PS9031 2.5 A OUTPUT CURRENT, HIGH CMR, IGBT GATE DRIVE
20Pages

Data Sheet PS9031 2.5 A OUTPUT CURRENT, HIGH CMR, IGBT GATE DRIVE, 5-PIN SOP (LSO5 WITH 8mm CREEPAGE DISTANCE) PHOTOCOUPLER DESCRIPTION The PS9031 is an optically coupled isolator containing a GaAlAs LED on the input side and a photodiode, a signal processing circuit and power MOSFETs on the output side on one chip. Long creepage distance (8 mm MIN.) Large peak output current (2.5 A MAX., 2.0 A MIN.) High speed switching (tPLH tPHL = 175 ns MAX.) UVLO (Under Voltage Lock Out) protection with hysteresis High common mode transient immunity (CMH, CML = 50 kV/s MIN.) Operating Ambient Temperature (125 C MAX.) Embossed tape product : PS9031-F3 : 3000 pcs/reel Pb-Free product Safety standards  UL approved: No. E72422  CSA approved: No. CA 101391 (CA5A, CAN/CSA-C22.2 60065, 60950)  DIN EN 60747-5-5 (VDE 0884-5) approved (Option) APPLICATIONS  IGBT, Power MOS FET Gate Driver  Industrial inverter  AC Servo Start of mass production Oct.2015 R08DS0131EJ0100

Chapter Title PACKAGE DIMENSIONS (UNIT: mm) PHOTOCOUPLER CONSTRUCTION Parameter Air Distance Outer Creepage Distance Isolation Distance

Chapter Title ORDERING INFORMATION Part Number Order Number Solder Plating Specification Packing Style Safety Standard Approval Pb-Free and Halogen Free (Ni/Pd/Au) Standard products (UL,CSA approved) 20 pcs (Tape 20 pcs cut) Embossed Tape 3 000 pcs/reel 20 pcs (Tape 20 pcs cut) Embossed Tape 3 000 pcs/reel UL,CSA approved DIN EN 60747-5-5 (VDE 0884-5): 2011-11 approved (Option) *1. For the application of the Safety Standard, following part number should be used. ABSOLUTE MAXIMUM RATINGS (TA = 25C, unless otherwise specified) Diode Parameter Forward Current Peak Transient Forward Current...

Chapter Title ELECTRICAL CHARACTERISTICS (at RECOMMENDED OPERATING CONDITIONS, VEE=GND, unless otherwise Specified) High Level Output Voltage Low Level Output Voltage High Level Supply Current Low Level Supply Current UVLO Threshold VOH VOL ICCH ICCL VUVLO+ VUVLO UVLOHYS Threshold Input Current (L  H) IFLH VFHL UVLO Hysteresis Coupled Conditions IF = 10 mA, TA = 25C VR = 3 V, TA = 25C f = 1 MHz, VF = 0 V VO = (VCC  4 V) *2 VO = (VCC  15 V) *3 VO = (VEE + 2.5 V) *2 VO = (VEE + 15 V) *3 IO = 100 mA *4 IO = 100 mA VO = Open, IF = 10 mA VO = Open, VF = 0 to 0.8V VO > 5 V, IF = 10 mA...

Chapter Title TEST CIRCUIT Fig. 1 I OH Test Circuit Fig. 5 I CCH/ICCL Test Circuit Fig. 6 UVLO Test Circuit

Chapter Title Fig. 7 I FLH Test Circuit Fig. 8 t PLH, tPHL, tr, tf Test Circuit and Wave Forms VOUT tPLH Fig. 9 CMR Test Circuit and Wave Forms IF A 5

Chapter Title TYPICAL CHARACTERISTICS (TA = 25C, unless otherwise specified) DETECTOR POWER DISSIPATION vs. AMBIENT TEMPERATURE DIODE POWER DISSIPATION vs. AMBIENT TEMPERATURE 50 Diode Power Dissipation PD (mW) Detector Power Dissipation PC (mW) FORWARD CURRENT vs. FORWARD VOLTAGE THRESHOLD INPUT CURRENT vs. AMBIENT TEMPERATURE Threshold Input Current IFLH / IFHL (mA) OUTPUT VOLTAGE vs. FORWARD CURRENT HIGH LEVEL OUTPUT VOLTAGE SUPPLY VOLTAGE vs. HIGH LEVEL OUTPUT CURRENT 35 High Level Output Voltage Supply Voltage VOH VCC (V) High Level Output Current IOH (A) Remark The graphs indicate...

