RF-W3S198TS-A4111-06-08-E0
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Catalog excerpts

RF-W3S198TS-A4111-06-08-E0 - 1

Viewing angle:140 deg The materials of the LED dice is InGaP AlGaInP and InGaN 1.60mm×1.60mm×0.70mm RoHS compliant lead-free soldering compatible Package Outline ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES All dimensions are in millimeters (inches); Tolerances are 0.1mm (0.004inch) unless otherwise noted.

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RF-W3S198TS-A4111-06-08-E0 - 2

Absolute maximum ratings at Ta=25℃ Forward current Reverse voltage Operating temperature range Storage temperature range Pulse Forward Current Electrostatic Discharge Electro-optical characteristics at Ta=25℃ Parameter Test Condition Spectral Half bandwidth Luminous intensity Dominant wavelength Forward voltage Reverse current NOTE: (Tolerance: Iv ±10%, λd ±2nm, Vf ±0.05V) IFP Conditions: Pulse Width≦10msec. and Duty ≦1/10.

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RF-W3S198TS-A4111-06-08-E0 - 3

Typical optical characteristics curves Spectral Distribution Relative Intensity vs. Wavelength (Ta=25° C) Relative Intensity vs. Forward Current (Ta=25° C) Relative Intensity Relative Intensity Forward Current vs. Forward Voltage (Ta=25° C) Derating Relative Intensity vs. Ambient Temperature Forward Current vs. Dominate wavelength (Ta=25° C) Relative Intensity Maximum Forward Current vs. Ambient Temperature Diagram characteristics of radiation

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RF-W3S198TS-A4111-06-08-E0 - 4

Reflow profile  Soldering condition • Recommended soldering conditions Reflow Soldering Hand Soldering Temperature Pre-heat time Soldering time Condition 3 second Max. (one time only) Peak temperature Soldering time 10 seconds Max. Refer to Temperature-profile • After reflow soldering rapid cooling should be avoided  Temperature-profile (Surface of circuit board) Use the following conditions shown in the figure. RECOMMEND PAD DESIGN (Units: mm) REFLOW PROFILE TIME (SECONDS) Reflow soldering should not be done more than two times When soldering ,do not put stress on the LEDs during heating...

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RF-W3S198TS-A4111-06-08-E0 - 5

Reliability (1)TEST ITEMS AND RESULTS Test Item Test Conditions Resistance to Soldering Heat(Reflow Soldering) Thermal Shock High Temperature Storage Life Test Operation Sequence Environmental Sequence Temperature Cycle Test Conditions Forward Voltage Reverse Current Luminous Intensity U.S.L.: Upper Standard Level L.S.L.: Lower Standard Level NOTES: 1.Reliability testing standards change, won't do notice

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RF-W3S198TS-A4111-06-08-E0 - 6

• Dimensions of Tape (Unit: mm) Feeding Direction- Conclusion portsCMir ,320nm) Irtroductior ports(Mir,3E0mm) Empty portsCMir,80) Looded portsCMir,3000pcs) Empty ports(Min,80) _ I_I |L^ii^-J| |LM_I^JI| |L-JI^-J 1. Empty component pockets are sealed with top cover tape; 2. The maximum number of missing lamps is two;

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RF-W3S198TS-A4111-06-08-E0 - 7

Packaging specifications Maximuns eighty reels Package specifications Reeled products (numbers of products are 3,000pcs) packed in a seal off moisture-proof bag along with a desiccant one by one, Eighty moisture-proof bag of maximums are put the outside box (size: about 545mm x about 375mm x about 275mm) Together with buffer material, and it is packed. (Pare No., Lot No., quantity should appear on the label on the moisture-proof bag, part No. And quantity should appear on the label on the cardboard box.) The number of the loading steps of outside box Storage conditions Before opening the...

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