MiniSKiiP® 3-level
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Applications The MiniSKiiP 3-level power modules are most suitable for applications requiring a high level of efficiency and a better output waveform quality, e.g. for uninterruptible power supply systems (UPS) and solar inverters. Especially at switching frequencies above 8 kHz, the 3-level topology provides reduction of overall losses up to 40% compared to a conventional 2-level solution. Product range The MiniSKiiP 3-level power modules are available up to 200A in NPC (Neutral Clamping Point) topology and in the MiniSKiiP housing sizes 2 and 3. All modules are featuring Trench Field Stop IGBT4 with a blocking voltage of 650 V and SEMIKRON CAL I4F diodes. Benefits The MiniSKiiP 3-level power modules combine all electrical advantages of 3-level topology with a well-established MiniSKiiP mechanical concept consisting of pressure contact technology for quick and easy solder-free assembly. While a soldered module is assembled in a time consuming production process requiring expensive automatic soldering equipment, MiniSKiiP 3-level power modules will be assembled in one step without costly special equipment.

SEMiX® half bridge 6-pack chopper SEMITRANS® half bridge 6-pack 600V/1200V/1700V single switch SEMITOP® half bridge 6-pack 3-level chopper single switch

Applications SEMiX is a flexible and application-oriented module. On the basis of a scalable platform concept, modern chip technology is integrated into IGBT and rectifier modules, which are used in a wide variety of applications such as AC motor drives, switching power supplies and current source inverters. Other typical applications are matrix converters, uninterruptible power supplies and electronic welding devices. Product range Six different housing sizes are available in the voltage classes 600 V, 1200 V and 1700 V for IGBT modules. Half-bridge, six-pack and chopper topologies are...

Modules - IGBT - SEMiX Cases SEMiX 3s

1200 V - IGBT 4 Fast (Trench; SKM50GAL12T4 2)

Modules - IGBT - SEMITRANS Cases SEMITRANS 2

Applications SKiM 63/93, sintered modules with no base plate, offer a number of possibilities for boosting the reliability of inverters. The SKiM 63/93 is used in many different applications such as electric powertrains in electric vehicles, hybrid cars and utility vehicles, heavy-duty construction machinery, or even to provide leading-edge performance in race cars. Product range The SKiM 63/93 modules combine 3-phase inverter topology with temperature control for all 3 phases in 600 V, 650 V, 1200 V, 1700 V voltage. Power ranges from 20 kW - 180 kW, nominal currents range from 300 A - 900...

* all po$. dimensions valid when mounted * ail pos. dimensions valid when mounted ** valid for the outer 4 inserts General Tolerances DIN ISO 2768-m PCB spring landing pad = 03,5 +0,2 ** valid for the outer 4 inserts General Tolerances DIN ISO 2768-m PCB spring landing pad = 03,5 ±0,2

Applications Thanks to the use of spring contact technology, MiniSKiiP modules enable fast single-screw or doublescrew assembly, facilitating quick and reliable inverter manufacture. With more than 14 years of field experience and more than 15 million modules in the field, this module platform has proven successful in every standard application. The main applications are all kinds of frequency inverters, like standard drives, stand alone drives, servo drives, system drives, solar inverters, UPS systems and welding machines. Thanks to the reliability of spring contacts applications like...

Circuit 600 V - IGBT 3 (Trench) SKiiP 16GH066V1 For detailed case drawings please see page 38

Circuit 1200 V - IGBT 4 (Trench)

Modules - IGBT - SEMITOP IGBT Rth(j-s) Case Not for New Design Cases SEMITOP 1

IPM Intelligent Power Modules MiniSKiiP® IPM half bridge

Applications MiniSKiiP IPM is SEMIKRON’s new intelligent power module family for medium power applications. Each IPM incorporates a latch-up free HVIC SOI gate driver with advanced level shifter concept. The gate driver has a 3.3 V/ 5 V/ 15 V compatible input signal interface and provides short-circuit current detection using external shunt resistor, integrated under-voltage lockout for all channels and interlock logic with dead time setting for cross conduction protection. A built-in temperature sensor with NTC characteristic enables monitoring of the intelligent power module temperature...

Modules - IPM - MiniSKiiP IGBT IFSM Rth(j-s) Case @TS= 25°C 600 V - IGBT 3 (Trench) SKiiP 25NABI066V3 1200 V - IGBT 4 (Trench) SKiiP 25ACI12T4V2

SKiiP® 4th generation Sintered chips – for high operating temperatures The success story of the SKiiP family has progressed hand in hand with the advancement of the wind power market. The 4th-generation SKiiP modules are a further improvement of the powerful SKiiP series. The mainstay of SKiiP4 modules is the wind power sector, with approximately 57 GW of the 122 GW of wind power installed worldwide (at the end of 2009) featuring SEMIKRON solutions, in many cases SKiiP technology. Besides wind power applications, SKiiP modules can also be found in elevators, solar power and railway...

1200 V - IGBT 4 (Trench) - SKiiP 4 SKiiP 1814 GB12E4-3DUL W,L,F,U W,L,F,U

1700 V - IGBT 4 (Trench) - SKiiP 4 SKiiP 1814 GB17E4-3DUL

Modules - IPM - SKiiP 3 / 4 Cases SKiiP 3 Case S 23 mounted on P3016 heat sink weight without heat sink: Case S 23 mounted on liquid cooled heat sink NWK 40

Modules - IPM - SKiiP 3 / 4 Cases SKiiP 3 Case S 33 mounted on P3016 heat sink weight without heat sink: Case S 33 mounted on liquid cooled heat sink NWK 40

Modules - IPM - SKiiP 3 / 4 Cases SKiiP 3 Case S 43 mounted on P3016 heat sink weight without heat sink: Case S 43 mounted on liquid cooled heat sink NWK 40

Modules - IPM - SKiiP 3 / 4 Cases SKiiP 4 Case S 34 mounted on P4016 heat sink weight without heat sink: Case S 34 mounted on liquid cooled heat sink NHC

Modules - IPM - SKiiP 3 / 4 Cases SKiiP 4 Case S 44 mounted on P4016 heat sink weight without heat sink: Case S 44 mounted on liquid cooled heat sink NHC