mΩ.
Space-Saving Design: High power ratings allow for smaller resistor sizes, contributing to compact circuit designs.

Applications: These resistors are suitable for a wide range of applications, including automotive electronics, consumer electronics, and industrial equipment, where reliability and performance are critical.

Overview: The document provides detailed specifications and characteristics of various LED and laser diode products, focusing on their electrical and optical properties, packaging types, and performance metrics. It includes information on high brightness LED lamps, numeric displays, and laser diodes, both red and infrared.

LED Specifications: The document categorizes LEDs based on their package shape, color, and brightness rank. It distinguishes between mono-color LEDs (excluding blue, green, and white) and multi-color options. Key parameters include forward current (IF), reverse voltage (VR), and luminous intensity (IV). The document also outlines the dimensions and viewing angles for different LED series, such as SLI, SLA, and SLR.

Numeric Displays: The document details single and two-digit LED numeric displays, highlighting their character height, external dimensions, and color options. It specifies absolute maximum ratings, including power dissipation (PD), forward current (IF), and operating temperature range. The displays are available in various colors, such as red, green, and orange, with specific brightness levels and wavelengths.

Laser Diodes: The document covers red and infrared laser diodes, providing information on their wavelength, power output (PO), and electrical characteristics. It includes details on package types and equivalent circuits. The document notes the importance of handling open package products carefully to avoid environmental degradation of laser diode characteristics.

Key Considerations: The document emphasizes the importance of adhering to specified electrical and optical characteristics to ensure optimal performance and reliability. It also highlights the need for careful handling of laser diodes, particularly those with open packages, to prevent contamination and damage.

Catalog excerpts

ROHm SEMICONDUCTOR rohm group Short Form Catalog ROHM Co.,Ltd.

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1) The information contained in this document is provided as of 1st. October, 2020. 2) The information contained herein is subject to change without notice. Before you use our Products, please contact our sales representative (as listed below) and verify the befor page specifications. 3) Although “ROHM group” (It is said here in after refers to ROHM) is continuously working to improve product reliability and quality, semiconductors can break down and malfunction due to various factors. Therefore, in order to prevent personal injury or fire arising from failure, please take safety measures such...

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NL Memory |g Data Converter @ Amplifiers & Linear Clocks & Timers High-performance Clock Generators ICs- 23 Switch & IPD & Multiplexer & Logic Built-in OVP Micro USB Switch with USB2.0, MHL™ and Audio ■ 25 IPD (Intelligent Power Device)- 25 Multiple Input Switch Monitor LSIs- 28 IrDA SIR, MIR, FIR, IrSimple Controllers/Remote Control Transmitters ■ •• 28 USB Type-C Power Delivery- 29 For POWER SOURCE (POWER Role: Source, DATA Role: DFP, Internal Shunt Reg., Variable OCP, Variable OVP, Internal Vconn SW) ■■■ 29 For POWER SOURCE & SINK (POWER Role: Source/Sink/DRP, DATA Role: DFP/UFP/DRD) ■ ■•...

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Contents \K% Power Management\K% Motor/Actuator Drivers Linear Regulators- 31 Switching Regulators (System Power Supplies)- 52 Programmable Gamma-Voltage Generator/Gamma Buffer Amplifiers • •• 52 System Power Supply ICs for Industrial/Consumer Applications • •• 54 Isolated/Non-isolated Power Supply- 54 AC Voltage Zero Cross Timing Detection ICs for AC/DC Power Supply • •• 56 IGBT/MOSFET High-side Low-side 3 Phase Bridge Drivers • • ■ 57 Non-insulated Gate Driver for Battery Management System (BMS) • 57 Power Management Switch- 57 Voltage Detectors (Reset ICs)- 61 DC Brush Motor Drivers- 64 Stepper...

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TN/STN LCD Driver series- 79 Ambient Light Sensor ICs- 82 Optical Sensor for Heart Rate Monitor ICs- 83 Amplifier for Human Body Detector IC- 83 Shock Sensor Amplifier- 83 Capacitive Switch Controller ICs- 84 Touch Screen Controller ICs- 84

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Wireless Communication LSIs- 85 MCU Included Specified Low Power Radio (Sub-GHz Band Radio) System LSI ■ ■ 86 Power Supply ICs for Audio- 89 Display Controller Series for Small to Medium-Sized TFT LCD 95 ® Speech Synthesis LSI Speech Synthesis LSI with Automotive grade- 97 Speech Synthesis LSI with Long-time Playback- 97 Speech Synthesis LSI with Short-time playback- 98 Speech Synthesis LSI with External Memory- 98 16bit ML620Q500 USB Interface & Security function MCU (32bit) 32bit ML630Q400 (Cortex-M0+) Low Voltage Operation MCU (8bit)- 8bit ML610400/ML610Q400 Speech Play Back MCU (8bit)- ROHM...

