PAN1326C2 2019

PAN1326C2 2019
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PAN1326C2 2019

Product catalog summary
Overview
The Panasonic PAN1326C2 is a compact Host Controlled Interface (HCI) Bluetooth RF module featuring Texas Instruments' CC2564C Bluetooth core. It is compliant with Bluetooth 4.2, offering superior RF performance and approximately double the range of other Bluetooth Low Energy solutions. The module is designed for easy implementation with a PCB pad pitch of 1.3 mm and is compatible with previous generations of Texas Instruments Bluetooth HCI modules.
Features
  • Bluetooth 4.2 compliant up to the HCI layer
  • Best-in-class RF performance (Tx, Rx sensitivity, blocking)
  • Dimensions: 9.0 mm x 9.5 mm x 1.8 mm
  • Interfaces: UART, GPIO, PCM
Characteristics
  • Receiver sensitivity: -90 dBm
  • Output power: 8 dBm
  • Power supply: 1.7 V to 4.8 V
  • Power consumption: Tx 40 mA, Rx 20 mA
  • Operating temperature range: -40 ºC to 85 ºC
Pin Configuration
The module includes various pins for ground, UART communication, PCM data, and power supply. Key pins include:
  • HCI_CTS: UART clear-to-send
  • HCI_RTS: UART request-to-send
  • HCI_RX: UART data receive
  • HCI_TX: UART data transmit
Engineering Samples and Disclaimer
Engineering samples are provided for evaluation purposes only and may not fully conform to the product specification. Panasonic disclaims liability for any defects or damages resulting from the use of these samples.
Regulatory and Certification Information
The module complies with various international standards, including FCC for the US, ISED for Canada, and European Conformity according to RED (2014/53/EU). It also adheres to RoHS and REACH declarations.
Power Supply
The device requires two power sources: a main power supply for Bluetooth (VDD_IN=VBAT) and a 1.8V I/O ring power source (VDD_IO). It supports three power supply configurations: Full-VBAT, Full-DC2DC, and Mixed DC2DC-VBAT systems, each offering different balances of RF output power and system power efficiency.
Clock Inputs
The module requires an external slow clock with a frequency accuracy of 32.768 kHz ±250 ppm for Bluetooth operation. This clock is essential for starting the internal controller.
Bluetooth Features
The module is Bluetooth 4.2 compliant and supports up to seven active devices, multiple Bluetooth profiles, and enhanced QoS. It can handle multiple connections without affecting performance and includes built-in coexistence and prioritization for BR, EDR, and Low Energy.
Interfaces
Host Controller Interface (HCI): Utilizes a UART module with a maximum baud rate of 4 Mbps. It includes features like hardware flow control and error detection.
Audio/Voice CODEC Interface: Supports various voice coding schemes and includes a PCM interface for codec connections. It is configurable for different data formats and clock operations.
Specifications
All specifications are maintained over temperature and process variations unless otherwise noted.
Default Test Conditions
Temperature is set at 25°C ± 10°C, humidity ranges from 40 to 85% RH, and the supply voltage is 3.3 V.
Absolute Maximum Ratings
These ratings must not be exceeded to avoid permanent damage. Key parameters include VDD_IN at -0.5 to 5.5 V, VDDIO_1.8 V at -0.5 to 2.145 V, and an operating temperature range of -40 to 85°C.
Recommended Operating Conditions
Power supply voltage (VDD_IN) should be between 1.7 and 4.8 V, and I/O power supply voltage (VDD_IO) between 1.62 and 1.92 V. High-level input voltage is 0.65 x VDD_IO to VDD_IO.
Current Consumption
In deep sleep mode, current consumption ranges from 40 to 700 µA, while in active mode, it is 1 mA. During transmit DH5 full throughput, it is 40 mA.
nSHUTD Requirements
Operation mode level is between 1.42 and 1.98 V, and shutdown mode level is 0 to 0.4 V. Minimum time for nSHUT_DOWN low to reset the device is 5 ms.
External Digital Slow Clock Requirements
Input slow clock frequency is 32,768 Hz with an accuracy of ±250 ppm. Input impedance is 1 MΩ.
Bluetooth Specifications
Operation frequency range is 2,402 to 2,480 MHz. Maximum RF output power is 8 to 10 dBm. Sensitivity for GFSK is -87 to -91 dBm.
Reliability Tests
Includes vibration, shock, heat cycle, moisture, low and high temperature tests. Each test has specific conditions such as frequency, amplitude, and duration.
Recommended Soldering Profile
Reflow permissible cycles are 2, and opposite side reflow is prohibited. More than 75% of the soldering area should be coated by solder.
Cautions
  • Design Notes: Ensure compliance with control signals and supply voltage conditions. Avoid mechanical stress and excessive heat. Maintain proper voltage levels and avoid high-frequency interference.
  • Installation Notes: Reflow soldering is limited to twice. Avoid mechanical stress during reflow and ensure proper heat management. Do not wash the product or apply pressure to the metal cover.
  • Usage Condition Notes: Protect against static electricity and avoid using damaged products. Follow power supply ratings and avoid excessive pressure on electrodes.
  • Storage Notes: Avoid mechanical stress and corrosive environments during storage. Maintain temperature and humidity within specified ranges.
  • Safety Cautions: Implement protection circuits to prevent short circuits and ensure system safety.
  • Other Cautions: Do not use the product for unintended purposes and ensure fail-safe functions are in place.
Restricted Use
  • Life Support Policy: The product is not intended for life support systems where failure could result in injury.
  • Restricted End Use: The product is not designed for military or weapon-related applications.
Regulatory and Certification Information
  • FCC for US: The device complies with FCC Part 15 rules. It must not cause harmful interference and must accept interference received. Labeling requirements and antenna restrictions are specified.
  • ISED for Canada: The device complies with Canadian RSS-Gen rules. It must not cause harmful interference and must accept interference received. Specific antenna requirements are outlined.
Labeling Requirements: The OEM must ensure compliance with IC labeling requirements, including a visible label on the OEM enclosure with the Panasonic IC identifier (IC: 216Q-1326C2) for the PAN1326C2 module.
European Conformity: The PAN1326C2 module complies with European standards under the RED (2014/53/EU) directive, including safety, health, EMC, and radio standards. The device must maintain a distance of more than 20 cm from the human body.
Bluetooth Certification: Products integrating the PAN1326C2 must obtain specific Bluetooth IDs. The module meets Bluetooth SIG criteria for labeling as a Bluetooth device.
RoHS and REACH Declaration: Environmental compatibility declarations are available on the Panasonic website.
Appendix:
Ordering Information: The PAN1326C2 module has a minimum order quantity of 1,500 pieces, with samples available on demand.
Contact Details: For sales assistance in the EU and North America, contact details and websites are provided for further inquiries and product information.
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Catalog excerpts

