integrated process assembly cell Maximize Area ProductivityGlobal Efficiency withCommon Spare Parts and Operator I/F Upgradeable for FutureRequirements >

integrated process assembly cell Fulfills Your Equipment Modularity Needs Configurable modules provide versatile, upgradeable technology for todays and tomorrowҒs products. Dual Lane with 4 Placement StagesՕDual Gantry (2 X Linear Motors, 2 Y Ball Screw Motors)Dual Robot HeadsՕLeft to Right Carrier FlowAlternating Lane PlacementSequence (No Transfer Time)ՕFront Access for Parts Supply (T & R, Tray, WDE)Dual Combo Camera betweenPlacement Stage and Parts Supply IPAC Ֆ Integrated Process Assembly Cell Chip Shooter: NM-MH00Odd Form: NM-MH10Die Attach: NM-MH50 Flip Chip: NM-MH60Dispenser Underfill:...

Chip Shooter and Odd Form Throughput:36,000 CPH6,000 UPH Specifications Dispenser Specifications Die Attach/Flip Chip Throughput:4,000 UPHAccuracy:XY381 ѵm| Z16 ѵmDie Size:135 mmSubstrate Size:15֖55 mmCarrier Size:max 146x323 mm Work Temp.:70120ְC Specifications Throughput:5,000 UPHAccuracy:25 ѵm10 ѵm/C4 :0.5豰Die Size:135 mmDie Thickness:50 ֵm850 ֵmCarrier Size:max 146x323 mmForce:(0.22 kgf) > (Odd Form) Accuracy:ֱ75 m ~ ո:4.0Ѱ 127 ѵm > (Odd Form) :0.5豰Comp. Size:0201 (0603 metric) to 6x6 mm 250 mm Function and Units Head: Underfill Dam and fill Flux sprayCamera:2D PCB cameraHeight Measuring...