Catalog excerpts
(P/N: XSJ-10-D5-32) Introduction This 14Gbps photodiode chip, which is top-illuminated high data rate PIN photodiode chip, with active area is Φ32μm. Its features have high responsivity, low capacitance, low dark current and excellent reliability, mainly combination with high performance 14Gbps transimpedance amplifiers (TIA), applications in long haul applications, high date rate up to 14Gbps with single mode fiber optical receiver. Mesa structure, Ground-Signal-Ground (GSG) bond pad on top. Low dark current, low capacitance. High responsibility. Excellent reliability: All chips have passed the qualification requirements as specified by Telcordia -GR-468-CORE. Parallel optical interconnection. Email: sales@xinsijie.com.cn
Open the catalog to page 1
Tel: +86 755-23712706 Email: sales@xinsijie.com.cn Web: www.xinsijie.com.cn D00000909 Rev D
Open the catalog to page 2
1. Take necessary ESD protective measures, avoid to prevent electrostatic damage the chip. 2. InP-based chip are easily fragile and damaged, should be very carefully used when handling. 3. Do not handle with tweezers, recommended by vacuum adsorption. 4. Bonding force, temperature should be carefully setting, in order to avoid damage to the chip. Tel: +86 755-23712706 Email: sales@xinsijie.com.cn Web: www.xinsijie.com.cn D00000909 Rev D
Open the catalog to page 3
