RF-W2SA50TS-A39 12-06-27-E0 全彩A50档
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♦ The materials of the LED dice is InGaN, InGaP and AIGalnP ♦ RoHS compliant lead-free soldering compatible Package Outline OBSERVE PRECAUTIONS SENSITIVE DEVICES 1. All dimensions are in millimeters (inches); 2. Tolerances are +0.3mm (0.012inch) unless otherwise noted.

Absolute maximum ratings at Ta=25℃ Forward current per chip Reverse voltage Operating temperature range Storage temperature range Pulse Forward Current Electrostatic Discharge Dominant wavelength Forward voltage Test Condition Luminous intensity Reverse current NOTE: (Tolerance: Iv ±10%,λd ±2nm, Vf ±0.05V, X, Y ±0.005) IFP Conditions: Pulse Width≦10msec. and Duty ≦1/10.

Typical optical characteristics curves Spectral Distribution Relative Intensity vs. Wavelength (Ta=25 °C) Relative Intensity vs. Forward Current (Ta=25 °C) Relative Intensity Relative Intensity Forward Current vs. Forward Voltage (Ta=25 °C) Derating Relative Intensity vs. Ambient Temperature Forward Current vs. Dominate wavelength (Ta=25 °C) Relative Intensity Maximum Forward Current vs.Ambient Temperature Ambient Temperature Ta(°C) Ambient Temperature Ta(°C) Diagram characteristics of radiation

Reflow profile  Soldering condition • Recommended soldering conditions Reflow Soldering Hand Soldering Temperature Pre-heat time Soldering time Condition 3 second Max. (one time only) Peak temperature Soldering time 10 seconds Max. Refer to Temperature-profile • After reflow soldering rapid cooling should be avoided  Temperature-profile (Surface of circuit board) Use the following conditions shown in the figure. RECOMMEND PAD DESIGN (Units: mm) REFLOW PROFILE TIME (SECONDS) Reflow soldering should not be done more than two times When soldering ,do not put stress on the LEDs during heating...

Reliability (1)TEST ITEMS AND RESULTS Test Conditions Temperature Cycle Thermal Shock High Temperature Storage Low Temperature Storage Operation Sequence Test Item Resistance to Soldering Heat(Reflow Soldering) Environmental Sequence Life Test High Humidity Heat Life Test Test Conditions Forward Voltage Reverse Current Luminous Intensity U.S.L.: Upper Standard Level L.S.L.: Lower Standard Level

• Dimensions of Tape (Unit: mm) Looded ppntsCMin.lOOOpcs 1. Empty component pockets are sealed with top cover tape; 2. The maximum number of missing lamps is two; 3. The cathode is oriented towards the tape sprocket hole in accordance with ANSI/EIA RS-481 specifications.

Packaging specifications CAUTIONS Package specifications Reeled products (numbers of products are 1,000pcs) packed in a seal off moisture-proof bag along with a desiccant one by one, Sixty moisture-proof bag of maximums are put the outside box (size: about 545mm x about 375mm x about 275mm) Together with buffer material, and it is packed. (Pare No., Lot No., quantity should appear on the label on the moisture-proof bag, part No. And quantity should appear on the label on the cardboard box.) The number of the loading steps of outside box (cardboard box) has two steps. Storage conditions...