Catalog excerpts
Developing Background Main Function and Specification Product Structure Comparison of other products
Open the catalog to page 21. Developing Background Regen-i Co., Ltd. performed business with product development background as follows. First, Process Simplification It is simple and easy system for the engineer who uses the product because of selecting only the necessary part from the existing system. Second, Process Standardization By applying the temperature profile (Step 3), the engineer can expect the same operation result repeatedly. Third, Protective PCB By introducing the programming method, we can isolate the chip with the minimum loss by solving the problems that can occur when heating the PCB through the...
Open the catalog to page 32. Main Function and Specification 1. Purpose - SMD Parts Removal and Mount ( top and bottom hot air drying method) 2.Benefit - Reduce cost and efficiency of parts repair at service center 3. Available Size - Small PCB below 200mm 4. Control function - Settable temperature profile ( Program#1~5(Factory setting), Program #6~9(User setting) - Max. Temperature : 300 Celsius, Max time: 99 Min. 5. Specification - Rated voltage : AC 200~240V 50/60Hz - Max. power : 1600W - Max. current : 7A - Dimension : (L)380mm x (W)230mm x (H)260mm - Weight : Approx.7 kg - Origin : Korea
Open the catalog to page 4※ Temperature profile Sort Temp.(T) Duration(t) Temp.(T) Duration(t) Temp.(T) Duration(t) Temp.(T) Duration(t) Temp.(T) Duration(t) Temp.(T) Duration(t) IF, BAT CON IC, POP, MEMORY E.T.C User setting User setting
Open the catalog to page 53. Product Structure 1. Push the upper heater back about 4 cm while heating : Upper Heating stopped ( Fan continues to operate) 2. When the upper heater is pulled upward again : Upper heating is restarted. Present Program Present Set-up Program (Pre-program: from 1 to 5 / User’s setting : from 6 to 9) Program Change Heater Setting Bottom Nozzle Magnetic Fixing block Program Modification From 1 to 9 Top Heater, Bottom Heater Setting Step1~Step3,
Open the catalog to page 64.How to operate ① Nozzle and PCB mount
Open the catalog to page 7⑤ Temperature change after heating ※ Program #3 Step 1 : 120 degree, 30 second Step 2 : 200 degree, 80 second Step 3 : 250 degree, 50 secon
Open the catalog to page 8⑥ Parts removal and mount
Open the catalog to page 95. Comparison of other products ALLOY Melting point(℃) Soldering(Pb free temperature graph) Element Symbol
Open the catalog to page 10Soldering(Hot gun-Temperature Experiment)
Open the catalog to page 11Soldering(Hot gun-Temperature Experiment)
Open the catalog to page 12Soldering(Hot gun-Temperature Experiment)
Open the catalog to page 13Soldering (PCB or Chip void)
Open the catalog to page 14Soldering(Defective type I by overheating)
Open the catalog to page 15Soldering(Defective type II by overheating) ※ Parts to watch out with Hot Gun - Image sensor - Ear jack - E.T.C (Vulnerable to heat)
Open the catalog to page 16※ REFLOWER OVEN vs SMART REWORK SYSTEM
Open the catalog to page 17All REGEN-I Company catalogs and technical brochures
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