REFOND P/N 产品型号 RF-R*HP32DS-FH-I3
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REFOND P/N 产品型号 RF-R*HP32DS-FH-I3 □R&D 研发 ■Mass Product 量产供货

The White LED which was fabricated using a bule chip and the phosphor Product Package: 2.8mmX3.5mmX0.7mm. 该产品为白光 LED，是由蓝光芯片激发荧光粉而形成，产品尺寸：2.8mmX3.5mmX0.7mm。 1.2Features 产品特征 ►PLCC-2 Package.封装 ►Extremely wide viewing angle.发光角度大 ►Suitable for all SMT assembly and solder process.适用于所有的SMT组装和焊接工艺 ►Available on tape and reel.适用于载带及卷轴 ►Moisture sensitivity level: Level 3.防潮等级 Level 3 ►RoHS compliant.满足RoHS要求 1.3Application 产品应用 ►Indoor display.室内显示 ►Bul

Fig.1-2 Side view 侧面视图 C Polarity A:anode C:cathode Fig.1-3 Bottom view 背面视图 Fig.1-5 Soldering patterns 推荐焊盘 Notes 备注： 1. All dimensions units are millimeters. 所有尺寸标注单位为毫米 2. All dimensions tolerances are 0.05mm unless otherwise noted.除特别标注外，所有尺寸公差为±0.05 毫米

1.5 Product Parameters 产品参数 Table 1-1 Electrical / Optical Characteristics at Ts=25°C 电性与光学特性 Test Condition 测试条件 Rank Y0 Forward Voltage Reverse Current（漏电流） Viewing Angle（发光角度） Color Rendering Index(显色指数） Thermal resistance（热阻） Table 1-2 Absolute Maximum Ratings at Ts=25°C 绝对最大值 Power Dissipation（功耗） Forward Current（正向电流） Peak Forward Current （峰值电流） Reverse Voltage（反向电压） Electrostatic Discharge(HBM)（静电） Operating Temperature（操作温度）

Notes 备注： 1. 1/10 Duty cycle, 0.1ms pulse width. 脉宽0.1ms,占空比1/10. 2. The above forward voltage measurement allowance tolerance is ±0.1V. 以上所示电压测量误差 ±0.1V. 3. The above color coordinates measurement allowance tolerance is 0.005. 以上所示坐标测量误差 0.005. 4. The above luminous intensity measurement allowance tolerance ±10%. 上述发光强度的测试允许公差为±10%. 5. Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. 使用 功率不能超过规定的最大值。 6. All measurements were made under the standardized environment of Refond. 所有测试都是基于瑞丰现有的 标准测试平台。 7.When the LEDs are in operation the...

Fig 1-6 The C.I.E Chromaticity Diagram CIE^SHI Table 1-4 E-mail: sales@refond.com

1.7 Typical optical characteristics curves Fig 1-7 Forward Voltage Vs. Forward Current^^^ttfl^ Fig 1-8 Forward Current Vs. Relative IntensityE^^^-^ffl^^^^ttfl^

Fig 1-9 Solder Temperature Vs Relative Intensity管脚温度与相对光强特性曲线 Fig 1-10 Solder Temperature Vs.Forward Current管脚温度与正向电流特性曲线 Tj≤125℃

Fig 1-11 Forward Voltage Vs Solder Temperature电压与管脚温度特性曲线

2. Packaging 产品包装 2.1 Packaging Specification 包装规格 Package:12000pcs/reel.包装每卷 12000pcs。 2.1.1Carrier Tape Dimension 载带尺寸 FEED DIRECTION Polarity Mark 3,02 Fig.2-1 Carrier Tape Dimension 载带尺寸 2.1.2Reel Dimension 卷盘尺寸 Table 2-1 Title The tolerances unless mentioned ±0.1mm. Unit : mm注：未注公差为±0.1毫米，尺寸单位：毫米。

2.1.3Label Form Specification 标签规格 Table 2-2 Title PART NO. Forward Voltage 正向电压 Wavelength 波长代码 Made Date 生产日期 2.2Moisture Resistant Packing 防潮包装

