Opnext Laser Diode Catalogue
12Pages

Opnext is paving the way to a future of exciting laser de-velopments and ground breaking applications. Our industry heritage, future-focused thinking and deep commitment to research and development help us anticipate and meet the needs of a diverse range of markets, from telecom and datacom to medical, information and industry applications, to defense and security. Established in 2000, Opnext was created from the resources of the Fiber Optic Components Business Unit at Hitachi. We have continued to build on three decades of advanced Hitachi tech- nology, establishing our own broad portfolio...

AC ConnectionCC Connection Other Connection > 65mW HL6364DG HL6365DG HL6376DG (BC) 90mW HL6366DG HL6367DG HL6378DG (BC) 120mW HL6386DG (LN) 150mW HL6385DG (LN) > AC Connection : LD: Anode Common PD: Cathode Common CC Connection : LD: Cathode Common PD: Anode Common FN Connection : LD electrode is isolated from stem (common) PD: none BC Connection : LD: Cathode Common PD: Cathode Common FC-Connection : LD electrode is isolated from stem (common) PD: cathode is flange connection LN Connection : LD: Cathode common PD: none Optodevices - Page 4 size="-1">

AC ConnectionCC ConectionOther Connection > 50mW HL8342MG HL8343MG > AC Connection : LD: Anode Common PD: Cathode Common CC Connection : LD: Cathode Common PD: Anode Common FN Connection : LD electrode is isolated from stem (common) PD: none BC Connection : LD: Cathode Common PD: Cathode Common FC-Connection : LD electrode is isolated from stem (common) PD: cathode is flange connection LN Connection : LD: Cathode common PD: none Optodevices - Page 5 size="-1">

Tc=25C Maximum RatingsOptical and Electrical Characteristics (Typical) Part NumberInternal Circuit Po (mW)Topr(ںC)Po(mW)Ith(mA)Iop(mA)Is(mA) L p(nm) Q //(deg.) Q> (deg.) > HL6312GAC5-10 to 50545550.4635831HL6313GCC5-10 to 50545550.4635831HL6314MGAC3-10 to 50325300.15635830 HL6316GAC3-10 to 50325300.3635830HL6319GCC10-10 to 501050700.17635831HL6320GAC10-10 to 501050700.17635831HL6321GCC15-10 to 501555850.2635830HL6322GAC15-10 to 501555850.2635830HL6323MGAC35-10 to 503045950.156398.530HL6324MGCC3-10 to 50325300.15635830HL6325GCC5-10 to 60530400.1635831HL6326GAC5-10 to...

Maximum RatingsOptical and Electrical Characteristics (Typical) Part NumberInternal Circuit Po (mW)Topr(C)Po(mW)Ith(mA)Iop(mA)Is(mA) L p(nm) Q //(deg.) Q> (deg.) > HL6724MGAC5-10 to 50525350.9670830HL6748MGAC10-10 to 601020301.0670825HL6738MGCC35-10 to 703045900.16908.519 HL6740FGCC**5-10 to 50535--675830HL6750MGCC55-10 to 705030750.15685921HL7001MGCC50-10 to 604030750.15705918HL7002MGAC50-10 to 604030750.15705918HL7851GAC50-10 to 6050451350.0457859.523HL7852GCC50-10 to 6050451350.0457859.523HL8325GCC40-10 to 6040401200.048301022HL8333GAC40-10 to 6040401200.18301022HL8334MGAC40-10 ro...

Main Applications Maximum Rating Optical Power Po (mW)Wavelength & 9mm Package (G/FG-type) & 5.6mm Package (MG/DG/SU/FM-type) L P(nm) > Pointer / AimingLine / Pattern Generator Distance Meter Medical (Bio, Analysis) Barcode Scanner / Laser Printing Display Optical Storage Infrared Automotive Defense & Security Experimental Uses vvvv 3635HL6316GHL6314MG series vvvvv vvvvvv HL6325G seriesHL6327MG series vvvvv vvvvvv 5HL6312G series HL6335G series HL6340MG series HL6356MG series vv 670HL6724MG v 675HL6740FG** vvvvv 7635HL6354MG series vvvv vvvvv HL6331G seriesHL6333MG series vvvv 10HL6319G...

DFB Type 1550nm 2.5 Gbit/s HL1574CP Chip Form 1310nm 10 Gbit/s HL1359CP Chip Form HL1360CP* Chip Form > APD Type 1310 / 1550nm 2.5 Gbit/s HR1252CP* Chip Form 10 Gbit/s HR1262DRC Chip on Carrier HR1262ERC Chip on Carrier PIN Type 1310 / 1550nm 10 Gbit/s HR1166CP* Chip Form > Part NumberData Rate (Gbit/s)Wavelength (nm)Operating Temp (C)Output Power (mW)Extinction Ratio (dB)SMSR (dB)Dispersion (ps/nm)ReachRemarksHL1574CP2.51,530 to 1,5650 to 855 (CW)-> 35-80 kmChip Form Expected ValueHL1359CP101,290 to 1,3300 to 855 (CW)->35-10 kmChip Form Expected ValueHL1360CP*101,290 to 1,3300 to 955...

Part NumberData Rate (Gbit/s)Wavelength (nm)Operating Temperature (C)ModulatedOutput Power (dBm)Extinction Ration (dB)Dispersion (ps/nm)Penalty (dB)ReachDimensionsRemarksLD5033101,290 to 1,3300 to 75-3 typ>5-- ڢɤ 10 km & 5.6, L=18 mmDM-DFBXMD-MSALD5035101,290 to 1,330-5 to 90-3 typ>5-- ≤ 10 km & 5.6, L=18 mmDM-DFBXMD-MSA Part NumberData Rate (Gbit/s)Wavelength (nm)Operating Temperature (C)Received Power (dBm)Power Supply (v) TypicalDimensionsRemarksPD7006101,310 to 1,5500 to 80-18 to 13.3 & 5.35,L=14 mm PIN-TIAXMD-MSAPD7056101,310 to 1,5500 to 80-23.3 / 30 & 5.35,L=14 mm APD-TIAXMD-MSA >...

Headquarters: Sales, Marketing and Global OperationsOpnext, Inc. 1 Christopher Way Eatontown, NJ 07724T | 732.544.3400 F | 732.544.3540 Pluggables Business Unit / North America Sales Office 940 Auburn Court Fremont, CA 94538T | 510.580.8828 F | 510.580.8819 Sales Office 104 Treemonte Drive Orange City, FL 32763T | 386.774.2404 F | 386.774.2403 Sales Office Opnext Japan, Inc. Takagi Building 3F Iwamoto-cho 1-3-9, Chiyoda-ku Tokyo 101-0032, JapanT | +81.3.3865.5591 F | +81.3.3865.5597 Modules Business Unit Opnext Japan, Inc. 216 Totsuka-cho, Totsuka-ku Yokohama 244-8567, JapanT |...