Device-related systems Device bonder •High quality bonding ( High Accuracy , Epoxy Quality etc. ) contributes to valuable devices production. •Multi small die stacking capability contributes to downsizing of valuable devices. •Variety of Epoxy-supplying method ( Writing, Stamping, Dual Epoxy etc. ) contributes to flexible production. •Flip chip and thermosonic bonding capabilities contribute to higher densification and performance for valuable devices. *It may not conform to Machinery Directive and EMC Directive in case of optional configuration and custom-made specification. Model No. Productivity *1 Placement accuracy *1 0.56 s / IC ( Under the fastest conditions ) 0.75 s / IC for thermosonic bonding ( Including process time of 0.2 seconds. Under the fastest conditions ) XY ( 3σ at Panasonic conditions ) : ±7 µm ( Flip bonding ) , ±15 µm ( With pre-centering ) , ±25 µm（Direct bonding ) Substrate dimensions Number of die types Die supply Up to 12 types ( For AWC ) / UP to 10 types ( Tray with the palette changer ) / Up to 5 types ( Wafer frame with the palette changer ) Wafer frame , Pre-expanded ring , Tray Adhesive dispenser Air-powered writing , Stamping pin Bonding load Pneumatic head : 0.5 N to 10 N ( Option : 1 N to 50 N ) VCM head for thermosonic process : 1 N to 50 N ( Option : 2 N to 100 N ) Head heating Constant heating , Up to 250 ℃ for the pneumatic head , Up to 300 ℃ for the VCM head Constant heating , Up to 300 ℃ Substrate heating Number of nozzle Power source Up to 24 nozzles ( Pickup nozzle, Bonding nozzle, Stamping tool ) ( Not available for the thermosonic nozzle ) 3-phase AC 200 V ±10V , 50 / 60 Hz , Up to 4 kVA（Up to 7 kVA for heating specification ) Pneumatic source 0.5 MPa , 30 L / min ( A.N.R. ) ( Up to 150 L / min for full-featured machine including cooling air ) Standard specification ( Up to 200 mm substrate length. Including loader / unloader ) W 1 950 mm × D 1 190 mm × H 1 720 mm ( Machine body : W 1 190 mm × D 1 190 mm × H 1 720 mm ) 2 200 kg ( Including loader / unloader ) Please refer to the specifications on details. *1：The described productivity and placement accuracy may differ depending on the conditions of use. *2：Three pha

Unit Level Manufacturing by the Synchro-motion of Dispensing and Bonding Die bonding is carried out immediately after Epoxy dispensing , thereby making it possible to finish the bonding operation before the Epoxy is deteriorated over time. ■Process Flow Diagram Camera Epoxy dispensing head Auto Production Screen Example display of inspection results This realizes stable and high quality bonding at all bond positions on a substrate. Also, the Bonding Stage Camera enables pre-bonding inspection right after Epoxy dispensing and post-bonding inspection right after the bonding of a die ( Option )....