aerospace climate control electromechanical filtration fluid & gas handling hydraulics pneumatics process control sealing & shielding Thermal Interface Materials For Electronics Cooling Products & Custom Solutions Catalog Chomerics ENGINEERING YOUR SUCCESS.

Customer Responsibility and Offer of Sale Statement CUSTOMER RESPONSIBILITY ! WARNING – USER RESPONSIBILITY FAILURE OR IMPROPER SELECTION OR IMPROPER USE OF THE PRODUCTS DESCRIBED HEREIN OR RELATED ITEMS CAN CAUSE DEATH, PERSONAL INJURY AND PROPERTY DAMAGE. This document and other information from Parker-Hannifin Corporation, its subsidiaries and authorized distributors provide product or system options for further investigation by users having technical expertise. The user, through its own analysis and testing, is solely responsible for making the final selection of the system and components...

Introduction Chomerics, a division of Parker Hannifin Corporation (NYSE:PH), is a global provider of EMI shielding, thermal interface materials, plastics and optical products. Chomerics specializes in providing products and services to OEM and CEM electronics companies in the telecommunications, information technology, consumer, power conversion, medical device, defense, and transportation markets. Since 1961, Chomerics has been a leader in the development of electrically conductive elastomers for use as extruded, molded and form-in-place EMI gaskets for telecommunications and electronics applications....

Parker Chomerics Capabilities include: THERMAL MANAGEMENT & CONTROL • • • • • • • • • • • Thermally conductive gap filler pads Fully cured dispensable thermal gels Silicone-free thermal pads Phase-change materials (PCM) Polymer solder hybrids (PSH) Dispensable thermal compounds Thermal grease Dielectric pads Thin flexible heat spreaders Custom integrated thermal/EMI assemblies RF absorbing gap filler pads EMI SHIELDING & COMPLIANCE • Conductive elastomers – molded, extruded, and form-in-place (FIP) • Conductive foam based gaskets – fabric-over-foam and z-axis foam • Conductive compounds – adhesives,...

Heat Transfer Fundamentals The objective of thermal management programs in electronic packaging is the efficient removal of heat from the semiconductor junction to the ambient environment. This process can be separated into three major phases: 1. heat transfer within the semiconductor component package; 2. heat transfer from the package to a heat dissipater (the initial heat sink); 3. heat transfer from the heat dissipater to the ambient environment (the ultimate heat sink) The first phase is generally beyond the control of the system level thermal engineer because the package type defines the...

and compressive modulus have a major impact on contact resistance. Because these surface conditions can vary from application to application, thermal impedance of a material will also be application dependent. Thermal Interface Materials (TIMs) Heat generated by a semiconductor must be removed to the ambient environment to maintain the junction temperature of the component within safe operating limits. Often this heat removal process involves conduction from a package surface to a heat spreader that can more efficiently transfer the heat to the ambient environment. The spreader has to be carefully...

between a component and a cold surface is highly variable. They are dispensed onto the component and readily conform over complex geometries and then cured in place. • Low-modulus, ceramic filled compounds • Fill gaps ranging from 0.005 to 0.25 inch without stressing components • Can cure at room temperature • Localized encapsulating of components Insulating Pads CHO-THERM® Insulator Pads Gap Fillers component. THERM-A-GAP™ gap fillers are a family of low modulus (soft), thermally conductive silicone elastomers for applications where heat must be conducted over a large and variant gap between...

Key Properties of Thermal Interface Materials Thermal Properties The key properties of interface materials are thermal impedance and thermal conductivity. Thermal Impedance This is the measure of the total resistance to the flow of heat from a hot surface through an interface material into a cold surface. Thermal impedance is measured according to the ASTM D5470 test method. Although the current version of this method is specific to high durometer insulating pad materials tested at high clamping forces, the method has been successfully adapted for use with low durometer materials as well as fluid...

Stress Relaxation When a compressive load is applied to an interface material, there is an initial deflection followed by a slow relaxation process whereby some of the load is relieved. This process continues until the compressive load is balanced by the cohesive strength of the material. Compression Set Compression set is the result of stress relaxation. After a material has been subjected to a compressive load for an extended time, part of the deflection becomes permanent and will not be recoverable after the load is reduced. Thermal Interface Materials (TIMs) for Consumer Electronics and Information...

THERM-A-GAP™ HCS10,569,570,579 and 580 Thermally Conductive Gap Filler Pads Description THERM-A-GAP™ gap-filler sheets and pads offer excellent thermal properties and highest conformability at low clamping forces. Features / Benefits • Ultra low deflection force • High thermal conductivity • High tack surface reduces contact resistance • “A” version offers high strength acrylic PSA for permanent attachment • UL recognized V-0 flammability • RoHS compliant All products are available on aluminum foil “A’ or on “clean break” glass “G” fiber carrier. As with all previous Chomerics gapfillers, the...

THERM-A-GAPTM HCS10, 569, 570, 579 and 580 Thermally Conductive Pads TYPICAL APPLICATIONS • Telecommunications equipment • Consumer electronics • Automotive electronics (ECUs) • LEDs, lighting • Power conversion • Desktop computers, laptops, servers • Handheld devices • Memory modules • Vibration dampening HANDLING INFORMATION These products are defined by Chomerics as “articles” according to the following generally recognized regulatory definition for articles: An article is a manufactured item “formed to a specific shape or design during manufacturing,” which has “end use functions” dependent...