BoxFlex XS
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Catalog excerpts

BoxFlex XS - 1

BoxFIex XS HIGHLIGHTS ■ Up to 60°C ambient temperature in operation ■ Passive cooling ■ Very small form factor Figure shows configuration variant Overview CHASSIS |Material Dimension (WxHxD) Weight Mounting Steel, powder coated 153 x 50 x 130 mm (with Phoenix connector) 0.8 kg DIN rail POWER SUPPLY Voltage DETAILS Motherboard form factor 3.5" CPU Intel® Baytrail N2807 SoC Processor Front I/O Push button/LED, 1 x USB 2.0, 1 x USB 3.0, 4 x LAN (1000Mbit/s), 1 x Phoenix connector, 2 x serial 9-36 V DC, min. 0.2 A, max. 1.5 A (internal DC/DC converter) CUSTOMIZING Appearance DEFAULT Powder coated with RAL 9005 (black) OPTION Powder coated with any RAL colour OPTION Front bezel printing OPTION Custom external packaging Product certification DEFAULT CE OPTION e.g. UL, FCC, CCC, EAC etc. ds_BoxFlex_XS_EN ■ 18.02.20 ■ specification is subject to change © 2020 by Pyramid Computer GmbH • Botzinger StraBe 60 • D-79111 Freiburg • www.pyramid.de • Phone +49 761 4514 792 • sales@pyramid.de

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BoxFlex XS - 2

Figure shows configuration variant ds_BoxFlex_XS_EN · 18.02.20 · specification is subject to change © 2020 by Pyramid Computer GmbH · Bötzinger Straße 60 · D-79111 Freiburg · www.pyramid.de · Phone +49 761 4514 792 · sales@p

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