MoW25 Sputtering Targets PS – PRODUCTSPECIFICATION This document is subject to electronic version control – confirm version status before using. This specification covers MoW25 sputtering targets. The MoW25 sputtering targets are produced according to Plansee SE drawings with the dimensions, tolerances and surface finish specified in these construction drawings. Bonding position (optional) The target position on the backing plate is defined as follows: Long direction = actual measurement ± 0,5 mm from the backing plate end where the water cooling ports are located. Actual measurement is defined as distance from new backing plate end where the water cooling ports are located to the edge of the target. Short direction = actual measurement ± 0,5 mm from both backing plate ends. Actual measurement is defined as distance from the lateral end of the backing plate to the lateral edge of the target. Warp (optional) The warp after bonding is less than 1,0 mm on plus side and less than 1,0 mm on minus side for targets smaller than 800 mm backing plate length. The warp after bonding is less than 1,0 mm on plus side and less than 2,0 mm on minus side for 800 to 1600 mm backing plate length target. The warp after bonding is less than 1,5 mm on plus side and less than 3,0 mm on minus side for 1600 to 3000 mm backing plate length target. Target height (optional) Target height from backing plate surface is defined by H in the following equation (Target thickness) < H < (Target thickness + 1,5 mm)

MoW25 Sputtering Targets PS – PRODUCTSPECIFICATION This document is subject to electronic version control – confirm version status before using. Physical and mechanical product properties Guaranteed Density: A  95,0 % (the largest single void will be less than 36 cm²) a) optional for bonded version Surface condition According to the drawing the specified areas of the target and / or the backing plate are blasted. The targets will have no cracks, abrasions and discoloration. Template: QM1 / HPM-020-TP-010 / part 100 / Vers

MoW25 Sputtering Targets PS – PRODUCTSPECIFICATION This document is subject to electronic version control – confirm version status before using. Chemical composition Main and minor components Cr (VI) Organic impurities (e.g. PBB, PBDE, PFOS, PFOA) Metallic purity ** The presence of Cr (VI) and organic impurities can definitely be excluded because of the production process (multiple heat treatments at temperatures above 1000 °C in H2-atmosphere). Remarks: The specified physical and chemical characteristics are disclosed not regarding measurement accuracy.

MoW25 Sputtering Targets PS – PRODUCTSPECIFICATION This document is subject to electronic version control – confirm version status before using.

This document is subject to electronic version control - confirm version status before using. 4.1 Packaging, labelling and storage Standard individual packing: The target is vacuum-sealed in a vinyl pack, which is put into a transportation box. Each package will be provided with a label with the following information: The targets must be kept in a dry place and protected from mechanical damage. The shelf time for the vacuum-packed targets shall be 6 months from the shipping date under the following storage conditions a). However, the customer is recommended to use the targets within 3 months....

MoW25 Sputtering Targets PS - PRODUCTSPECIFICATION This document is subject to electronic version control - confirm version status before using. Please quote following information when ordering: ■ quality (the number of this specification must be mentioned) ■ quantity (number of targets) ■ type of certificate (2.2 or 3.1 according to EN 10204:2004) ■ bonded version (yes/no) ■ for special packing: specification of packaging For further information on our delivery possibilities, please look into our http://www.plansee.com. The standards applied for the test methods are listed in the Plansee standard...