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Panasonic IPAC

Product catalog summary

Overview: The Integrated Process Assembly Cell (IPAC) by Panasonic Factory Solutions Company is a continuously configurable manufacturing line that integrates Surface Mount Technology (SMT) and microelectronics. It is designed to maximize manufacturing flexibility and efficiency within a compact footprint.

Key Features:

Configurable Modules: Includes Die Attach/Flip Chip, Dispenser, Chip Shooter, and Odd Form modules, allowing for versatile production capabilities.
Compact Design: Occupies less than one meter of space, featuring dual lanes with four placement stages and dual gantry robot heads.
High Throughput and Accuracy: Offers high throughput rates and precise placement accuracy across various modules.
Modular and Upgradeable: Designed to meet current and future production needs with upgradeable technology.

Specifications:

Die Attach/Flip Chip: Throughput of 5,000 UPH, accuracy of ± 25 µm, and die size range of 1–35 mm.
Dispenser: Throughput of 4,000 UPH, accuracy of XY ± 381 µm, and substrate size of 15–55 mm.
Chip Shooter and Odd Form: Throughput of 36,000 CPH, accuracy of ± 75 µm, and component size range from 0201 to 6 x 6 mm.

Benefits:

Maximized Area Productivity: Efficient use of space with dual lane handling and alternating lane placement sequencing.
Global Efficiency: Common spare parts and operator interfaces enhance global operational efficiency.
Low Cost of Ownership: Designed for a long functional life and cost-effective operation.

Contact Information: For more details, contact Panasonic Factory Solutions Company at 847-468-4000 or visit www.panasonicfa.com.

Catalog excerpts

integrated process assembly cell Maximize Area ProductivityGlobal Efficiency withCommon Spare Parts and Operator I/F Upgradeable for FutureRequirements >

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integrated process assembly cell Fulfills Your Equipment Modularity Needs Configurable modules provide versatile, upgradeable technology for todays and tomorrowҒs products. Dual Lane with 4 Placement StagesՕDual Gantry (2 X Linear Motors, 2 Y Ball Screw Motors)Dual Robot HeadsՕLeft to Right Carrier FlowAlternating Lane PlacementSequence (No Transfer Time)ՕFront Access for Parts Supply (T & R, Tray, WDE)Dual Combo Camera betweenPlacement Stage and Parts Supply IPAC Ֆ Integrated Process Assembly Cell Chip Shooter: NM-MH00Odd Form: NM-MH10Die Attach: NM-MH50 Flip Chip: NM-MH60Dispenser Underfill:...

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Chip Shooter and Odd Form Throughput:36,000 CPH6,000 UPH Specifications Dispenser Specifications Die Attach/Flip Chip Throughput:4,000 UPHAccuracy:XY381 ѵm| Z16 ѵmDie Size:135 mmSubstrate Size:15֖55 mmCarrier Size:max 146x323 mm Work Temp.:70120ְC Specifications Throughput:5,000 UPHAccuracy:25 ѵm10 ѵm/C4 :0.5豰Die Size:135 mmDie Thickness:50 ֵm850 ֵmCarrier Size:max 146x323 mmForce:(0.22 kgf) > (Odd Form) Accuracy:ֱ75 m ~ ո:4.0Ѱ 127 ѵm > (Odd Form) :0.5豰Comp. Size:0201 (0603 metric) to 6x6 mm 250 mm Function and Units Head: Underfill Dam and fill Flux sprayCamera:2D PCB cameraHeight Measuring...

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