ProViaTM FP-U

ProViaTM  FP-U

ProViaTM FP-U

Product catalog summary
Overview
The ProVia FP-U is a single laser drilling system designed for processing both flex and rigid boards using UV laser technology. It offers high-quality drilling and cutting in copper and dielectrics, with options for automatic loading and higher power lasers for dual-head processing.

Applications
The system is suitable for various applications including blind via drilling, routing, patterning, skiving, cavity formation, solder mask removal, and coverlay cutting. It is designed to meet high-volume via drilling requirements with auto-calibration for consistent job quality.

System Configuration
The ProVia system can be configured for different applications, including blind via drilling and defect repair. It supports UV-only, CO2-only, or hybrid laser models, with advanced beam positioning for rapid processing.

ProSys Control Software
The ProSys software provides an intuitive interface for operators and engineers, offering automated drill file conversion, job generation, and real-time system monitoring. It supports multi-language selection and remote access for factory support.

Features
  • Simple operator interface with touchscreen support.
  • Automatic calibration and real-time monitoring.
  • Automated file conversion and job creation.
  • Maintenance tracking and full system diagnostics.

Process Control
The system allows precise control over laser parameters, supporting multi-step and multi-pass processing for flexibility and optimization. It can handle various laser processes, including punch, spiral, and rout operations.

Additional Features
  • Autoloader for automated panel loading.
  • Integrated inspection microscope for microvia inspection.
  • Flat-top beam homogenizer for consistent processing.
  • Dual-head, dual-panel drilling capability.
  • Panel thickness measurement probe.

Specifications
The system features a diode-pumped solid-state UV laser, high-performance beam positioning, and a galvanometer scanning field. It includes a vacuum platen, integrated power meter, and precision linear motor stages. The system is compliant with CE and North American regulations.

Utilities and Dimensions
The system requires specific electrical and exhaust setups, with detailed dimensions and weight specifications provided. It includes a Windows 10-based user interface and supports industry-standard file formats.
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Catalog excerpts

ProViaTM  FP-U-1

Advanced laser solutions for interconnect and component production. Single Laser Drilling System (UV) for Flex and Rigid Board Processing. ProVia UV Laser System • • • • Single laser (UV) system for superior drilling and cutting quality in copper and dielectrics. High performance beam positioning for rapid, accurate panel processing. Optional automatic load/unload and slip sheet handling Optional higher power laser for dual-head, dual-panel processing. Blind via drilling Routing Patterning Skiving / cavity formation Solder mask removal Coverlay cutting Designed for Next-Generation High Volume Via Drilling Requirements The system auto-calibration ensures repeatable job quality with minimal effort on the part of the operator. It also offers optional networking software with automatic file retrieval and job creation as well as optional panel automation with slipsheet handling. Configured for all Applications The system is configured for all applications including blind via drilling, cutting, routing, skiving / cavity formation as well as defect repair. Flex Circuit Processing Advanced ProSysTM Control Software ProSys software allows for automated drill file conversion and job generation and provides a vision display of the job features and process status. All machine setup and calibration controls, job and process settings, vision and process map, status and diagnostic information is accessible with a single click or tap. Drill process tools allow precise control over bite size, spiral spacing, cut direction, via size fine adjust, inner diameter, perimeter revolutions and repetitions using a Windows 10 64-bit architecture. Solder mask removal (L) and coverlay kisscuts (R). The ProVia systems are advanced processing workstations for rigid, rigid-flex or flex panels, with high performance beam positioning for rapid point-to-point drilling and routing complex features. Choose a UVonly model, a CO2-only model, or the hybrid version with both laser sources. 1051 Baxter Road, Ottawa, Ontario, Canada K2C 3P2 Tel: +1-613-236-8359 Copyright© 2020 PPI Systems Inc. All rights reserved.

 Open the catalog to page 1
ProViaTM  FP-U-2

Advanced laser solutions for interconnect and component production. ProSys™ Software for ProVia™ Systems Intuitive graphical user interface that offers unmatched ease of use for both operators and process engineers. All machine setup and calibration controls, job and process settings, vision and process map, status and diagnostic information - accessible with a single click or tap. Simple operator interface - load panels and just press Start. Process map - visualize all job features in map or camera overlays. Clearly see at a glance what and where the process is, in real time. Fully automatic...

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ProViaTM  FP-U-3

Advanced laser solutions for interconnect and component production. A complete range of features and options to make your production more productive. Autoloader • Complete automation allows for trays of panels to be loaded into the system. Panels are loaded by vacuum pickup. Alternate compact autoloader within the core system footprint. Both schemes have configurable pickup vacuum zones. Slipsheet pass-through handling for both autoloader styles. Configurable for large panel and continuous web processing. Compatible with roll-to-roll web handlers. Integrated inspection microscope A 2.3MP HD color...

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ProViaTM  FP-U-4

Advanced laser solutions for interconnect and component production. ProVia Specifications* System Hardware System Control Diode-pumped solid-state UV laser (20W model) Configured with high performance beam positioning for high speed via drilling, skiving and cutting Galvanometer scanning field: 50x50 mm (approx. 2”x2”) Maximum process area: 610x660 mm (24”x26”) Vacuum platen for panel hold-down Integrated power meter for accurate process control Precision linear motor XY stages with linear encoder feedback High performance motion and laser control CDRH Class 1 enclosure Large process viewing...

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.