Single-part, heat-cure Epoxy Technical Datasheet Permabond Engineering Adhesives Excellent adhesive strength Excellent resistance to vibration Easy to use - no mixing required High shear and peel strength Good impact strength High temperature resistance Good resistance to chemicals Typical Performance of Cured Adhesive Description PERMABOND® ES558 is a single-part epoxy paste which flows like solder when heated during curing. The adhesive is toughened for maximum impact resistance, along with excellent peel and shear strength. ES558 is ideal for bonding a wide range of materials including metals, ferrites, ceramics and composites. Physical Properties of Uncured Adhesive Chemical composition Typical Curing Properties Flow at high temperature *Actual cure times will depend on the time it takes for the adhesive to reach this temperature - for example, large assemblies or a crowded oven will require longer to reach full cure. Alternative, quicker methods of curing include induction, hotplates, infrared lamps and hot-air guns. *Strength results will vary depending on the level of surface “Hot strength" shear strength tests performed on mild steel. Fully cured then conditioned to pull temperature for 30 minutes before testing. ES558 can withstand higher temperatures for brief periods (such as for paint baking and wave soldering processes) providing the joint is not unduly stressed. The minimum temperature the cured adhesive can be exposed to is -40°C (-40°F) depending on the materials being bonded. The information given and the recommendations made herein are based on our research and are believed to be accurate but no guarantee of their accuracy is made. In every case we urge and recommend that purchasers before using any product in full-scale production make their own tests to determine to their own satisfaction whether the product is of acceptable quality and is suitable for their particular purpose under their own operating conditions. THE PRODUCTS DISCLOSED HEREIN ARE SOLD WITHOUT ANY WARRANTY AS TO MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR ANY OTHER WARRANTY, EXPRESS OR IMPLIED. No representative of ours has any authority to waive or change the foregoing provisions but, subject to such provisions, our engineers are available to assist purchasers in adapting our products to their needs and to the circumstances prevailing in their business. Nothing contained herein shall be construed to imply the non-existence of any relevant patents or to constitute a permission, inducement or recommendation to practice any invention covered by any patent, without authority from the owner of this patent. We also expect purchasers to use our products in accordance with the guiding principles of the Chemical Manufacturers Association’s Responsible Care® program. Permabond ES558 Global TDS Revision 10 25 October 2019 Page 1/2 FOR PROFESSIONAL OR INDUSTRIAL USE ONLY. KEEP OUT OF REACH OF CHILDREN

Surface Preparation Surfaces should be clean, dry and grease-free before applying the adhesive. Use a suitable solvent (such as acetone or isopropanol) for the degreasing of surfaces. Some metals such as aluminium, copper and its alloys will benefit from light abrasion with emery cloth (or similar), to remove the oxide layer. % Strength Retention Directions for Use 1) The adhesive should be dispensed from the cartridge via the nozzle supplied (this can be cut to give the appropriate sized bead to cover the bond area). 2) Apply the adhesive to one surface and avoid entrapping air. 3) Assemble...