SPECIFICATION REFONDP/N Pnpik^ RF-Q30SA**A-24-J2 □ R&D ■ Mass Product

1.7 Typical optical characteristics curves 2. Packaging 2.1 Packaging Specification 2.1.1Carrier Tape Dimension 2.1.2Reel Dimension 2.1.3Label Form Specification 2.2Moisture Resistant Packing 2.3Cardboard Box 2.4 Reliability Test Items And Conditions 2.5 Criteria For Judging Damage 3. SMT Reflow Soldering Instructions SMT 3.1SMT Reflow Soldering Instructions SMT

1. Description j^pp^S1.1 General Description j^qqlBSS The White LED which was fabricated using a blue chip and the phosphor : 3.0mmX3.0mmX0.65mmo 1.2Features ► EMC Package.EMC^S ► Extremely wide viewing angle. ► Suitable for all SMT assembly and solder process. ► Package: 5000pcs/reel.l!2S§#5000pcs ► Moisture sensitivity level: Level Level 3 ► RoHS compliant.>ffiSRoHS^^< 1.3Application r'qqJiM ► Optical indicator, ► Indoor display.^|X|M^ ► Outdoor lighting

Polarity A:anode C:cathode Fig.1-5Soldering patterns 推荐焊盘 Notes All dimensions units are millimeters. All dimensions tolerances are 0.05mm unless otherwise noted.

Table 1-1 Electrical / Optical Characteristics at Ts=25°C

Hi ISliiVrlll HtfOND ilnJ 52 / L * L! Table 1-2 Absolute Maximum Ratings atTs=25°C 1. 1/10 Duty cycle, 0.1ms pulse width. jjftji&O.lmSjd&^tbl/lO. 2. The above forward voltage measurement allowance tolerance is ±0.1 V. 3. The above color coordinates measurement allowance tolerance is ±0.005. ±0.005. 4. The above luminous intensity measurement allowance tolerance ±10%. 5. Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. 6. All measurements were made under the standardized environment of Refond. 7.When the LEDs are in operation the maximum current...

Fig 1-6 The C.I.E Chromaticity Diagram CIEfejSIS

1.7 Typical optical characteristics curves 250 Fig 1-7 Forward Voltage Vs. Forward Current Relative Luminous Flux (%) Forward Current(mA) Fig 1-8 Forward Current Vs. Relative Intensity

Fig 1-10 Solder Temperature Vs.Forward CurrentlfliP}miJ||^IE[^^;J[l4314®^i

Hi ISliiVrlll HtfOND ilnJ 52 / L * L! 2. Packaging 2.1 Packaging Specification inMWfa Package:5000pcs/reel.1[l,S§# 5000pcso 2.1.1 Carrier Tape Dimension Feeding Direction -

Luminous flux Forward Voltage Packing Quantity Spec Number Part Number Made Date Label 标签 ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES 深圳市瑞丰光电子股份有限公司 SHENZHEN REFOND OPTOELECTRONICS CO.LTO.

2.4 Reliability Test Items And Conditions Table 2-3 Title

Hi ISliiVrlll HtfOND ilnJ 52 / L * L! Notes i§-}±: 1 .The Reliability tests are based on Refond existing test platform. 2. The technical information shown in the data sheets are limited to the typical characteristics and circuit examples of the referenced products. It does not constitute the warranting of industrial property nor the granting of any license, voltage distribution, heat dissipation and others. (W v J I Innovation enrich life

Hi ISliiVrlll HtfOND ilnJ 52 / L * L! Notes H>±: (1)Reflow soldering should not be done more than two times. In the case of more than 24 hours passed soldering after first, LEDs will be damaged. L E D rJ lb S T1 i® $ ffn JM IT o (2)When soldering , do not put stress on the LEDs during heating. 3.1.1 Soldering Iron (1) When hand soldering, keep the temperature of iron below less 300°C less than 3 seconds B#i]#pJj£S&3#c (2) The hand solder should be done only one time.#I^SRpJ^S—'Xo 3.1.2 Repairing fif^h Repair should not be done after the LEDs have been soldered. When repairing is unavoidable,...

(1) The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the top of package. The pressure to the top surface will be influence to the reliability of the LEDs. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when use the picking up nozzle, the pressure on the silicone resin should be proper. LED±^K^]5±i$, (2) Components should not be mounted on warped (non coplanar) portion of PCB. After soldering, do not warp the circuit board. LED PCB M_t> (3) Do not apply mechanical force or excess vibration during the cooling process...

energy. The result can be a significant loss of light output from the fixture. Knowledge of the properties of the materials selected to be used in the construction of fixtures can help prevent these issues. Refond advises against the use of any chemicals or materials that have been found or are suspected to have an adverse affect on device performance or reliability. To verify compatibility, Refond recommends that all chemicals and materials be tested in the specific application and environment for which they are intended to be used. Attaching LEDs, do not use adhesives that outgas organic vapor....

Hi ISliiVrlll HtfOND ilnJ 52 / L * L! (6) Thermal Design is paramount importance because heat generation may result in the Characteristics decline, such as brightness decreased, Color change and so on. Please consider the heat generation of the LEDs when making the system design.LED mmmm, (7) Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust > requiring special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the...

Hi ISliiVrlll HtfOND ilnJ 52 / L * L! following condition (65±5) °C for above 24 hours. mmnfemmm, rnm^: eo±5°c5 *?24/Wo If the package is flatulence or damaged, please notify the sales staff to assist. im, itam^AratM&lIo (9)Similar to most Solid state devices; LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS). *¥, LED H (10) Other points for attention, please refer to our relevant information.

Declare This specification is written both in English and in Chinese and the latter is formal.