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PCB Solder Pallet Materials

PCB Solder Pallet Materials

PCB Solder Pallet Materials

Product catalog summary

Overview: Durostone® materials are high-performance composite materials designed for the PCB assembly process, specifically for SMT reflow and wave soldering. The main grades include CHP760, CAS761, and CAG762, each offering excellent mechanical properties at elevated temperatures, low thermal conductivity, and good chemical resistance.

Material Grades:

  • CHP760, CAS761, CAG762: These grades are suitable for SMT reflow and wave soldering, providing excellent machining properties for complex designs and good resistance to modern flux chemicals.
  • WGR781: Designed for harsh environments, this woven glass laminate withstands extreme temperatures and aggressive fluxes, offering high cycle repetition and eliminating the need for titanium inserts in some applications.

Technical Specifications:

  • Mechanical Properties: All grades have a flexural strength of 360 MPa at 23°C, with WGR781 reaching 400 MPa. The modulus of elasticity is 18,000 MPa for CHP760, CAS761, and CAG762, and 26,000 MPa for WGR781.
  • Thermal Properties: Maximum operating temperatures are 300°C for CHP760, CAS761, and CAG762, and 320°C for WGR781. Standard operating temperatures are 260°C and 280°C, respectively.
  • Other Properties: Water absorption is less than 0.20% for the first three grades and less than 0.10% for WGR781. Surface resistivity varies, with CHP760 being non-anti-static and the others having anti-static properties.

Material Selector: A flow chart is provided to select the appropriate material grade based on process parameters such as corrosive flux presence, pre-heat temperature, optical reflectivity, solder bath temperature, and anti-static requirements.

Contact Information: Röchling Industrial provides contact details for their offices across Europe, North America, and Asia, ensuring global support and distribution.

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Catalog excerpts

PCB Solder Pallet Materials-1

PCB Solder Pallet Materials High performance composite materials specifically designed for the PCB assembly process

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PCB Solder Pallet Materials-2

PCB Solder Pallet Materials Durostone® materials have been developed for all procedures within the PCB assembly process. There are three main grades which are suitable for use in the SMT reflow and wave soldering processes, Durostone® CHP760, CAS761 and CAG762. These materials offer the following features: • Excellent mechanical properties at elevated temperatures in both the wave soldering and SMT reflow processes. • Low thermal conductivity. • Excellent machining properties enabling the manufacture of complex design solder pallets. • Good resistance to chemicals used in modern fluxes.

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PCB Solder Pallet Materials-3

Harsh environments In the wave soldering process, a combination of flux, temperature and process cycle time can result in a reduced lifespan of standard solder pallet materials. The solution is Durostone® WGR781, a woven glass laminate which has been specifically formulated to withstand extreme temperatures and aggressive fluxes. Fluxes containing halides or halogen activators can reduce a material’s lifespan but Durostone® WGR781 is designed for a very high cycle repetition. The woven glass reinforcement ensures that the flux does not penetrate the solder pallet surface and expose fibres. The...

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PCB Solder Pallet Materials-4

Material Selector The following flow chart enables the correct choice of material grade depending on the process parameters. Durostone® Material Selector • halides (JSTD004 types ORH1, ORM1) • succinic or adipic acid (see MSDS, CAS n°: 110 – 15 – 6 and 124 – 04 – 9) Does the solder bath exceed 265 °C? Does the bottom side PCB pre-heat temperature exceed 140 °C? No No Are anti-static properties required? Does the material have to be optically reflective for infrared sensors?

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PCB Solder Pallet Materials-5

Anti-Static Optical Flux Resistant Density (g/cm³) Glass reinforcement Woven glass Flexural Strength 3 point support (MPa) Thermal Conductivity (W/m°K) Maximum Operating Temperature (°C) 10 – 20 seconds Standard Operating Temperature (°C) Water Absorption (%) Coefficient of Linear Expansion (10–⁶/K) between 30 °C and 200 °C Surface Resistivity (ohms) Chemical Resistance Sheet Size (mm) Thickness’ available (mm) Thickness Tolerance Flatness Tolerance (for a panel size of 300 x 300 mm) • All the values are average values. • Material is considered as not electrostatic dissipative (ESD) if more than...

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PCB Solder Pallet Materials-6

GERMANY Röchling Lützen SE & Co. KG Planckstr. 3 06686 Lützen T +49 34 444 308-200 F +49 34 444 308-100 [email protected] www.roechling-industrial.com/ luetzen FRANCE Röchling Industrial Nancy S.A.S. 8, Rue André Fruchard B.P.12, Maxéville 54527 LAXOU Cedex T +33 383 342424 F +33 383 322318 [email protected] www.roechling-industrial.com/fr ITALY Röchling Machined Plastics Italia s.r.l Via Morena 66 28024 Gozzano T +39 0322 95421 F +39 039 93335 [email protected] www.roechling-industrial.com/it SPAIN Röchling Plásticos Técnicos S.A.U. Ctra. Villena, s/n. - Apartado 34 46880...

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.
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