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Panasonic FCB3
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Catalog excerpts

Panasonic FCB3 - 1

Accuracy of 3 յ m/3 o High-speed mounting at 1.8 s/chipՕ Adaptable to a wide variety of production styles The bonding head unit and die supply system are modular so that futurechangeovers to the latest process requirements will be easierՕ The clean running design and front-supply system for 300 mm wafers facilitate production changeover > MODEL NUMBERAPPLICABLE SUBSTRATE SIZE APPLICABLE IC SIZE DRY CYCLE TIME BONDING ACCURACY IC SUPPLY METHOD NM-SB50A50 mm square to 330 x 250 mm1 mm square to 20 mm square1.8s/IC 3 m/3Up to 300 mm (12 inch) diameter2 inch square, 4 inch square5 N~ 490 Nup to 500հ C 1,635 mm1,980 mm1,800 mm Wafer supply Tray supply BONDING PRESSUREBONDING HEAD TEMPERATUREDIMENSIONS W D H FCB3 size="-4">

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All Panasonic Factory Automation Company catalogs and technical brochures

  1. NPM-TT2

    2 Pages

  2. SP series

    8 Pages

  3. NPM-W2

    4 Pages

  4. MD-P200

    2 Pages

  5. JV131

    2 Pages

  6. RG131

    2 Pages

  7. NPM-VF

    2 Pages

  8. MD-P300

    2 Pages

  9. PSX307

    2 Pages

  10. PSX307A

    2 Pages

  11. AV132

    2 Pages

  12. NPM SERIES

    12 Pages

  13. UA3P

    4 Pages

  14. AM100

    5 Pages

  15. NPM-VF

    2 Pages

  16. MD-P300

    2 Pages

  17. PSX307

    2 Pages

  18. SP Series

    8 Pages

  19. APX300

    2 Pages

  20. CM602

    2 Pages

  21. NPM-W2

    4 Pages

  22. NPM-D3

    4 Pages

  23. RG131

    2 Pages

  24. SP70

    2 Pages

  25. RL132

    2 Pages

  26. JV131

    2 Pages

  27. NPM D2

    4 Pages

  28. AV132

    2 Pages

  29. PSX800

    2 Pages

  30. E600

    9 Pages

  31. MD-P200

    2 Pages

  32. 20261

    2 Pages

  33. NPM-TT

    2 Pages

  34. NPM_W

    2 Pages

  35. NPM

    4 Pages

Archived catalogs

  1. AM100

    8 Pages

  2. PSX307

    2 Pages

  3. UA3P

    2 Pages