IC Assembly System catalog Plasma cleaner ● Surface cleaning and modification of wafers and substrates improve bondability of metal and adhesion of resin. ● Increasing process number of wafers and substrates in the same time by enlarging vacuum chamber capacity improves productivity. ● Panasonic original plasma monitoring system suppresses abnormal discharge and newly introduced traceability function ensures process quality ● Flexible machine concept adapts versatile production model and supports process operation. ● Capability of Φ300mm wafer (with/without : dicing ring) contributes to wafer level package manufacturing. For substrate & wafer level PKG *There are cases the options and customer’s specifications don’t apply for machinery directive and EMC directive Cleaning Method Parallel plate RF back-sputtering method Power source Pneumatic source *4 Specification （Target work） ※Please refer to the specifications on details ※Pre-confirmation by customer's works is required. Wafer with dicing ring If the optional oxygen gas is selected as electric discharge gas, nitrogen gas is also required to dilute exhaust Excluding touch panel, emergency stop switch and signal tower. In case of full option Please select a specification among three Please consult us about the substrate thickness Please contact us for the substrate with depth < 30mm outer diame

Achieve high quality production by plasma cleaning and modification from wafer level to substrate level assembly process Wafer Level Process Substrate Level Process Without ring With ring Substrate and Tray Mold From front process Residue Solder ball RDL Contamination Rewiring / Mold Grinding / Ball attach Back grinding Flip chip bonding Before insulation layer coating ・ Improve adhesiveness of wafer After RDL on insulation layer ・ Remove the residue after photolithography Before ball attach After dicing ・ Improve bonding quality of pad Pad cleaning / Surface activation ・ Improve wirebondability...