General Illumination LUXEON FlipChip UV Chip-scale package for maximum design flexibility in UV applications LUXEON FlipChip UV is the smallest and highest power density (W/cm2) ultraviolet with FlipChip Technology in a chip-scale package LED can be reflowed onto a substrate with a standard surface mount (SMT) equipment and process. LUXEON FlipChip UV LED enables tighter beam control and high packing density of LEDs on a chip-on-board solution and completely eliminates wire bonds in the system. LUXEON FlipChip UV is the ideal choice for cost sensitive applications to achieve high irradiance at high current density, maximizing W/$ by taking the advantage of lowest thermal resistance of a chip-scale package device. Primary Applications Ultraviolet wavelength range of 380–410nm for a range of options Specialty Lighting Micro sized CSP: 1.0mm2 package for design flexibility and packing density No wire bonds allows for direct attach and reflow 5-sided emitter with batwing radiation pattern enables wide viewing angles Low thermal resistance for leading system level lm/$ Maximum drive current of 1A for delivers superior lumens for reduced LED count DS137 LUXEON FlipChip UV Product Datasheet ©2015 Lumileds Holding B.V. All rights reserved.

Table of Contents General Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Part Number Nomenclature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Environmental Compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Product Characteristics . . . . . . . . . . . . . . . . . . . . . . . . ....

General Information Part Number Nomenclature LUXEON FlipChip UV are specified and binned at 500mA and Tj=25°C. The alphanumerical part number designations for the LUXEON FlipChip UV are explained as follows: LxF2 – Uyyy1000zzzz1 Where: x — designates level (0 for die on blue bin tape, 1 for die on tape and reel) U — designates for Ultraviolet color yyy — designates minimum peak wavelength bin (390 for 390 nm minimum wavelength bin) 1000 — designates die dimension (1000 for 1.000 mm2) zzzz — designates minimum radiometric power at test conditions (0500 for 500mW power bin) Environmental Compliance...

Product Selection Tablet LUXEON FlipChip UVTypical Performance 1 Lumileds maintains a tolerance of ±0 06V on forward voltage measurements 2 Measured between T. = 25°C and T. = 85°C for coefficient of Vf DS137 LUXEON FlipChip UV Product Datasheet 20150217 ©2015 Lumileds Holding B.V. All rights reserved.

Absolute Maximum Ratings Table 4. LUXEON FlipChip UV Operating Condition and Ratings Maximum Ratings Peak Pulsed Forward Current 1200mA _ESP Sensitivity w_< 200V Human Body Model (HBM) Class 3A, JESD22-A114-E LED Junction Temperature ra (DC & pulse) 135°C LED Operating Case Temperature™ 105°C Soldering Temperature 300 ±3°C (<30 second) Allowable Reflow Cycles 3 Reserve Voltage (V ) LUXEON FlipChip UV LEDs are not designed to be driven in reverse bias 1 Proper current derating must be observed to maintain junction temperature below the maximum 2 Residual periodic variations due to power conversion...

Typical Performance Graphs Power Output (Test Current= 500mA) Figure 1. Typical radiometric power vs. T. Figure 2. Typical radiometric power vs. forward current. DS137 LUXEON FlipChip UV Product Datasheet 20150217 ©2015 Lumileds Holding B.V. All rights reserved.

Figure 3. Typical peak wavelength shift vs. forward current. Wavelength Shift (Test Current =500mA) Figure 4. Typical peak wavelength shift vs. T DS137 LUXEON FlipChip UV Product Datasheet 20150217 ©2015 Lumileds Holding B.V. All rights reserved.

Figure 5. Forward current vs. Vf. Spectral Distribution vs. Wavelength Characteristics Figure 6. Spectral distribution vs. wavelength. DS137 LUXEON FlipChip UV Product Datasheet 20150217 ©2015 Lumileds Holding B.V. All rights reserved.

Spatial Radiation Patterns (T .. =25°C, Test Current =500mA) Figure 7. Intensity vs. angle. Angular Displacement [degrees] Figure 8. Angle vs. intensity. DS137 LUXEON FlipChip UV Product Datasheet 20150217 ©2015 Lumileds Holding B.V. All rights reserved.

Binning Definitions & Labeling Purpose of Product Binning In the manufacturing of semiconductor products, there are variations in performance around the average values given in the technical datasheets. For this reason, Lumiieds bins the LED components for radiometric power and forward voltage, peak wavelength Decoding Product Bin Labeling LUXEON FlipChip UV emitters are labeled using a four-digit alphanumeric CAT code following the format below: Radiometric Flux Bins DS137 LUXEON FlipChip UV Product Datasheet 20150217 ©2015 Lumiieds Holding B.V. All rights reserved.

Forward Voltage Bins DS137 LUXEON FlipChip UV Product Datasheet 20150217 ©2015 Lumileds Holding B.V. All rights reserved.

Reflow Soldering Guidelines (Based Upon SAC Solder) Table 8. (Based upon SAC solder) Profile Feature Lead Free Assembly Average Ramp-Up Rate (Tsmax to Tp) Preheat Temperature Min (Tsmin ) Preheat Temperature Max (Tsmax ) Preheat Time (ts) from Tsmin to Tsmax Time Maintained Above Temperature (tL ) Peak / Classification Temperature (Tp ) Time within 5°C of Actual Temperature (tp ) Ramp-Down Rate Time 25°C to Peak Temperature Notes for Table 8: 1. All temperatures refer to the application Printed Circuit Board (PCB), measured on the surface adjacent to the package body. JEDEC Moisture Sensitivity...

Figure 9. Solder pad layout of LxF2-Uzzz1000yyyy1. Notes for Figure 9: 1. The drawing shows the recommended LUXEON FlipChip UV layout on Printed Circuit Board (PCB). 2. All dimensions are in millimeters. Assembly Precautions **Refer to Assembly Precautions and Material Safety documents DS137 LUXEON FlipChip UV Product Datasheet 20150217 ©2015 Lumileds Holding B.V. All rights reserved.