RapiTrimTM -C-A
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Advanced laser solutions for interconnect and component production. Active-Trim Laser (IR, Green and UV) Resistor Trimming Systems for Thick and Thin Film Resistors RapiTrim-C with additional capability for active trimming Available for all three laser systems (IR, Green and UV), allowing the adjustment of the whole circuit output such as voltage, switching threshold or frequency. Unique fixturing to customer specifications is also available. • • • • • Unique, proprietary flying probe technology for rapid, accurate trim and test operations No restrictions on component size, shape, orientation or density Optimized for hybrid, PCB, SMT and embedded circuit trimmer Fast job changeover for quick-turn production High accuracy throughput with advanced probe and laser Designed for Next-Generation Circuit Trim and Test Thin film and thick film trimming Simple two-probe measurement to guard probe to full Kelvin probing Optional active circuit trimming with onboard or external instruments Optional process sequence customization Serpentine trims in thin and thick films. Lower cost of operation than fixture-based trimmers with no expensive probe cards to buy. Enhanced layout capability results in no limit on circuit size, orientation or density. Operational flexibility is improved since the system is fully programmable with no waiting days for probe cards. The resulting system is as comfortable in high volume production as in a high-mix quick-turn environment. Advanced ProSysTM Control Software ProSys software allows for automated file conversion and job generation and provides a vision display of the job features and process status. All machine setup calibration controls, job and process settings, vision and process map, status and diagnostic information are accessible with a single click or tap. Laser process tools allow precise control over laser energy, bite size, cut direction and trim limits. Corner shave trim and symmetrical shave trim. RapiTrim systems use proprietary fixtureless technology so probe cards and their inherent limitations are eliminated. Restrictions on design layout are lifted, and operational delays waiting for probe cards are removed. 1051 Baxter Road, Ottawa, Ontario, Canada K2C 3P2 Tel: +1-613-236-8359 Copyright© 2022 PPI Systems Inc. All rights reserved.

Advanced laser solutions for interconnect and component production. The RapiTrim™ Fixtureless Advantage RapiTrim Standard Features RapiTrim systems enable volume production trim and test using flying probe technology for advanced hybrid circuits and embedded passives. Intuitive graphical user interface with ProSys operating software. Advanced beam positioning and laser pulse control provides high throughput, accuracy, and process stability. Using proprietary fixtureless technology, probe cards and their inherent limitations are eliminated. Restrictions on design layout are lifted, and...

Advanced laser solutions for interconnect and component production. Software Features Simple operator interface - load substrates and job, then just press Start. Create jobs through an interactive graphical map of components, circuit features, alignment targets, and trims. Process map - visualize all job components in map or camera overlays. Clearly see immediately what and where the process is, in real time, including pass / fail indication. Extensive DXF and IPC-D-356 file import support automates and speeds job creation. Visualize trims and markings in the map or camera overlay on actual...

Advanced laser solutions for interconnect and component production. RapiTrim Specifications* Trim Types and Accuracy Moving Probes • Single-plunge, double-plunge, L, L-Vernier, • Number of flying probes: 4 scan, serpentine, and custom multi-leg cut types • Easy access sliding doors with two hand full Kelvin (double tip) probes • Typical trimmed resistor distribution <1% (3 sigma) • Automated probe tip calibration • Probe positioning accuracy: <25 µm • Advanced laser pulse control optimizes the process and minimizes substrate damage • Probe XYZ resolution: 0.5 µm • Probe repeatability XYZ:...