Industrial Platform Solution Guide 2012
164Pages

Industrial Platform Solution Guide

^1About Portwell Portwell, Inc. was founded in 1993 and entered the Industrial PC market in 1995 by developing single-board computers. Today, our continuous development of leading-edge products has resulted in strong growth in market share and revenue, a firm place on the Taipei stock exchange (TAISDAQ), and has established Portwell a major worldwide supplier of specialty computing application platforms and services. Portwell, Inc. is not only a member of the selected group of Intel® Applied Computing Platform Providers (IACPP), but also an associate member of Intel® Embedded and...

Portwell is famous for her platform service that could offer the following benefits to customers. Complte Product Portfolio Select from our full range of both off-the-shelf and versatile custom solutions to scale your products. Portwell provides not only board-level products but also peripheral-level and complte system solutions. Implement Latest Intel Technology Partnering with Intel since 1999, and with streamline access to the latest Intel technologies and roadmap, Portwell delivers cutting-edge solutions not only to meet and exceed the demand for the technologies, but also the needs of...

^1BoardProductionFlow - SMT Material Baking The SMD components tend to be thin, hence, can't endure high temprature. Raw Material Inspection Materials in the production line are prepared based on the packing list provided by the warehouse staff and are stored in the WIP buffer area. Raw Material Inspection Solder Material Paste Baking Printing IPQC The IPQC using the personnel will examine according to the IPC-610D standards magnifying glass to determine the confirmed ECO, BOM and assure the production contents without mistakes. Receiving Board Producti DIP IPQC ICT In-Circuit Testing (ICT)...

Solder Paste Printing Use stencil plate to print the soldering paste thru the plate noies onto the PCB. AOI - Soldering Paste 100% automatic inspection of the PCB after solder paste printing catches defects and improves quality the first time. AOI Solder Paste Chip Mounting Chips Mounting High Speed Mounting pertains to different tiny components such as resistors, capacitors and ICs. It is widely recognized to achieve high precision production. on Flow - SMT Visual Inspection Reflow Soldering Visual Inspection & Repair The visual personnel use the magnifying glass examination, to check for...

^1 System Production Flow IPQC Vrifies that ail the production process is done correctly and accordingly to spcification. Visual Inspection When system is assembled , they would have been visually inspected.Inspectors should check all components and accessory are assembled well and follow MFG before testing. Visual Inspection Assembly System P Assembly Make sure all the system components assembly are finished (Main board, CABLE, Fan, HDD, etc.) Kiting Material Shipping In order to meet the demand of storing collectively, transportation, loading and unloading the products mechanically, the...

Basic Function Test In order to ensure the system product can boot up by Dynamic Burn-ln, the system product should be tested by the electronic function 100% and Basic Function Testing after assembly. Basic Function Test Dynamic Burn In Test DBI is the test before product is shipped out. The purpose is to screen possible weakness and failure which would affect its reliability under different environments. Dynamic Burn In Advanced Function Test on Flow o FQC Finished and packed goods are placed in this area for inspection; the FQC department will inspect finished goods based on standard...

What We Focus on ■ ESD Protection ESD usuaily caused by HBM (Human-Body Mode!), MM (Machne Mode». CDM (Charged-Device Modei)and FI M (FiekHnduced rVtodel). The advantages of preventing ESD in r/ie factory hclude befler product relia bility+ cxtcnded usage tfe. cost savlngs and ncreased yields In order to ensure that the products wil not be arfected by ESD du ring production, an ESO contre* procdure is in place to meet standards. ■ Corrective and Prventive Action (CAPA) In order to en sure Portwell offers world-dass manufactunng services, the correctrve and preventrve processes are...

Table of Contents SINGLE BOARD COMPUTER PAGE 1-7 About Portwell 8-12 Table of Contents 13 Portwell Embedded Board Solutions 14-16 SBC Rfrence Table 17 ROBO-8120VG2R irrtef* DuaVQuad Core ■ Xeon PICMG 1.3SHB wtti DDR3 ECC SDRAM. VGA DM. Dual G驩gabtl Ethernet and USB 22 ROBO-8912VG2AR Intel* Core m 2 Duo processor based PICMG 1 3 SHB wtm DDR2 SDRAM VGA, Dual Gigabit Ethernet. Audio and USB RO-*tt2Vܛ2AR ROBO-8921VG2R Dual/Qusd Core1* Xeon* processor besed PICMG 1.3 SHB wtti DDR2 ECC SDRAM. VGA & Dual Gigabit Ememet ROBO-8110VG2AR Hier Core"* 2 Quad processor based PICMG 1.3SHBwtth...

Table of Contents INDUSTRIAL CHASSIS PAGE 45 About Chssis :oqnc RPC-500NC/L iy 4U industriel rack-mount choses A RE MO-4196 Th§ Best Co^rfbrmanc* 19- 4U Ho⪩ghl Pentium* 4 Prooeuor Bmod Rack-rroont Compute* AREMO-8164 3-eiot lul-eaed industriel note chasst Shoota* ) AREMO-4184 19*4U HeigMrac*-mourt 3uaf WEM06182 rote chssis S1 AREMO-2173P 19-2U industrie*»** PK»Gbaefcp*ar>e :un1 c.mssis (or 53 ARf MO-6182 6-sic* ful-stre induira node tfiassi* (Shoe-box) 65 PRC-1194 19" 1U h$&⢢ Mustrtel raek-mount P4 66 EZORV-400 5.25* oornpad onv* ae<wlths«m type DVD-ROM. SOX* card rwdw 2 USB ports Srtd Bace...

^1 Table of Contents M MINI-ITX FORM FACTOR_ PAGE 81 About Mini-ITX 82-85 Mini-ITX Rfrence Table ma WADE-8020 86 WADE-8020 Intel® Core驙 i5/i7 processor based Mini-ITX with DDR3 SDRAM, Dual Display, Dual Gigabit Ethernet and USB Ports 87 WADE-8067 Leading Intel® 45nm CoreTM 2 Duo processor or Celeron® M processor based Mini-ITX with DDR3 SDRAM, HDMI, Dual Gigabit Ethernet, Audio and USB 88 WADE-8066 Leading Intel® CoreTM2 Duo processorbased Mini-ITX Board with DDR2 SDRAM, Dual Displays, Two GbE LAN ports, Audio and USB 89 WADE-8068 Leading Mobile Intel® CoreTM 2 Duo processor Mini-ITXwith...