ProViaTM FP-C

ProViaTM  FP-C

ProViaTM FP-C

Product catalog summary
Overview
The ProVia FP-C is a single laser drilling system utilizing CO2 technology, designed for processing both flex and rigid HDI boards. It offers high-performance beam positioning for rapid and accurate panel processing, with optional features for automation and enhanced beam quality.

Specifications
- High peak power RF-excited CO2 laser
- Galvanometer scanning field: 50x50 mm
- Maximum process area: 610x660 mm
- Beam placement accuracy: 20µm
- Compliant with CE and North American regulations
- Optional features include panel thickness probe and microvia inspection microscope

Applications
The system is suitable for various applications such as blind via drilling, routing, patterning, skiving, cavity formation, solder mask removal, and drilling green tape. It is designed to meet next-generation high-volume via drilling requirements.

ProSys Control Software
The ProSys software provides an intuitive graphical user interface, allowing for easy machine setup, calibration, and process monitoring. It supports automated file conversion, job creation, and real-time system monitoring. The software is compatible with industry-standard file formats and offers remote access for support.

Features
- Automated load/unload and slip sheet handling
- Integrated inspection microscope with HD color camera
- Flat-top beam homogenizer for consistent processing
- Dual-head, dual-panel drilling capability
- Networking software for automatic file retrieval and job creation

System Control and Process Parameters
The system operates on a Windows 10 interface, offering user-friendly screens and password protection. It supports rapid drill file conversion, path optimization, and real-time monitoring. The laser sources are designed to minimize heat-affected zones, with programmable energy and pulse settings.

Utilities and Dimensions
- Electrical: 208 VAC or 400 VAC options
- Exhaust: 75mm duct for debris removal
- Dimensions: 2620 x 1620 x 2372 mm
- Weight: 3200 kg net, 3740 kg shipping
- Water: 8 l/min or optional closed cycle chiller

Conclusion
The ProVia FP-C system is a versatile and advanced solution for high-volume laser drilling and processing of HDI boards, offering a range of features and options to enhance productivity and precision.
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Catalog excerpts

ProViaTM  FP-C-1

Advanced laser solutions for interconnect and component production. Single Laser Drilling System (CO2) for Flex and Rigid HDI Board Processing. ProVia CO2 Laser System • • • • • Single laser (CO2) system for dielectric and thin copper processing. High performance beam positioning for rapid, accurate panel processing. Zoom telescope provides continuously variable CO2 spot sizes Optional automatic load/unload and slip sheet handling Optional beam homogenizer for flat-top CO2 spots Blind via drilling Routing Patterning Skiving / cavity formation Solder mask removal Drilling green tape Designed for Next-Generation High Volume Via Drilling Requirements The system auto-calibration ensures repeatable job quality with minimal effort on the part of the operator. It also offers optional networking software with automatic file retrieval and job creation as well as optional panel automation with slipsheet handling. Configured for all Applications The system is configured for all applications including blind via drilling, cutting, routing, skiving / cavity formation as well as defect repair. Flex Circuit Processing Advanced ProSysTM Control Software ProSys software allows for automated drill file conversion and job generation and provides a vision display of the job features and process status. All machine setup and calibration controls, job and process settings, vision and process map, status and diagnostic information is accessible with a single click or tap. Drill process tools allow precise control over bite size, spiral spacing, cut direction, via size fine adjust, inner diameter, perimeter revolutions and repetitions using a Windows 10 64-bit architecture. Drilling and cutting green tape (L) and solder mask removal (R). The ProVia systems are advanced processing workstations for rigid, rigid-flex or flex panels, with high performance beam positioning for rapid point-to-point drilling and routing complex features. Choose a UVonly model, a CO2-only model, or the hybrid version with both laser sources. 1051 Baxter Road, Ottawa, Ontario, Canada K2C 3P2 Tel: +1-613-236-8359 Copyright© 2020 PPI Systems Inc. All rights reserved.

 Open the catalog to page 1
ProViaTM  FP-C-2

Advanced laser solutions for interconnect and component production. ProSys™ Software for ProVia™ Systems Intuitive graphical user interface that offers unmatched ease of use for both operators and process engineers. All machine setup and calibration controls, job and process settings, vision and process map, status and diagnostic information - accessible with a single click or tap. Simple operator interface - load panels and just press Start. Process map - visualize all job features in map or camera overlays. Clearly see at a glance what and where the process is, in real time. Fully automatic...

 Open the catalog to page 2
ProViaTM  FP-C-3

Advanced laser solutions for interconnect and component production. A complete range of features and options to make your production more productive. Autoloader • Complete automation allows for trays of panels to be loaded into the system. Panels are loaded by vacuum pickup. Alternate compact autoloader within the core system footprint. Both schemes have configurable pickup vacuum zones. Slipsheet pass-through handling for both autoloader styles. Configurable for large panel and continuous web processing. Compatible with roll-to-roll web handlers. Integrated inspection microscope A 2.3MP HD color...

 Open the catalog to page 3
ProViaTM  FP-C-4

Advanced laser solutions for interconnect and component production. ProVia Specifications* System Hardware System Control High peak power RF-excited CO2 laser Configured with high performance beam positioning for high speed via drilling, skiving and cutting Single drilling modes: conformal mask CO2, direct CO2 Galvanometer scanning field: 50x50 mm (approx. 2”x2”) Maximum process area: 610x660 mm (24”x26”) Vacuum platen for panel hold-down Integrated power meter for accurate process control Precision linear motor XY stages with linear encoder feedback High performance motion and laser control...

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.