PAN1326C2 2019-1

PAN1326C2 Bluetooth Basic Data Rate and Low Energy Module

 Open the catalog to page 1
PAN1326C2 2019-2

Parasonic PAN1326C2 Bluetooth Module Overview Panasonic's new PAN1326C2 is a Host Controlled Interface (HCI) Bluetooth Radio Frequency (RF) module that brings Texas Instruments Incorporated™ seventh generation Bluetooth core integrated circuit, the CC2564C, to an easy-to-use module format. The PAN1326C2 is Bluetooth 4.2 compliant and it offers best-in-class RF performance with about twice the range of other Bluetooth Low Energy solutions. Panasonic's tiny footprint technology has produced a module of only 85.5 mm2. The module is designed to accommodate PCBs pad pitch of 1.3 mm and as few as two...

 Open the catalog to page 2
PAN1326C2 2019-3

By purchase of any of the products described in this document the customer accepts the document's validity and declares their agreement and understanding of it is contents and recommendations. Panasonic reserves the right to make changes as required at any time without notification. Please consult the most recently issued Product Specification before initiating or completing a design. © Panasonic Industrial Devices Europe GmbH 2019. This Product Specification is copyrighted. Reproduction of this document is permissible only if reproduction is without alteration and is accompanied by all associated...

 Open the catalog to page 3
PAN1326C2 2019-4

Parasonic PAN1326C2 Bluetooth Module Product Specification Rev. 1.1 Page 4

 Open the catalog to page 4
PAN1326C2 2019-6

Parasonic PAN1326C2 Bluetooth Module 1 About This Document 1.1 Purpose and Audience This Product Specification provides details on the functional, operational, and electrical characteristics of the Panasonic PAN1326C2 module. It is intended for hardware design, application and Original Equipment Manufacturer (OEM) engineers. The product is referred to as “the PAN1326C2” or “the module” within this document. Please refer to the Panasonic website for related documents ^ 7.2.2 Product Information. Product Specification Rev. 1.1 Page 6

 Open the catalog to page 6
PAN1326C2 2019-7

PAN1326C2 Bluetooth Module 2 Overview 2 Overview Panasonic’s new PAN1326C2 is a Host Controlled Interface (HCI) Bluetooth RF module that brings Texas Instrument’s seventh generation Bluetooth core integrated circuit, the CC2564, to an easy-to-use module format. The PAN1326C2 is Bluetooth 4.2 compliant and it offers best in class RF performance with about twice the range of other Bluetooth Low Energy solutions. Panasonic’s tiny footprint technology has produced a module of only 85.5 mm². The module is designed to accommodate PCBs pad pitch of 1.3 mm and as few as two layers for easy implementation...