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Power Devices H SiC Schottky Barrier Diodes SiC Schottky Barrier Diodes - Field Stop Trench IGBT Ignition IGBT- Full SiC Power Modules 0 Intelligent Power Modules Full SiC Power Modules - Discrete Devices Schottky Barrier Diodes- Fast Recovery Diodes- Rectifier Diodes- Zener Diodes- Protection Devices- Bi-Directional Zener Diodes- Switching Diodes- High Frequency Diodes-

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Passive Devices ® Resistors Quick Reference of Resistance Range- 221 Class-leading Compact Size Chip Resistors (RASMID™ series) High Power Thick Film Shunt Resistors <Wide Terminal type> <Low TCR> (LHR series) • •• 234 High Power Thick Film Shunt Resistors <Wide Terminal type> (Low Ohmic LTR series) • •■ 234 Chip Resistors for Current Detection (Metal Plate type) Metal Plate Shunt Resistors <Wide Terminal type> <Ultra Low ohmic> (PML series) • • • 236 High Power Metal Plate Shunt Resistors <Ultra Low ohmic> (PSR series) • 237 Standard Nominal Resistance Values- 239 Conductive Polymer Capacitors...

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Opto Devices Laser Diodes High Brightness LED Numeric Displays-266 Surface Mount LED Numeric Displays-266 High Power Infrared Lasers- 270 High Power Infrared VCSEL- 270 Part Numbers, Symbols and Definitions- 271 Transmission type Photointerrupters- 274 Reflective type Photosensors (Photoreflectors)- 274 Infrared Light Emitting Diodes- 276 Ambient Light and Proximity Sensor- 277 ROHM Wireless Modules Technology-280 Wi-SUN Communication Modules (Specified Low Power Radio Modules) — 280 Wireless LAN Modules-280 For Mobile Printers series- 283 For Label writers series- 283 For Receipt, Label Printers...

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Memory SDRAM (LAPIS Technology products) Serial EEPROM (LAPIS Technology products) Standard Legacy DRAM SDRAM Industrial Legacy DRAM SDRAM Automotive Legacy DRAM SDRAM SDRAM for SiP Standard EEPROM -SPI BUS EEPROM-Microwire BUS "EEPROM (3-Wire) " -WL-CSP EEPROM - Plug & Play "EEPROM " Automotive EEPROM -Parallel BUS FeRAM --I2C BUS FeRAM- SCL Frequency=1MHz • BR25Gxxx-3 series • BR93Gxx-3/3A/3B series • WL-CSP EEPROM Memory Module series Display series

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SDRAMStandard Legacy DRAM SDRAM (lapis Technology products) Standard

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Serial EEPROMStandard EEPROM Memory

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Microwire BUS EEPROM (3-Wire) BR93Gxx-3/3A/3B series: *1 They are dual organization (by 16bit or 8bit) and it is selected the input of ORG PIN. *2 1PIN: CS PIN *3 3PIN: CS PIN Micro Wire BUS Pin Assignment cs m sk m DI d DO ■ Rotated Pins Interchangeable with the BR93LxxRxx-W series

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Plug & Play EEPROM For Memory Modules Plug & Play EEPROM For Memory Modules: *1 Vcc=1.7 to 5.5V *2 Vcc=2.5 to 5.5V Plug & Play EEPROM For Display Automotive EEPROM 125°C Operation I2C BUS EEPROM (2-Wire) BR24Hxxx-5AC series 105°C Operation I2C BUS EEPROM (2-Wire) BR24Axx-WM series 85°C Operation I2C BUS EEPROM (2-Wire) BR24Txx-3AM series Endurance (times) Data Retention (years) 125°C Operation Microwire BUS EEPROM (3-Wire) BR93Hxx-2C series 105°C Operation Microwire BUS EEPROM (3-Wire) BR93Axx-WM series Endurance (times) Endurance (times) Data Retention (years) Data Retention (years)

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