PCB Solder Pallet Materials
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Catalog excerpts

PCB Solder Pallet Materials - 1

PCB Solder Pallet Materials High performance composite materials specifically designed for the PCB assembly process

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PCB Solder Pallet Materials - 2

PCB Solder Pallet Materials Durostone® materials have been developed for all procedures within the PCB assembly process. There are three main grades which are suitable for use in the SMT reflow and wave soldering processes, Durostone® CHP760, CAS761 and CAG762. These materials offer the following features: • Excellent mechanical properties at elevated temperatures in both the wave soldering and SMT reflow processes. • Low thermal conductivity. • Excellent machining properties enabling the manufacture of complex design solder pallets. • Good resistance to chemicals used in modern fluxes.

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PCB Solder Pallet Materials - 3

Harsh environments In the wave soldering process, a combination of flux, temperature and process cycle time can result in a reduced lifespan of standard solder pallet materials. The solution is Durostone® WGR781, a woven glass laminate which has been specifically formulated to withstand extreme temperatures and aggressive fluxes. Fluxes containing halides or halogen activators can reduce a material’s lifespan but Durostone® WGR781 is designed for a very high cycle repetition. The woven glass reinforcement ensures that the flux does not penetrate the solder pallet surface and expose fibres....

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PCB Solder Pallet Materials - 4

Material Selector The following flow chart enables the correct choice of material grade depending on the process parameters. Durostone® Material Selector • halides (JSTD004 types ORH1, ORM1) • succinic or adipic acid (see MSDS, CAS n°: 110 – 15 – 6 and 124 – 04 – 9) Does the solder bath exceed 265 °C? Does the bottom side PCB pre-heat temperature exceed 140 °C? No No Are anti-static properties required? Does the material have to be optically reflective for infrared sensors?

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PCB Solder Pallet Materials - 5

Anti-Static Optical Flux Resistant Density (g/cm³) Glass reinforcement Woven glass Flexural Strength 3 point support (MPa) Thermal Conductivity (W/m°K) Maximum Operating Temperature (°C) 10 – 20 seconds Standard Operating Temperature (°C) Water Absorption (%) Coefficient of Linear Expansion (10–⁶/K) between 30 °C and 200 °C Surface Resistivity (ohms) Chemical Resistance Sheet Size (mm) Thickness’ available (mm) Thickness Tolerance Flatness Tolerance (for a panel size of 300 x 300 mm) • All the values are average values. • Material is considered as not electrostatic dissipative (ESD) if more...

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PCB Solder Pallet Materials - 6

GERMANY Röchling Lützen SE & Co. KG Planckstr. 3 06686 Lützen T +49 34 444 308-200 F +49 34 444 308-100 kontakt@roechling-luetzen.de www.roechling-industrial.com/ luetzen FRANCE Röchling Industrial Nancy S.A.S. 8, Rue André Fruchard B.P.12, Maxéville 54527 LAXOU Cedex T +33 383 342424 F +33 383 322318 info@roechling-permali.fr www.roechling-industrial.com/fr ITALY Röchling Machined Plastics Italia s.r.l Via Morena 66 28024 Gozzano T +39 0322 95421 F +39 039 93335 compositi@roechling.it www.roechling-industrial.com/it SPAIN Röchling Plásticos Técnicos S.A.U. Ctra. Villena, s/n. - Apartado 34...

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