COMPAL GROUP PP58Cooling Innovation for Enhanced Performance Without heat-dissipation solution System Front View System Back View Heat-Dissipation Solution Utilize the entire back cover as a heatsink to dissipate CPU & system heat from the inside out. With heat-dissipation solution System Front View System Back View Temperature (degC) • Aluminum die-casting structure for strong & stable operation. • Easy access/service M.2 SSD cover. • Rubber gasket frame sealing bezel design for IP65 resistance. • Comprehensive dual-side mounting support of peripherals. • Innovative heat-dissipation fan-less operation design. • 4.8mm Super Slim Edge Bezel. • VESA 75/100 for Pole/Wall Mounting.

Cash COM1 USB Drawer 3.0 DC19V USB COM2 USB 2.0 Type C 3.0 Specification PT58 Motherboard Processor Chipset System Memory PE26 Intel® Alder Lake-P Platform Intel® Elkhart Lake Celeron 2.0GHz, up to 2.60 Core i5 @ 1.3GHz up to 4.4 GHz GHz Core i3 @ 1.2GHz up to 4.4GHz Chipset integrated 1 x 8GB DDR4 SO-DIMM memory (Max. support up to 16GB) LCD Size LCD Touch Panel Touch Screen USB Port COM Port External I/O Ports Super slim bezel true-Flat PCAP multi-touch screen 3 x USB 3.1 / 3 x USB 2.0 2 x COM (RJ48 connectors that support DC+0/5/12v by BIOS setting, default setting is 0v) 1 x Gigabit Ethernet...