2.4 Reliability Test Items And Conditions 信赖性测试项目及条件 Table 2-3 Title TestItems 项目 Ref.Standard 参考标准 Test Condition 测试条件 Ac/Re 接收/拒收 Thermal Shock 冷热冲击 High Temperature Storage JEITAED-4701 200 201 高温保存 Low Temperature Storage JEITA ED-4701 200 202 低温保存 Life Test 常温通电 High Temperature High Humidity Life Test 高温高湿通电 Temperature Humidity Storage 高温高湿储存

2.5 Criteria For Judging Damage 失效判定标准 Table 2-4 Title Criteria For Judgement 判定标准 Test Condition 测试条件 Forward Voltage 正向电压 Reverse Current 反向电流 Notes 备注： 1.U.S.L: Upper standard level 规格上限 L.S.L: Lower standard level 2. The above reliability tests is based on the verification of a single/strip LED of Refond's existing experimental platform, the reliability experiment was taken under good heat dissipation conditions. when customers applies the LED to the series and parallel circuit, should take consideration of all the factors such as the current, voltage distribution, heat dissipation and...

3. SMT Reflow Soldering Instructions SMT3.1SMT Reflow Soldering Instructions SMT Average temperature rise speed^^^U^® ( Tsmax MTp )

Notes 备注： (1)Reflow soldering should not be done more than two times. In the case of more than 24 hours passed soldering after first, LEDs will be damaged. 回流焊次数不可以超过两次，两次回流焊的时间间隔如果超过24小 时，LED可能由于吸湿而损坏。 (2)When soldering , do not put stress on the LEDs during heating.当焊接时，不要在材料受热时用力压胶体表 面。 3.1.1 Soldering Iron 烙铁焊接 (1) When hand soldering, keep the temperature of iron below less 300℃ less than 3 seconds 当手工焊接时，烙铁的温度必须小于300℃，时间不可超过3秒。 (2) The hand solder should be done only one time.手工焊接只可焊接一次。 3.1.2 Repairing 修补 Repair should not be done after the LEDs have been soldered. When repairing is...

(3) Do not apply mechanical force or excess vibration during the cooling process to normal temperature after soldering. Do not rapidly cool device after soldering.回流焊之后冷却过程中，不 要对材料实加外力，也不要有震动，回流焊后，不要采用激剧冷却的方式。 4. Handling Precautions 产品使用注意事项 4.1 Handling Precautions 产品使用注意事项 (1) LED operating environment and sulfur element composition cannot be over 100PPM in the LED mating usage material. This is provided for informational purposes only and is not a warranty or endorsement.LED 工作环境及与 LED 适配的材料中硫元素及化合物成份不可超过 100PPM.这只 是一个建议，不作任何品质担保。 (2) In order to prevent ex-ternal material from getting...

了的还是仅仅怀疑有害。针对特定的用途和使用环境，瑞丰建议对所有的物质和材料进行相容性的 测试。在贴装 LED 时候，不要使用能产生有机挥发性气体的粘结剂。 (4) Handle the component along the side surface by using forceps or appropriate tools; do not directlytouch or Handle the silicone lens surface, it may damage the internal circuitry.通过使用适当 的工具从材料侧面夹取，不可直接用手或尖锐金属压胶体表面，它可能会损坏内部电路。 (5) In designing a circuit, the current through each LED can not exceed the absolute maximum rating specified for each LED. In the mean while, resistors for protection should be applied, otherwise slight voltage shift will cause big current change, burn out may happen. The driving circuit...

package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. 与其他封装胶相比，硅胶通常较软，表面易吸附脏物，应用时应特别注意，当 对产品洁净度要求较高时，回流焊以后需要采用恰当的清洗方式，我们推荐用异丙醇作清洗剂，如 需要用到其他清洗剂，必须保证不会破坏封装体，超声清洗可能会对 LED 带来损害，不推荐这种清 洗方式。 Table 4-1Storage 储存 Conditions 种类 Before Opening Aluminum Bag 拆包前 Within 1 Year From Date 一年内 After Opening Aluminum Bag 拆包后 (8) If the moisture absorbent material（silica gel）has faded away or the LEDs have exceeded the storage time，baking treatment should be performed after unpacking and based on the following condition（60±5）℃ for above 24...