LUXEON FlipChip
12Pages

Catalog excerpts

LUXEON FlipChip High Current Density FlipChip Introduction Philips Lumileds LUXEON FlipChip LED Technology enables the next generation of lighting applications. Customers now have complete design flexibility to access Lumileds’ industry leading performance at the die level and customize the phosphor and packaging to best suit their lighting applications. LUXEON FlipChip is a real chip scale package LED that can be attached by reflow without additional packaging. Traditional wire bonding limits the packing and power density of LEDs. LUXEON FlipChip LEDs can be packaged closer and can be driven at a higher current density, therefore requiring fewer emitters to achieve a higher lumen output at higher lumen densities. This document contains the performance data needed to design and engineer Philips Lumileds LUXEON FlipChip based application. • High drive current up to 1A/mm2 • High current density for high • High-packaging density • Low typical forward voltage of 2.9V • Low thermal resistance • Symmetric, larger bond pads with under bump metallization finishing remote phosphor applications • Surface mount capable • No wire bonds • Robust design with proven Lumileds reliability LUXEON FlipChip DS116 ©2014 Philips Lumileds Lighting Company. • Chip-on-board applications • Remote phosphor applications

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Table of Contents General Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Part Number Nomenclature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Environmental Compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . ....

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General Information Part Number Nomenclature The part number designation for LUXEON FlipChip follows: L0F2-BxxxSIZEyyyy1 Where: L0F2 – designates for package level 0 flip chip generation 2 B – designates for color blue xxx - designates minimum dominant wavelength bin (450 for 450nm min dominant wavelength bin) SIZE - designates die dimension (1000 for 1.000mm2 ) yyyy - minimum radiometric power performance (0500 for 500mW power bin) Environmental Compliance Philips Lumileds is committed to providing environmentally friendly products to the solid-state lighting market. LUXEON FlipChip is...

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Product Performance and Characterization Guide Table 1. Optical Characteristics at Tj = 25°C, If = 350mA Dominant Wavelength (nm) [1,2] Part Number Typical Temperature Coefficient of Peak Wavelength [3] (nm/°C) Typical Spectra Half-width (nm) Notes for Table 1: 1. Philips Lumileds maintains a tolerance of ±2nm for dominant wavelength measurements. 2. Please see Figure 8 for typical translation from peak wavelength to dominant wavelength. 3. Measured between 25°C and 85°C at If= 350mA. Table 2. Performance Characteristics at Tj = 25°C, If = 350mA Part Number Notes for Table 2: 1. Radiometric...

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Absolute Maximum Ratings Table 4. Operating Condition and Ratings Maximum Performance Peak Pulsed Forward Current ^ 1300mA Reverse Voltage LUXEON FlipChip is not designed to be driven in reverse bias 1 Proper current de-rating must be observed to maintain the junction temperature below the specified maximum junction temperature 2 Residual periodic variations due to power conversion from alternating current (AC) to direct current (DC), also called "ripple" with frequencies > 100Hz and amplitude < 250mA are acceptable, assuming the average current throughout each cycle does not exceed the...

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Characteristic Curves Relative Spectral Power Distribution vs. Wavelength Figure 2. Relative spectral power distribution at T. = 25°C, lf = 350mA. Forward Current vs. Forward Voltage Figure 3. Forward current vs. forward voltage at T. = 25°C. LUXEON FlipChip DS116 20140904 ©2014 Philips Lumileds Lighting Company

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Typical Relative Radiometric Power vs. Forward Current Figure 4. Typical relative radiometric power vs. forward current at T. = 25°C. Dominant Wavelength Shift vs. Forward Current Figure 5. Dominant wavelength shift vs. forward current at T. = 25°C. LUXEON FlipChip DS116 20140904 ©2014 Philips Lumileds Lighting Company

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Relative Radiometric Power vs. Junction Temperature Figure 6. Relative radiometric power vs. junction temperature at lf = 350mA. Dominant Wavelength Shift vs. Junction Temperature Figure 7. Dominant wavelength shift vs. junction temperature at lf = 350mA. LUXEON FlipChip DS116 20140904 ©2014 Philips Lumileds Lighting Company

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Typical Translation from Peak Wavelength to Dominant Wavelength Figure 8. Typical translation from peak wavelength to dominant wavelength at Tj = 25°C, If = 350mA. LUXEON FlipChip DS116 20140904 ©2014 Philips Lumileds Lighting Company.

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Radiation Patterns Spatial Radiation Pattern Angular Displacement [degrees] Figure 9. Typical spatial radiation pattern at T. = 25°C, lf = 350mA. Polar Radiation Pattern Figure 10. Typical polar radiation pattern for LUXEON FlipChip. 1 Radiation pattern is measured for the die packaged on ceramic tile with high reflective surface and dome encapsulation LUXEON FlipChip DS116 20140904 ©2014 Philips Lumileds Lighting Company

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Bin Structure for LUXEON FlipChip LUXEON FlipChip is characterized at Tj = 25°C, If = 350mA and sorted on bin sheets. A specific bin sheet only contains LUXEON FlipChip within a single bin for radiometric power, dominant wavelength, and forward voltage. An order for a specific part number at a given dominant wavelength bin can be filled from any bin combination of radiometric flux and forward voltage. Bin sheets are labeled by a four digit alphanumeric CAT code ABCD following the format below. Table 5. A Notes for Table 5: 1. Radiometric power values are based on a die packaged on ceramic...

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