Innovations 2010/2011
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Innovations 2010/2011 - 1

Subracks Card-Loks/Wedge-Loks Systems Backplanes CCA Cabinets Innovations 2010/2011

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Innovations 2010/2011 - 2

Standard 19" subracks 19" subrack for mobile applications Card-Loks and Wedge-Loks are mechanically expanding devices used for securely fixing a PCB assembly into a cold wall or card cage chassis. They provide: ¡ Secure mechanical fixing to withstand harsh shock and vibration environments ¡ A thermal path for the conduction of heat generated on the PCB to the cold wall, where it is dissipated (by heat sink, liquid cooling, etc.) ¡ As kits or individual configuration ¡ EMC shielding can be easily upgraded ¡ Designed for extractor handles to the IEEE 1101.10/11 and IEC 60297-3-103 standards...

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Innovations 2010/2011 - 3

¡ As kits or individual configuration ¡ EMC shielding can be easily upgraded ¡ Designed for extractor handles to IEEE 1101.10/11 and IEC 60297-3-103 for CompactPCI and VME64x applications ¡ Shock and vibration: IEC 61597-1, performance level DL3 ¡ Vibration resistance: 9-200 Hz, 3g (IEC 60068-2-6) ¡ Shock requirements: up to 25g (IEC 60068-2-27) ¡ Operation Temp. 0 °C to +65 °C ¡ Storage Temp. -20 °C to +85 °C, additional MIL requirements Subracks for harsh environments Custom application options ¡ Maximum clamping force for high shock and vibration resistance ¡ Maximum thermal heat...

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Innovations 2010/2011 - 4

FOR SERIAL HIGH-SPEED DATA TRANSMISSION Systems Schroff offers a variety of system solutions for all current bus specifications. The newly specified systems from PICMG and VITA, such as CompactPCI Serial, RuggedMicroTCA and VPX backplanes are already available as standard. Based on the Schroff subrack programme, available in various levels of ruggedness, system solutions can be adapted quickly to your specific shock and vibration requirements. With our know-how in high-speed backplane design, EMC, thermal management and environmental considerations, we can help you to develop the perfect...

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Innovations 2010/2011 - 5

¡ Modular concept with base chassis and serveral different cooling options ¡ Conduction cooled for fanless operation ¡ High IP class (>IP 55) ¡ Board form factor conforms to IEEE 1101.x/IEC 60297 VPX Conduction Cooled Enclosure New standard for high-speed data transmission with highest shock and vibration requirements MicroTCA.1 New standard for communications solutions in harsh environments ¡ Extended Shock and Vibration Range 1 Vibration sinusoidal 3g (MicroTCA.0 = 0,5g), shock: 25g (MicroTCA.0 = 7g) In accordance with IEC 61587:2007 Performance level DL3 ¡ Extended Shock and Vibration...

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Innovations 2010/2011 - 6

Cabinets ¡ Earthquake resistance tested under IEC 61 587-2 to Bellcore Zone 3 (maximum acceleration: 3g) ¡ Dynamic load-carrying capacity: 250 kg ¡ Static load-carrying capacity: 1000 kg ¡ Earthquake resistance tested under IEC 61 587-2 to Bellcore Zone 4 (maximum acceleration: 5g) ¡ Dynamic load-carrying capacity: 250 kg ¡ Earthquake-proof plinth with NEBS-compliant fixing VARISTAR is Schroff‘s standard cabinet platform that values robustness, flexibility and attention to detail. Manufactured in Europe, Asia and the Americas, this cabinet platform meets all your engineering challenges...

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Innovations 2010/2011 - 7

¡ Cabinet for extreme seismic and mobile requirements ¡ Shock tested to MIL 901D ¡ Excellent EMC protection (60 dB at 1 GHz, 40 dB at 3 GHz) ¡ Dynamic load-carrying capacity: 150 kg ¡ Protected against dust and water (IP 55) ¡ Cabinet for on-board application on trains ¡ Welding certified to EN 15085 ¡ Load calculation to EN 12633 (5g) ¡ Dynamic load-carrying capacity: 170 kg ¡ Fire regulations to NFF16-101 or DIN 5510 ¡ Corrosion resistance to EN ISO 6270 VARISTAR MIL VARISTAR Rail For further information please visit: www.schroff.biz/varistar/mil For further information please visit:...

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All NVent Schroff GmbH catalogs and technical brochures

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