Website:
nVent Schroff GmbH
Group: nVent
Catalog excerpts
Rugged Conduction Cooled Enclosures www.schroff.biz For electronics packaging which must perform under extreme conditions ¡ Robust machined aluminium construction ¡ IP/EMC gasket options for severe environments ¡ Optimized heat transfer and dissipation ¡ Extreme shock and vibration protection ¡ Fully modular design for maximum flexibility
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Modular Rugged Conduction Cooled Enclosures are designed to accept plug-in-units with Card-Lok clamping devices 39601-409 06/2010 © Pentair Technical Products www.schroff.biz ¡ Designed in accordance with “VITA 48.2 mechanical specification for microcomputers using REDI conduction cooling applied to VITA 46” • Accomodates Eurocard format printed circuit boards in 3 U or 6 U heights x 160 mm depth • Allows a variety of system formats including VPX, VME, CompactPCI, CompactPCI Serial, CompactPCI Plus IO, VME64 extensions in accordance with “IEEE standard for mechanical core specifications for...
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Innovations 20104 Pages
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Innovations 2008 - 20098 Pages
