
Catalog excerpts

HiQP SERIES Miniature DC/DC Converters Wide Input Range: 125 to 475 Vdc 50 Watt, Isolated, Regulated Output High Efficiency, Low Ripple Low Profile (2.5" x 1.55" x 0.5") - PCB Mountable High Reliability DC-DC Converters The HiQP Series of high input voltage DC-DC Modules feature superior functionality and characteristics that make them suitable for high end applications. Units in the HiQP Series provide wide input voltage range (125 to 475 Vdc) while maintaining tight output regulation along with low ripple and noise. HiQP Series has a full range of designed-in protections: Overtemperature, Input Overvoltage, Output Overvoltage, and Output Current Limit. HiQP Modules also feature: Remote Shutdown, Trim capability, Onboard Reference Voltage, and, for increased reliability, do not use OptoCouplers in the feed-back look. Load Share function provides a simple way for parallel operation, allowing for increased power with "N+1" redundancy. All modules in HiQP Series are fitted with Input LC Filters to reduce reflected current ripple. Additionally, the Soft -Start function eliminates input inrush current and output voltage overshoot during start-up. HiQP Series units are fully encapsulated for ruggedized operation. PHYSICAL CHARACTERISTICS: Case Dimensions: LxWxH is 2.5" x 1.55" x 0.5" Weight: 75 Grams typical Epoxy Encapsulation FEATURES: • Wide Input Voltage Range: 125Vdc to 475Vdc • Output Voltage: 24Vdc to 200Vdc. 5 standard voltages. Custom output voltages are also available. • Line and Load Regulation: from 1% Vout • Efficiency: Up to 90% • Low Ripple • Input Over Voltage Protection • Input LC Filter • Output Current Limit • Output Overcurrent Protection: Typical 120% Vout • Thermal Shutdown • Trim Capability: +/-15% Vout • 3V Onboard Reference • Remote Shutdown • Load Share Pin for parallel operation • 4242Vdc In/Out Isloation • Fully Encapsulated • 0°C to +70°C Standard Operating Temperature. ° Expanded Operating Temperature Ranges: ■ -40°C to +95°C for HiQP-I ■ -55°C to +95°C for HiQP-M ° All all temperatures measured at Base Plate • Units compliant by design with Mil Std 202: ° Vibration - Method204, Condition D ° Shock - Method 213, Condition I ° Humidity - Method 106 ° Altitude - Method 105, Condition D • Optional Environmental Screening (selected Mil Std 883) available: ° Stabilization Bake - Method 1008 ° Temperature Cycle - Method 1010, Condition B ° Hi Temperature Full Power Burn In - Method 2015 used as a guide Call 800-431-1064 to speak with an engineer f
Open the catalog to page 1
REMOTE SHUT-DOWN FUNCTION Remote Shutdown is enabled when Pin # 2 (SHDN) is pulled LOW (to Pin # 1) within less than 0.4V. Shut-Down Pini released of floating will allow for converter operation. The Shut-Down function can be used in applications requiring On/Off control. This may be done in different was: Non-isolated control could be implemented by using a bipolar transistor, Mosfet, or a switch. Isolated operation would require a relay or an opto-coupler. LOAD SHARE FUNCTION Modules in HiQP Series have a designed-in circuit allowing for parallel operation of multiple converters. This...
Open the catalog to page 5
ISOLATION CHARACTERISTICS Parameter Isolation Test Voltage Isolation Resistance THERMAL CHARACTERISTICS Parameter Thermal Impedance Storage Temperature Baseplate Operating Temperature Baseplate to Ambient 10°C/W Typical Rth (b-a) Free Air Typical Weight: 75 Grams Dimensions are in
Open the catalog to page 6
Pin # 1 (-IN): Negative Input Voltage to the unit - 125-475Vdc. Units are Input OV protected, non-latched shut-down. Pin # 2 (SHDN): When pulled below 0.4Vdc will cause the unit to shut down, non-latching. Leave unconnected if not used. Pin # 3 (VREF): 3 Vref generated on board. Reference voltage tolerance: +/- 2%. Current sourcing capability: 10mA max. Pin # 4 (TRIM): Connecting this pin through a resistor to -IN will increase Vout. Connecting it through a resistor to VREF will reduce Vout. Minimum adjusting range is: +/-10% of Vout nominal. Pin # 5 (LDSH): By connecting together this pin...
Open the catalog to page 7
PART TI = Thermal Interface Alloy Aluminum Substrate Termal Conductivity (BTU-in/hr sq.ft. °F): 1530 Coefficient of Thermal Expansion (25-100°C, 10 {to the -6th} in-in/°F): 13.1 Hardness, Brinnell B: 23 Endurance Limit, pse: 5000 Standard Thickness (Inches): .002 For immediate engineering assistance or to place an order: Call Toll Free: 800-431-1064 PICO Electronics, Inc. 143 Sparks Ave. Pelham, NY 10803-1810 Tel: 914-738-1400 or Fax: 914-738-82
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