 Open the catalog to page 7
PAN1326C2 2019-8

PAN1326C2 Bluetooth Module 2 Overview The I/O are 1.8 V driven and might need external level shifter and Low-dropout regulator (LDO). The Pin MLDO_OUT cannot be used as reference due to RF internal connection. The total capacity will not exceed 2.8 µF. The total inductance will not exceed 0 nH. There are no voltage multiplying or voltage boosting circuits.

 Open the catalog to page 8
PAN1326C2 2019-9

Parasonic PAN1326C2 Bluetooth Module Product Specification Rev. 1.1 Page 9 I =input, O=output, I/O=bidirectional, P=power, PU=pulled up, PD=pulled down I/O Type: Digital I/O cells, HY=input hysteresis, current=typ. output current No signals are allowed on the I/O pins if no VDD_IO (Pin 22) power supplied, except pin 7, 8, 17-19.

 Open the catalog to page 9
PAN1326C2 2019-10

Parasonic PAN1326C2 Bluetooth Module 2 Overview For RF conducted measurements de-solder the antenna and solder an antenna connector to the hot pin. HCI_CTS is an input signal to the CC2564C device: • When HCI CTS is low: CC2564C is allowed to send data to Host device. • When HCI_CTS is high: CC2564C is not allowed to send data to Host device. 4 I=input, O=output, I/O=bidirectional, P=power, PU=pulled up, PD=pulled down 5 I/O Type: Digital I/O cells, HY=input hysteresis, current=typ. output current Product Specification Rev. 1.1 Page 10

 Open the catalog to page 10
PAN1326C2 2019-11

Parasonic PAN1326C2 Bluetooth Module 2.3 Device Power Supply The PAN1326C2 Bluetooth radio solution is intended to work in devices with a limited power budget such as cellular phones, headsets, handheld PC’s, and other battery-operated devices. One of the main differentiators of the PAN1326C2 is its power management. It is ability to draw as little current as possible. The PAN1326C2 device requires two kinds of power sources: • Main power supply for the Bluetooth (VDD_IN=VBAT) • Power source for the 1.8 V I/O ring (VDD_IO) The PAN1326C2 includes several on-chip voltage regulators for increased...

 Open the catalog to page 11
PAN1326C2 2019-12

PAN1326C2 Bluetooth Module 2 Overview Full-DC2DC system (Lower RF output power, but optimum system power): Mixed DC2DC-VBAT system (Maximum RF output power and optimum system power, but requires routing of VBAT): Clock Inputs The Slow Clock is always supplied from an external source. It is connected to the SLOW_CLK_IN pin number 8 and can be a digital signal with peak to peak of 0 V to 1.8 V. The Slow Clock's frequency accuracy must be 32.768 kHz 250 ppm for Bluetooth usage (according to the Bluetooth specification). The Slow Clock 32.768 kHz is mandatory to start the internal controller; otherwise...

 Open the catalog to page 12
PAN1326C2 2019-13

PAN1326C2 Bluetooth Module 2 Overview Bluetooth Features • • • • • • Support of multiple Bluetooth profiles with enhanced QoS Assisted mode for Handset Profile (HFP) 1.6 Wideband Speech (WBS) profile or Advanced Audio Distribution Profile (A2DP) profile to reduce host processing and power Bluetooth 4.2 compliant up to the HCI layer Built-in coexistence and prioritization handling for BR, EDR, and Low Energy Up to seven active devices Scatternet: up to three piconets simultaneously, one as master and two as slaves Up to two Synchronous Connection Oriented (SCO) links on the same piconet Support...

 Open the catalog to page 13
PAN1326C2 2019-14

PAN1326C2 Bluetooth Module 2 Overview Flow control is obtained by the following: When the UART RX buffer of the CC2564C passes the “flow control” threshold, it will set the signal UART_RTS high to stop transmission from the host. When the signal UART_CTS is set high, the CC2564C will stop it is transmission on the interface. In case HCI_CTS is set high in the middle of transmitting a byte, the CC2564C will finish transmitting the byte and stop the transmission. Audio/Voice CODEC Interface The codec interface is a fully-dedicated programmable serial port that provides the logic to interface to...

 Open the catalog to page 14

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.