Plasma Cleaner PSX307
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Catalog excerpts

IC Assembly System catalog PLASMA CLEANER High Productivity Plasma Cleaner with 1.5 Times The Productivity Model ID Model No. Cleaning Methed Gas for Electrical Discharge*1 Substrate Dimensions Substrate Thickness Dimensions / Mass *3 Power Source *4 Pneumatic Source Super cost saver PSX307 NM-EFP1A Parallel plate RF back-sputtering method Ar [option:O2] L 50 mm X W 20 mm to L 250 mm X W 75 mm*2 incl. S type option L 50 mm X W 20 mm to L 330 mm X W 120 mm incl. M type option 0.5 mm to 2.0 mm W 930 mm X D 1100 mm X H 1 450 mm / 555 kg W 1 764 mm X D 1 100 mm X H 1 450 mm / 850 kg incl. S type option W 1 764 mm X D 1 100 mm X H 1 450 mm / 770 kg incl. M type option 1-phase AC 200 V, 2.00 kVA [Full Load 5.00 kVA] 0.49 MPa or more, 6.5 L/min [A.N.R.] *Please refer to the specifications on details. *1: If the optional oxygen gas is selected as a discharge gas, nitrogen gas is also required to dilute exhaust. *2: For W 70.1mm to W 75mm, the electrode in the chamber is required separately. *3: Tolerance of equipment dimensions is ±5mm, Touch panel and condition lamp is not included. Mass varies depending on configuration. *4: Compatible with 1-phase 208/220/230/240 V

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Our Solutions, Your Value The reason why an extra-thin gold plated electrode can be used When a extra-thin gold plated electrode is used, nickel compounds are formed on a surface after the heat treatment by the die-bonding cure. These nickel compounds impair the wire bonding performance, thus it is said that a thin gold plated electrode is unsuitable for wire bonding. However, the argon plasma treatment eliminates the nickel compounds, therefore stable wire bonding can be performed on an extra-thin and extra-cheap gold plated electrode. When you use the following patents (process patents or...

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