LUXEON Rebel General Purpose White Portfolio High fl ux and color stability Technical Datasheet DS64 Introduction The LUXEON® Rebel General Purpose White Portfolio LEDs in this datasheet are ideal for all lighting and illumination applications. These fl ux differentiated parts, like all other LUXEON Rebel LEDs, provide the industry’s best lumen maintenance, superior reliability and quality white light that make them the most widely used power LEDs today. Using the information in this document you can start designing applications to your unique specifi cations. LUXEON Rebel General Purpose White LEDs • Deliver more usable light and higher fl ux density • Optimize applications to reduce size and cost • Tightly pack the LEDs for mixing • Engineer more robust applications • Utilize standard FR4 PCB technology • Simplify manufacturing through the use of surface mount technology. LUXEON® Rebel General Purpose White Portfolio

LUXEON Rebel General Purpose Datasheet DS64 (09/10/07) 3 Product Nomenclature LUXEON Rebel is tested and binned at 350 mA. The part number designation is explained as follows: L X M L - A B C D - E F G H Where: A — designates radiation pattern (value P for Lambertian) B — designates color (see LUXEON Rebel Binning and Labeling section) C — designates color variant (0 for direct colored variants) D — designates test current (value 1 for 350 mA) E — reserved for future product offerings FGH — minimum luminous fl ux (lm) or radiometric power (mW) performance Therefore products tested and binned...

LUXEON Rebel General Purpose Datasheet DS64 (09/10/07) 4 Flux Characteristics for LUXEON Rebel, Thermal Pad Temperature=25°C Table 1. Performance at Test Current Typical Performance at Indicated Current Color Part Number Minimum Luminous Test Typical Luminous Drive Flux (lm) Current Flux (lm) Current ƒ¶V [1] (mA) ƒ¶V [2] (mA) LXML-PWC1-0040 40 350 80 700 LXML-PWC1-0050 50 350 95 700 LXML-PWC1-0080 80 350 145 700 LXML-PWC1-0090 90 350 160 700 LXML-PWC1-0100 100 350 180 700 LXML-PWN1-0040 40 350 80 700 LXML-PWN1-0050 50 350 95 700 LXML-PWN1-0080 80 350 145 700 LXML-PWN1-0090 90 350 160 700 LXML-PWN1-0100...

LUXEON Rebel General Purpose Datasheet DS64 (09/10/07) 5 Flux Performance, Binning, and Supportability LEDs are produced with semiconductor technology that is subject to process variation, yielding a range of fl ux performance that is approximately Gaussian in nature. In order to provide customers with fi ne granularity within the overall fl ux distribution, Philips Lumileds separates LEDs into fi xed, easy to design with, minimum luminous fl ux bins. To verify supportability of parts chosen for your application design, please consult your Philips Lumileds/Future Lighting Solutions sales representative....

LUXEON Rebel General Purpose Datasheet DS64 (09/10/07) 6 Lambertian LUXEON Rebel at Test Current [1] Thermal Pad Temperature = 25°C Table 2. Typical Total Typical Included Viewing Color Temperature [3] [4] Angle [5] Angle [6] CCT (degrees) (degrees) Color Min. Typ. Max. ƒå0.90V 2ƒå 1/2 Cool-White 4500K 6500K 10,000K 160 120 Neutral-White 3500K 4100K 4500K 160 120 Warm-White 2540K 3100K 3500K 160 120 Notes for Table 2: 1. Test current is 350 mA for all LXML-Pxx1-0xxx products. 2. CCT ±5% tester tolerance. 3. Typical CRI (Color Rendering Index) for cool-white is 70, neutral-white is 70 and warm-white...

LUXEON Rebel General Purpose Datasheet DS64 (09/10/07) 7 Electrical Characteristics at 350 mA for LUXEON Rebel, Part Numbers LXML-Pxx1-0xxx, Thermal Pad Temperature = 25ºC Table 3. Typical Temperature Typical Thermal Coeffi cient of Resistance Forward Voltage Vf [1] Forward Voltage [2] Junction to (V) (mV/°C) Thermal Pad (°C/W) Color Min. Typ. Max. ƒ´Vf / ƒ´TJ Rƒå J-C Cool-White 2.55 3.15 3.99 -2.0 to -4.0 10 Neutral-White 2.55 3.15 3.99 -2.0 to -4.0 10 Warm-White 2.55 3.15 3.99 -2.0 to -4.0 10 Notes for Table 3: 1. Philips Lumileds maintains a tolerance of ±0.06V on forward voltage measurements....

LUXEON Rebel General Purpose Datasheet DS64 (09/10/07) 8 Absolute Maximum Ratings Table 5. Parameter Cool-White/Neutral-White/Warm-White DC Forward Current (mA) 1000 Peak Pulsed Forward Current (mA) 1000 Average Forward Current (mA) 1000 ESD Sensitivity < 8000V Human Body Model (HBM) Class 2 JESD22-A114-B < 400V Machine Model (MM) Class 2 JESD22-A115-B LED Junction Temperature[1] 150°C Operating Case Temperature at 350 mA -40°C - 135°C Storage Temperature -40°C - 135°C Soldering Temperature JEDEC 020c 260°C Allowable Refl ow Cycles 3 Autoclave Conditions 121°C at 2 ATM 100% Relative Humidity...

LUXEON Rebel General Purpose Datasheet DS64 (09/10/07) 9 Table 7. Profi le Feature Lead Free Assembly Average Ramp-Up Rate (Tsmax to Tp) 3°C / second max Preheat Temperature Min (Tsmin) 150°C Preheat Temperature Max (Tsmax) 200°C Preheat Time (tsmin to tsmax) 60 - 180 seconds Time Maintained Above Temperature TL (tL) 217°C Time Maintained Above Time (tL) 60 - 150 seconds Peak / Classifi cation Temperature (TP) 260°C Time Within 5°C of Actual Peak Temperature (tP) 20 - 40 seconds Ramp-Down Rate 6°C / second max Time 25°C to Peak Temperature 8 minutes max Note for Table 7: 1. All temperatures refer...

LUXEON Rebel General Purpose Datasheet DS64 (09/10/07) 10 Mechanical Dimensions Figure 1. Package outline drawing. Notes for Figure 1: 1. Do not handle the device by the lens—care must be taken to avoid damage to the lens or the interior of the device that can be damaged by excessive force to the lens. 2. Drawings not to scale. 3. All dimensions are in millimeters. 4. The Thermal Pad is electrically isolated from the Anode and Cathode contact pads.

LUXEON Rebel General Purpose Datasheet DS64 (09/10/07) 11 Pad Confi guration Note for Figure 2: 1. The Thermal Pad is electrically isolated from the Anode and Cathode contact pads. Solder Pad Design Note for Figure 3: The photograph below shows the recommended LUXEON Rebel layout on Printed Circuit Board (PCB). This design easily achieves a thermal resistance of 7K/W. Application Brief AB32 provides extensive details for this layout. In addition, the .dwg fi les are available upon request. Figure 2. Pad confi guration. Figure 3. Solder pad layout.