Chapter Title PROPAGATION DELAY TIME, PULSE WIDTH DISTORTION vs. FORWARD CURRENT LOW LEVEL OUTPUT VOLTAGE vs. LOW LEVEL OUTPUT CURRENT 175 VCC = 30 V, VEE = GND, IF = 0 mA Propagation Delay Time tPHL, tPLH (ns), Pulse Width Distortion (PWD) tPHL – tPLH (ns) Low Level Output Voltage VOL (V) PROPAGATION DELAY TIME, PULSE WIDTH DISTORTION vs. SUPPLY VOLTAGE Propagation Delay Time tPHL, tPLH (ns), Pulse Width Distortion (PWD) tPHL – tPLH (ns) Propagation Delay Time tPHL, tPLH (ns), Pulse Width Distortion (PWD) tPHL – tPLH (ns) PROPAGATION DELAY TIME, PULSE WIDTH DISTORTION vs. LOAD CAPACITANCE...

Chapter Title SUPPLY CURRENT vs. AMBIENT TEMPERATURE SUPPLY CURRENT vs. SUPPLY VOLTAGE 2.5 ICCH ICCL HIGH LEVEL OUTPUT VOLTAGE – SUPPLY VOLTAGE vs. AMBIENT TEMPERATURE High Level Supply Current ICCH (mA), Low Level Supply Current ICCL (mA) High Level Supply Current ICCH (mA), Low Level Supply Current ICCL (mA) Low Level Output Voltage VOL (V) LOW LEVEL OUTPUT VOLTAGE vs. AMBIENT TEMPERATURE LOW LEVEL OUTPUT CURRENT vs. AMBIENT TEMPERATURE HIGH LEVEL OUTPUT CURRENT vs. AMBIENT TEMPERATURE 3.0 Low Level Output Current IOL (A) 3.0 High Level Output Current IOH (A) 0.0 High Level Output Voltage...

Chapter Title OUTPUT VOLTAGE vs. SUPPLY VOLTAGE 14 Remark The graphs indicate nominal characteristics.

Chapter Title TAPING SPECIFICATIONS (UNIT: mm) Tape Direction Outline and Dimensions (Taps) Outline and Dimensions (Reel)

Chapter Title RECOMMENDED MOUNT PAD DIMENSIONS (UNIT: mm) Remark All dimensions in this figure must be evaluated before use.

Chapter Title NOTES ON HANDLING 1. Recommended soldering conditions (1) Infrared reflow soldering • Peak reflow temperature • Time of peak reflow temperature • Time of temperature higher than 220C • Time to preheat temperature from 120 to 180C • Number of reflows • Flux 260C or below (package surface temperature) 10 seconds or less 60 seconds or less 12030 s Three Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) Package Surface Temperature T (°C) Recommended Temperature Profile of Infrared Reflow (2) Wave soldering •...

Chapter Title USAGE CAUTIONS 1. This product is weak for static electricity by designed with high-speed integrated circuit so protect against static electricity when handling. 2. Board designing (1) By-pass capacitor of more than 1.0 F is used between VCC and GND near device. Also, ensure that the distance between the leads of the photocoupler and capacitor is no more than 10 mm. (2) When designing the printed wiring board, ensure that the pattern of the IGBT collectors/emitters is not too close to the input block pattern of the photocoupler. If the pattern is too close to the input block...

Dependence of maximum safety ratings with package temperature Psi : total power dissipation