ProViaTM FP-UC

ProViaTM  FP-UC

ProViaTM FP-UC

Product catalog summary
Overview
The ProVia FP-UC is a dual laser drilling system utilizing both UV and CO2 lasers, designed for processing flex and rigid HDI boards. It offers high-speed, precise panel processing with optional automation features.

Specifications
- Dual-laser system with UV and CO2 lasers.
- High-performance beam positioning for rapid processing.
- Zoom telescope for variable CO2 spot sizes.
- Optional automatic load/unload and slip sheet handling.
- Beam homogenizer for flat-top CO2 spots.

Applications
- Blind and through via drilling.
- Routing, patterning, skiving, cavity formation, circuit excising, coverlay routing, and defect repair.

System Features
- Configured for all applications including blind and through-hole via drilling.
- High-performance beam positioning for complex features.
- Available in UV-only, CO2-only, or hybrid models.

ProSys Control Software
- Automated drill file conversion and job generation.
- Vision display of job features and process status.
- Precise control over drilling parameters.
- Windows 10 64-bit architecture.

Additional Features
- Autoloader for panel loading.
- Integrated inspection microscope for microvias.
- Flat-top beam homogenizer for consistent processing.
- Dual-head, dual-panel drilling capability.
- Panel thickness measurement probe.

Networking and Automation
- Networking software for automatic file retrieval and job creation.
- Compatible with industry-standard file formats.
- Remote access for factory support.

System Hardware
- High peak power RF-excited CO2 laser and diode-pumped solid-state UV laser.
- Galvanometer scanning field of 50x50 mm.
- Maximum process area of 610x660 mm.
- Beam placement accuracy: 15µm for UV, 20µm for CO2.
- Compliant with CE and North American regulations.

Utilities
- Electrical: 208 VAC or 400 VAC options.
- Exhaust: 75mm duct for debris removal.
- Dimensions: 2620 x 1620 x 2372 mm.
- Weight: 3200 kg net, 3740 kg shipping.

Process Parameters
- High peak power laser sources for minimal heat affected zones.
- Programmable laser energy and pulse rate.
- Via sizes down to 25µm with UV and 50µm with CO2.

Conclusion
The ProVia FP-UC system is a versatile and advanced solution for high-volume via drilling, offering a range of features and configurations to meet diverse production needs.
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Catalog excerpts

ProViaTM  FP-UC-1

Advanced laser solutions for interconnect and component production. Dual Laser Drilling System (UV & CO2) for Flex and Rigid HDI Board Processing. ProVia Hybrid CO2 and UV Laser System • • • • • Dual-laser (UV and CO2) system providing the broadest capability with optimum speed. High performance beam positioning for rapid, accurate panel processing. Zoom telescope provides continuously variable CO2 spot sizes Optional automatic load/unload and slip sheet handling Optional beam homogenizer for flat-top CO2 spots Blind and through via drilling Routing, patterning and skiving Cavity formation Circuit excising Coverlay routing Defect repair Designed for Next-Generation High Volume Via Drilling Requirements A hybrid laser process is used for the broadest process capability. The system auto-calibration ensures repeatable job quality with minimal effort on the part of the operator. It also offers optional networking software with automatic file retrieval and job creation as well as optional panel automation with slipsheet handling. Configured for all Applications The system is configured for all applications including blind and through-hole via drilling, cutting, routing, skiving / cavity formation as well as defect repair. Flex Circuit Processing Advanced ProSysTM Control Software ProSys software allows for automated drill file conversion and job generation and provides a vision display of the job features and process status. All machine setup and calibration controls, job and process settings, vision and process map, status and diagnostic information is accessible with a single click or tap. Drill process tools allow precise control over bite size, spiral spacing, cut direction, via size fine adjust, inner diameter, perimeter revolutions and repetitions using a Windows 10 64-bit architecture. Solder mask removal (L) and coverlay kisscuts (R). The ProVia systems are advanced processing workstations for rigid, rigid-flex or flex panels, with high performance beam positioning for rapid point-to-point drilling and routing complex features. Choose a UVonly model, a CO2-only model, or the hybrid version with both laser sources. 1051 Baxter Road, Ottawa, Ontario, Canada K2C 3P2 Tel: +1-613-236-8359 Copyright© 2020 PPI Systems Inc. All rights reserved.

 Open the catalog to page 1
ProViaTM  FP-UC-2

Advanced laser solutions for interconnect and component production. ProSys™ Software for ProVia™ Systems Intuitive graphical user interface that offers unmatched ease of use for both operators and process engineers. All machine setup and calibration controls, job and process settings, vision and process map, status and diagnostic information - accessible with a single click or tap. Simple operator interface - load panels and just press Start. Process map - visualize all job features in map or camera overlays. Clearly see at a glance what and where the process is, in real time. Fully automatic...

 Open the catalog to page 2
ProViaTM  FP-UC-3

Advanced laser solutions for interconnect and component production. A complete range of features and options to make your production more productive. Autoloader • Complete automation allows for trays of panels to be loaded into the system. Panels are loaded by vacuum pickup. Alternate compact autoloader within the core system footprint. Both schemes have configurable pickup vacuum zones. Slipsheet pass-through handling for both autoloader styles. Configurable for large panel and continuous web processing. Compatible with roll-to-roll web handlers. Integrated inspection microscope A 2.3MP HD color...

 Open the catalog to page 3
ProViaTM  FP-UC-4

Advanced laser solutions for interconnect and component production. ProVia Specifications* System Control System Hardware • • • • • • • • • • • • • • • • • • High peak power RF-excited CO2 laser and diode-pumped solidstate UV laser (20W model) Configured with high performance beam positioning for high speed via drilling, skiving and cutting Three drilling modes: hybrid, conformal mask CO2, direct CO2 Galvanometer scanning field: 50x50 mm (approx. 2”x2”) Maximum process area: 610x660 mm (24”x26”) Vacuum platen for panel hold-down Integrated power meter for accurate process control Precision linear...

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.