CSL1501RW Data Sheet ■Features • Thin, ultra-compact package • Side view type ■Size Color Type ■Recommended Solder Pattern 1.0 ± 0.1 Cathode index ■Moisture sensitivity level(MSL) : ■Specifications Absolute Maximum Ratings (Ta=25ºC) Emitting Power Forward Peak Forward Electrical and Optical Characteristics (Ta=25ºC) Forward Voltage VF Reverse Current IR Current Current Voltage PD(mW) IF(mA) IFP(mA) VR(V) Operating Temp. Storage Temp. Chip Structure (mW/sr) (mW/sr) (　):Refernce Data

[Data Sheet] ■Electrical Characteristics Curves Fig.1 Forward Current - Forward Voltages Fig.2 RADIANT Intensity 　　　　　Atmosphere Temperature RELATIVE RADIANT INTENSITY [a.u.] Fig.4 Derating MAXIMUM FORWARD CURRENT : [mA] Fig.3 RADIANT Intensity - Forward Current RELATIVE RADIANT INTENSITY

[Data Sheet] ■Viewing Angle RELATIVE INTENSITY (%) RELATIVE INTENSITY (%)

[Data Sheet] (Note) Tolerance is within ±0.2mm unless otherwise specified. Pull direction ■Part No. Construction *"-"will be taken out for emitting color Special Code will be applied for WB/B/E series. Emitting color WB/B/E series. Chromaticity rank Rank sign Chromaticity rank (for white LED） Rank sign (Brightness Rank)* Series name Package Type Series name Chip type Chip type Package Type Emitting Color Standard Type High Brightness type Yellow Yellow Yellowish green Transparent Colorless Cathode at sprocket hole side(the back) Cathode at sprocket hole side(the top) Black White Milky *Concerning...

[Data Sheet] ■Precaution (Surface Mount Device) １．Storage If the product is heated during the reflow under the condition of hygroscopic state, it may vaporize and expand which will influence the performance of the product. Therefore, the package is waterproof. Please use the product following the conditions: ・Using Conditions Classification Temperature Humidity Expiration Date Remark ①Before Within 1 year 5～30℃ 30～70%RH Storage with waterproof package using from Receiving ②After opening Please storing in the airtight container 5～30℃ Below 70%RH Within 168h package with our desiccant (silica gel)...

[Data Sheet] ３．Others ３－１．Surrounding Gas Notice that if it is stored under the condition of acid gas (chlorine gas, sulfured gas) or alkali gas (ammonia), it may result in low soldering ability (caused by the change in quality of the plating surface ) or optical characteristics changes (light intensity, chrominance) and change in quality of cause die bonding (Ag-paste) materials. All of the above will function failure of the products. Therefore, please pay attention to the storage environment for mounted product (concern the generated gas of the surrounding parts of the products and the atmospheric...

[Data Sheet] ４．Mounting ４－１. Soldering ・No resin hardening agent such as filler is used in the sealing resin of the product. Therefore, resin expansion and moisture absorption at humidity will cause heat stress during soldering process and finally has bad influence on the product’s reliability. ・The product is not guaranteed for flow soldering. ・Do not expose the product in the environment of high temperature (over 100℃) or rapid temperature shift (within 3℃/sec. of temperature gradient) during the flow soldering of surrounding parts. In case of carrying out flow soldering of surrounding parts...

[Data Sheet] ４－６．Reflow Profile For reflow profile, please refer to the conditions below:(※) ■Meaning of marks, Conditions Mark Tsmax Tsmin ts TL tL TP tP ΔTR/Δt ΔTD/Δt Conditions 180℃ Minimum of pre-heating temperature 140℃ Time from Tsmin to Tsmax Over 60sec. Reference temperature 230～260℃ Retention time for TL Within 40sec. Peak temperature 260℃(Max) Time for peak temperature Within 10sec. Temperature rising rate Under 3℃/sec. Temperature decreasing rate Over -3℃/sec. Maximum of pre-heating temperature ※Above conditions are for reference. Therefore, evaluate by customer’s own circuit boards...

Notes 1) The information contained herein is subject to change without notice. 2) Before you use our Products, please contact our sales representative and verify the latest specifications : 3) Although ROHM is continuously working to improve product reliability and quality, semiconductors can break down and malfunction due to various factors. Therefore, in order to prevent personal injury or fire arising from failure, please take safety measures such as complying with the derating characteristics, implementing redundant and fire prevention designs, and utilizing backups and fail-safe procedures....