REFOND P/N RF-Q50SA**A-24-H8
23Pages

SPECIFICATION REFONDP/N RF-Q50SA**A-24-H8 UR&D Sff* ■ Mass Product

1.7 Typical optical characteristics curves 2. Packaging 2.1 Packaging Specification 2.1.1Carrier Tape Dimension 2.1.2Reel Dimension 2.1.3Label Form Specification 2.2Moisture Resistant Packing 2.3Cardboard Box 2.4 Reliability Test Items And Conditions 2.5 Criteria For Judging Damage 3. SMT Reflow Soldering Instructions SMT 3.1SMT Reflow Soldering Instructions SMT

1. Description i^pp^S1.1 General Description ;“-qqJ8i£ The White LED which was fabricated using a blue chip and the phosphor rzppR\l' : 5.0mmX5.0mmX0.7mmo 1.2Features ► EMC Package.EMC. ► Small light-emitting surface, high light output. ^*c?huttj ► Suitable for all SMT assembly and solder process. ► Package: 2000pcs/reel.'ell^4i#2000pcs ► Moisture sensitivity level: Level Level 3 1.3Application j^qqJ^Zffl ► Architectural landscape lighting. ► Spotlight applications. ► General use.SfdlJ'yffl

Fig.1-5Soldering patterns^#^# Notes H'/i: 1. All dimensions units are millimeters. 2. All dimensions tolerances are +0.05mm unless otherwise noted.F/T'^'R't^^^+0.05

1.5Product Parameters ?*■ pp#^ Table 1-1 Electrical / Optical Characteristics at Ts=25°C

Hi ISliiVrlll HtfOND ilnJ 52 / L * L! Table 1-2 Absolute Maximum Ratings atTs=25°C 1. 1/10 Duty cycle, 0.1ms pulse width. jjftji&O.lmSjd&^tbl/lO. 2. The above forward voltage measurement allowance tolerance is ±0.1 V. ±0.1V. 3. The above color coordinates measurement allowance tolerance is ±0.003 ±0.003. 4. The above luminous intensity measurement allowance tolerance ±10%. 5. Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. 6. All measurements were made under the standardized environment of Refond. 7.When the LEDs are in operation the...

Bin data: ANSI 3 - 5 Step

Fig 1-8 Forward Current Vs. Relative IntensitylEl^^^^S^^iiffttffiiije Tel: +86-755-66839118 Fax:+86-755-66839300 E-mail:sales@refond.com

Fig 1-11 Forward Voltage Vs Solder Temperature^ffi-^^WS^^tt®^

2. Packaging 2.1 Packaging Specification Package:2000pcs/reel.1[l,S§# 2000pcso 2.1.1 Carrier Tape Dimension H^Rtt' Notes The tolerances unless mentioned ±0.1mm. Unit: mm>±; S7K0

Spec Number Luminous flux Forward Voltage Packing Quantity Part Number Made Date ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES 深圳市瑞丰光电子股份有限公司 SHENZHEN REFOND OPTOELECTRONICS CO.LTO.

2.4 Reliability Test Items And Conditions Table 2-3 Title

Hi ISliiVrlll HtfOND ilnJ 52 / L * L! 1.U.S.L: Upper standard level L.S.L: Lower standard level $G$§TPfl 2. The above reliability tests is based on the verification of a single/strip LED of Refond's existing experimental platform, the reliability experiment was taken under good heat dissipation conditions. when customers applies the LED to the series and parallel circuit, should take consideration of all the factors such as the current, voltage distribution, heat dissipation and others. LED ^siLEDgziT^s nmmw, ^j±^ib^ tiifsiio 3.The technical information shown in the data sheets are limited...

Notes i§-}±: (1)Reflow soldering should not be done more than two times. In the case of more than 24 hours passed soldering after first, LEDs will be damaged. L E D rJ lb S T1 i® $ ffn iM IT o (2)When soldering , do not put stress on the LEDs during heating. 3.1.1 Soldering Iron mfk‘) (1) When hand soldering, keep the temperature of iron below less 300°C less than 3 seconds ^K)}UJt^^/jNT300oC5 tt|i]^pntSM30>o (2) The hand solder should be done only one time.#I^SRpJ^S—'Xo 3.1.2 Repairing fif^h Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a...

(1) The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the top of package. The pressure to the top surface will be influence to the reliability of the LEDs. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when use the picking up nozzle, the pressure on the silicone resin should be proper. LED±^K^]5±i$, $m, ffl^KJ±^fta®^^pipiLEDpr«tt, sm (2) Components should not be mounted on warped (non coplanar) portion of PCB. After soldering, do not warp the circuit board. LED PCB tBLt, (3) Do not apply mechanical force or...

Hi ISliiVrlll HtfOND ilnJ 52 / L * L! (3) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures can penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy. The result can be a significant loss of light output from the fixture. Knowledge of the properties of the materials selected to be used in the construction of fixtures can help prevent these issues. Refond advises against the use of any chemicals or materials that have been found or are suspected to have an adverse affect on device performance or reliability....

Hi ISliiVrlll HtfOND ilnJ 52 / L * L! (6) Thermal Design is paramount importance because heat generation may result in the Characteristics decline, such as brightness decreased, Color change and so on. Please consider the heat generation of the LEDs when making the system design.LED (7) Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust > requiring special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the...

Hi ISliiVrlll HtfOND ilnJ 52 / L * L! (8) If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time > baking treatment should be performed after unpacking and based on the following condition (65±5) °C for above 24 hours. eo±5°c5 *?24/Wo If the package is flatulence or damaged, please notify the sales staff to assist. (9)Similar to most Solid state devices; LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS). LED P (10) Other points for attention, please refer to our relevant information.