NPM-W2
4Pages

Front head Lightweight 16-nozzle head 12-nozzle head Lightweight 8-nozzle head 3-nozzle head V2 Dispensing head Inspection head No head Single-lane *1 Electronics Assembly System Electric source Pneumatic source *2 Dimensions *2 Mass Placement head Lightweight 16-nozzle head 12-nozzle head Lightweight 8-nozzle head 3-nozzle head V2 PRODUCTION MODULAR N M - E J M7D -D N M - E J M7D -MD N M - E J M7D -A N M - E J M7D -MA N M - E J M7D N M - E J M7D -D Batch mounting L 50 mm × W 50 mm ∼ L 750 mm × W 550 mm 2-positin mounting L 50 mm × W 50 mm ∼ L 350 mm × W 550 mm Dual transfer Batch） L 50 mm × W 50 mm ∼ L 750 mm × W 260 mm Dual transfer 2-positin）L 50 mm × W 50 mm ∼ L 350 mm × W 260 mm （ （ Single transfer Batch） L 50 mm × W 50 mm ∼ L 750 mm × W 510 mm Single transfer 2-positin） L 50 mm × W 50 mm ∼ L 350 mm × W 510 mm （ （ 3-phase AC 2 0 0、220、380、400、420、480 V 2 . 8 kVA 0.5 MPa、200 L /min（A.N.R.） W 1 280 mm *3 × D 2 332 mm *4 × H 1 444 mm *5 2 470 k g （Only for main body:This differs depending on the option configuration.） Lightweight 16-nozzle head Per head ） （ High production mode[ON] High production mode[OFF] High production mode[ON] High production mode[OFF] Lightweight 8-nozzle head （ Per head ） Component dimensions（mm） 0402 *7 chip ∼ L 6 × W 6 × T 3 03015*7 *8/0402*7 chip ∼ L 6 × W 6 × T 3 0402*7 chip ∼ L 12 × W 12 × T 6.5 Tape：4 / 8 / 12 / 16 / 24 / 32 / 44 / 56 mm Taping Max.120 （Tape: 4、8 mm ） Component supply ±30 μm/ chip ±30 μm/QFP ±50 μm/QFP 3-nozzle head V2 （ Per head ） 8 320cph （0.433 s/ chip） （0.554 s/ Q F P） 6 500cph 0402*7 chip ∼ L 32 × W 32 × T 12 0603 chip to L 150 × W 25 (diagonal152) × T 30 Tape : 4 to 56 mm Tape : 4 to 56 / 72 / 88 / 104 mm Front/rear feeder cart specifications：Max.120（ Tape width and feeder are subject to the conditions on the left） Single tray specifications：Max.86（ Tape width and feeder are subject to the conditions on the left） Twin tray specifications：Max.60（ Tape width and feeder are subject to the conditions on the left） Front/rear feeder cart specifications：Max.30（ Single stick feeder） Single tray specifications：Max.21（ Single stick feeder） Twin tray specifications：Max.15（ Single stick feeder） Manufacturing Process Innovation Single tray specifications：Max.20 Twin tray specifications：Max.40 Dot dispensing Draw dispensing Dispensing head 0.16 s/dot（Condition : XY＝10 mm, Z＝less than 4 mm movement, No θ rotation） 4.25 s/component（Condition: 30 mm x 30 mm corner dispensing）*9 Dispensing speed ± 100 μ m/component Adhesive position accuracy Cpk≧1） ± 75 μ m/dot （ BGA、 CSP Applicable components 1608 chip to SOP,PLCC,QFP,Connector,BGA,CSP Inspection head 2D inspection head （A） 2D inspection head （B） Resolution 18 μm 9 μm View size 21.1 mm × 17.6 mm 44.4 mm × 37.2 mm Inspection Solder Inspection*10 0.35s/ View size processing Component Inspection*10 0.5s/ View size time Chip component：100 μm × 150 μm or more（0603 or more） Chip component：80 μm × 120 μm or more（0402 or more） Solder Inspection Inspection *10 Package component：φ150 μm or more Package component： φ120 μm or more object Square chip (0402 or more), SOP, QFP (a pitch of 0.3 mm or more), Component Square chip (0603 or more), SOP, QFP (a pitch of 0.4 mm or more), Inspection *10 CSP, BGA,Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector *11 CSP, BGA,Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector *11 Inspection Solder Inspection*10 Oozing, blur, misalignment, abnormal shape, bridging items Component Inspection*10 Missing, shift, flipping, polarity, foreign object inspection *12 Inspection position accuracy（ Cpk≧1）*13 ± 20 μm ± 10 μm Solder Inspection*10 Max. 30 000 pcs./machine（ No. of components：Max. 10 000 pcs./machine） No. of inspection Component Inspection*10 Max. 10 000 pcs./machine * Placement tact time,inspection time and accuracy values may differ slightly depending on conditions *Please refer to the specification booklet for details. *1：Please consult us separately should you connect it to NPM-D3/D2/D. It cannot be connected to NPM-TT and NPM. *2 : Only for main body *3 : 1 880 mm in width if extension conveyors (300 mm) are placed on both sides. *4：Dimension D including tray feeder : 2 570 mm * 9：A PCB height measurement time of 0.5s is included. Dimension D including feeder cart : 2 465 mm *10：One head cannot handle solder inspection and *5：Excluding the monitor, signal tower and ceiling fan cover.    component inspection at the same time. *6：±25 μm placement support option. Under conditions specified by Panasonic） （ *11：Please refer to the specification booklet for details. *7：The 03015/0402 chip requires a specific nozzle/feeder. *12：Foreign object is available to chip components.（Excluding 03015 mm chip） *8：Support for 03015 mm chip placement is optional. *13：This is the solder inspection position accuracy   （Under conditions specified by Panasonic：Placement accuracy ±30 μm / chip）    measured by our reference using our glass PCB for    plane calibration. It may be affected by sudden    change of ambient temperature. Safety Cautions ●Please read the User's Manual carefully to  familiarize yourself with safe and effective  usage procedures. ● To ensure safety when using this equipment, all work should be  performed according to that as stated in the supplied Operating  Instructions. Read your operating instruction manual thoroughly. Panasonic Group products are built with the environment in mind. Inquiries… Model Name Please check the homepage for the details. panasonic.com/global/corporate/sustainability Panasonic Corporation Process Automation Business Division 3-1-1 Inazu-cho, Toyonaka City, Osaka 561- 0854, Japan TEL +81-6-6866- 8675 FAX +81-6-6862-