Panasonic CM602
4Pages

Catalog excerpts

Values such as maximum speed and placement accuracy may vary depending on operating conditions. Please refer to the specification booklet for details. *1: Compatible with 220/380/400/420/480 V *2: Only for main body *3: Dimension D including direct tray feeder: 2,565 mm *4: Excluding monitor and signal tower *5: Standard configuration: excluding batch exchange cart and tray feeders. This may differ depending on configuration. *6: The 0402 chip requires a specific nozzle/feeder CM602-L Modular High-speed Multi-functional Placement Machine • One platform solution for any kind of production • APC-capable (Adaptive Process Control)—adapting placement of 01005s down to 1.6mil spacing • Linear motor drive increases reliability and reduces maintenance • Compatible with other CM-series equipment Electronic Assembly Mounting System High-speed head (12 nozzles) CM602-L MODEL NO. NM-EJM8A PCB DIMENSIONS Min L × W to 50 mm × 50 mm Max L × W 510 mm × 460 mm HEAD TYPE HIGH-SPEED (12 Nozzles) HIGH-FLEXIBILITY (8 Nozzles) MULTI-FUNCTION (3 Nozzles) Maximum speed 0.036 s/chip (for Type A-2 head) 0.048 s/chip (for Type A-0 head) 0.18 s/QFP (for Type B-0 head) Placement accuracy ±40 ìm/chip (Cpk1) ±40 ìm/chip, ±35 ìm/QFP 24 mm to 32 mm ±50 ìm/QFP <24 mm (Cpk1) ±35 ìm/chip (Cpk1) COMPONENT DIMENSIONS (mm) 0402 (01005") chip*6 to L 12 x W 12 0603 (0201") chip to L 32 x W 32 0603 (0201") chip to L 100 x W 90 PCB EXCHANGE TIME 0.9s (Board length up to 240 mm under optimum conditions) ELECTRIC SOURCE*1 3-phase AC 200 V, 4.0 kVA PNEUMATIC SOURCE*2 0.49 MPa, 170 L/min (A.N.R.) DIMENSIONS*2 W 2,350 mm D 2,290 mm*3 H 1,430 mm*4 MASS*5 3,400 kg

Open the catalog to page 1

Head Options High-speed 12 nozzle head • Measures actual chip thickness • Maintains constant placement force, preventing chip cracking • Verifies chip placement Compact Feeder Cart • 200 mm feeder cart size decrease • Compact cart compatible with existing feeder carts. Both cart types can be used at the same time. *Installed high-speed software. NM-EJM8A is standard. NM-EJM4A is optional. Maximum Speed (Type A-2) 0.036 s/chip 100,000 cph* • New high-speed head (12 nozzles) provides super high-speed placement of microchips • Main body has space-saving small footprint • 166% higher...

Open the catalog to page 2

Placement Quality Enhancement High-speed POP placement using transfer units (optional) High-speed POP Placement • Placement speed 0.65 s/chip Mid-sized Large Micro-chips Components Components High-speed Head High-flexibility Head Multi-functional Head (12 nozzles) (8 nozzles) (3 nozzles) Board Warp Sensing • The optimum placement height is controlled by measuring board warp. 3D Sensor • Detects all leads of components; i.e., QFP, SOP, SOJ • High-speed detection via batch scanning • Detects solder ball position and measures ball height Ball lacking CSP BGA.CSP Batch transfer for 8 components...

Open the catalog to page 3

Component Types: Up to 216 (8 mm double tape feeder) © Copyright 2005, 2008 Panasonic Corporation of North America. All rights reserved. Changes may be made without notice to specifications and appearance for product improvement. EAG013.02 Panasonic Factory Solutions Company of America 1-847-495-6100 PFSAmarketing@us.panasonic.com panasonicfa.com Safety Caution: To ensure safety when using this equipment, all work should be performed in accordance with the supplied operating instructions. Thoroughly read your operating instructions manual. CM602-L GHG Factor 1.6 Resource Factor 2.1 (Ref....

Open the catalog to page 4