CSL1104WBx Series (x=A/B/C/D) 　　　　 Data Sheet ■Features • 1608 (0603) size, compact and high intensity reflector type ■Size Color Type ■Recommended Solder Pattern 0.8 ±0.1 Cathode Index ：Land Pattern ■Moisture sensitivity level(MSL) : ■Specifications Absolute Maximum Ratings (Ta=25ºC) Emitting Power Forward Peak Forward Forward Voltage VF Reverse Current IR Chromaticity Luminous Intensity IV Operating Temp. Storage Temp. Chip Structure Current Current Voltage PD(mW) IF(mA) IFP(mA) VR(V) Electrical and Optical Characteristics (Ta=25ºC) InGaN White

[Data Sheet] ■Electrical Characteristics Curves Reference Fig.2 Luminous Intensity 　　　　　Atmosphere Temperature RELATIVE LUMINOUS INTENSITY [a.u.] Fig.1 Forward Current - Forward Voltages Fig.4 Derating MAXIMUM FORWARD CURRENT : [mA] RELATIVE LUMINOUS INTENSITY Fig.3 Luminous Intensity - Forward Current

[Data Sheet] ■Viewing Angle RELATIVE INTENSITY RELATIVE INTENSITY

[Data Sheet] ■Rank Reference of Brightness* White(WB) Rank Iv(cd) ■Chromaticity Diagram Chromaticity rank Chromaticity rank Chromaticity rank

[Data Sheet] Packing quantity 3,000pcs / reel Pull direction (Unit : mm) (Note) Tolerance is within ±0.2mm unless otherwise specified. ■Part No. Construction Chromaticity rank Series name Package Type Emitting Color Rank sign (Brightness Rank)* Resin Color Taping Specification Sapphire blue Transparent Colorless Milky White *Concerning the Brightness rank. *Please refer to the rank chart above for luminous intensity classification. *Part name is individual for each rank. *When shipped as sample,the part name will be a representative part name. General products are free of ranks. Please contact...

[Data Sheet] ■Precaution (Surface Mount Device) １．Storage If the product is heated during the reflow under the condition of hygroscopic state, it may vaporize and expand which will influence the performance of the product. Therefore, the package is waterproof. Please use the product following the conditions: ・Using Conditions Classification Temperature Humidity Expiration Date Remark Within 1 year ①Before using 5～30℃ 30～70%RH Storage with waterproof package from Receiving ②After opening Please storing in the airtight container 5～30℃ Below 70%RH Within 168h package with our desiccant (silica gel)...

[Data Sheet] ３．Others ３－１．Surrounding Gas Notice that if it is stored under the condition of acid gas (chlorine gas, sulfured gas) or alkali gas (ammonia), it may result in low soldering ability (caused by the change in quality of the plating surface ) or optical characteristics changes (light intensity, chrominance) and change in quality of cause die bonding (Ag-paste) materials. All of the above will function failure of the products. Therefore, please pay attention to the storage environment for mounted product (concern the generated gas of the surrounding parts of the products and the atmospheric...

[Data Sheet] ４．Mounting ４－１. Soldering ・No resin hardening agent such as filler is used in the sealing resin of the product. Therefore, resin expansion and moisture absorption at humidity will cause heat stress during soldering process and finally has bad influence on the product’s reliability. ・The product is not guaranteed for flow soldering. ・Do not expose the product in the environment of high temperature (over 100℃) or rapid temperature shift (within 3℃/sec. of temperature gradient) during the flow soldering of surrounding parts. In case of carrying out flow soldering of surrounding parts...

[Data Sheet] ４－６．Reflow Profile For reflow profile, please refer to the conditions below:(※) ■Meaning of marks, Conditions Mark Tsmax Tsmin ts TL tL TP tP ΔTR/Δt ΔTD/Δt Meanings Maximum of pre-heating temperature Minimum of pre-heating temperature Time from Tsmin to Tsmax Reference temperature Retention time for TL Peak temperature Time for peak temperature Temperature rising rate Temperature decreasing rate ※Above conditions are for reference. Therefore, evaluate by customer’s own circuit boards and reflow furnaces before using, because stress from circuit boards and temperature variations of...

Notes 1) The information contained herein is subject to change without notice. 2) Before you use our Products, please contact our sales representative and verify the latest specifications. 3) Although ROHM is continuously working to improve product reliability and quality, semiconductors can break down and malfunction due to various factors. Therefore, in order to prevent personal injury or fire arising from failure, please take safety measures such as complying with the derating characteristics, implementing redundant and fire prevention designs, and utilizing backups and fail-safe procedures....

Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. The...