Developing Background Main Function and Specification Product Structure Comparison of other products

1. Developing Background Regen-i Co., Ltd. performed business with product development background as follows. First, Process Simplification It is simple and easy system for the engineer who uses the product because of selecting only the necessary part from the existing system. Second, Process Standardization By applying the temperature profile (Step 3), the engineer can expect the same operation result repeatedly. Third, Protective PCB By introducing the programming method, we can isolate the chip with the minimum loss by solving the problems that can occur when heating the PCB through the existing...

2. Main Function and Specification 1. Purpose - SMD Parts Removal and Mount ( top and bottom hot air drying method) 2.Benefit - Reduce cost and efficiency of parts repair at service center 3. Available Size - Small PCB below 200mm 4. Control function - Settable temperature profile ( Program#1~5(Factory setting), Program #6~9(User setting) - Max. Temperature : 300 Celsius, Max time: 99 Min. 5. Specification - Rated voltage : AC 200~240V 50/60Hz - Max. power : 1600W - Max. current : 7A - Dimension : (L)380mm x (W)230mm x (H)260mm - Weight : Approx.7 kg - Origin : Korea

※ Temperature profile Sort Temp.(T) Duration(t) Temp.(T) Duration(t) Temp.(T) Duration(t) Temp.(T) Duration(t) Temp.(T) Duration(t) Temp.(T) Duration(t) IF, BAT CON IC, POP, MEMORY E.T.C User setting User setting

3. Product Structure 1. Push the upper heater back about 4 cm while heating : Upper Heating stopped ( Fan continues to operate) 2. When the upper heater is pulled upward again : Upper heating is restarted. Present Program Present Set-up Program (Pre-program: from 1 to 5 / User’s setting : from 6 to 9) Program Change Heater Setting Bottom Nozzle Magnetic Fixing block Program Modification From 1 to 9 Top Heater, Bottom Heater Setting Step1~Step3,

4.How to operate ① Nozzle and PCB mount

⑤ Temperature change after heating ※ Program #3 Step 1 : 120 degree, 30 second Step 2 : 200 degree, 80 second Step 3 : 250 degree, 50 secon

⑥ Parts removal and mount

5. Comparison of other products ALLOY Melting point(℃) Soldering(Pb free temperature graph) Element Symbol

Soldering(Hot gun-Temperature Experiment)

Soldering(Hot gun-Temperature Experiment)

Soldering(Hot gun-Temperature Experiment)

Soldering (PCB or Chip void)

Soldering(Defective type I by overheating)

Soldering(Defective type II by overheating) ※ Parts to watch out with Hot Gun - Image sensor - Ear jack - E.T.C (Vulnerable to heat)

※ REFLOWER OVEN vs SMART REWORK SYSTEM