Catalog excerpts
WORK PIECE DIMENSIONS: MAX. Ø 305 MM × 650 MM 12″ WAFER AT HIGHEST PRECISION AND THROUGHPUT High wire speed and acceleration Patented Diamond Wire Management System (DWMS) High process automation Sophisticated work piece rocking SMART SLICING TECHNOLOGY FOR SEMICONDUCTOR WAFERING enhancing surfac
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Sophisticated work piece rocking for maximum precision High throughput: 35 m/s wire speed, 12 m/s2 acceleration DWMS: 60 µm wire capability Long load length for high output Optimized work piece rocking for higher wafer quality Shortest wire path: Only < 1.9 m on one side, easy wire set-up and constant tension Robust machine: Mineral cast, low temperature dependency, low vibration, low noise HMI: New HMI on 19″ touch screen, production assistant, global process recipes, easy to train, easy to use Option: Automatic cutting fluid exchange Option: MES interface (SECS / GEM) Easy operation for...
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