NPM SERIES
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Any-mix manufacturing Greater versatility, solution for evolving unparalleled accuracy assembly needs and increased efficiency NPM-X Series NPM Series The next-generation platform for World-class, award-winning any mix, any volume manufacturing platform

NPM-Series Design concept The global acceptance of the award-winning NPM platform is based on its inherent flexibility. Each is a completely integrated, single-platform solution that can expand and evolve with your manufacturing needs. When requirements change, simply swap heads to add new functionality and provide investment protection. As always, manufacturers can scale NPM lines to meet production needs now and add new technologies later. Plug & Play heads spanning from high speed to multifunction placement, dispense and inspection can be reconfigured in approximately 15 minutes –...

NPM-W2 With duaL-gantry functionality The broader capacity dual-beam NPM-W2 amplifies the NPM-W with a 10% throughput and 25% accuray improvement and integrates our award-winning Multi Recognition Camera. Combined, these features extend the component range from 03015mm microchips to 6" long connectors up to 40mm tall. • Combine various new light-weight version high-speed and flexible multi-function head options to handle nearly any application, including large, odd-form parts like snap-fit connectors requiring upwards of 100N placement force • Setup multiple products with 120 reels on...

NPM-D3 With multi-recognition camera The compact, dual-beam NPM-D3 offers a reinforced frame, advanced head and award-winning multirecognition camera improve placement accuracy by 25%, while boosting IPC-9850 throughput 30% to 38,078 CPH per square meter. Features and benefits • Flexible board handling system converts to support single and multiple dual-lane operation modes • Compact footprint and dual-side operation maximizes factory floor space utilization and scalability • Integrates the industry's only field-scalable multirecognition camera that combines alignment, thickness and 3D...

Electronics assembly includes several processes to ensure high-quality, which historically meant investing in standalone equipment for placement, dispensing and inspection. Today, our NPM Series provides multiple assembly processes. More than a placement machine, you can configure the platform with heads for component placement and material dispensing - even combinations. In one single platform, it is a true lean solution - doing more with less and improving your return on investment. NPM-Series award-winning features Placement heads An array of component placement head variations are...

> PROCESS CAPABILITY CONTINUED Package on package As part of our industry-leading patent list, we continuously pioneer new technologies and techniques. Panasonic helped establish the PoP assembly process over a decade ago. Since then, PoP has matured and many designers are adopting it to drive miniaturization, lower costs and improve performance. Panasonic has the ability to guide the industry with manufacturing best practices gleaned from being a global manufacturing leader. • 3D component and feature inspection boosts production yields • Plug-and-play Multi-function Transfer Unit (MTFU)...

Intelligent tape feeders • Common with the AM, CM and NPM Series • Adjustable-width feeders reduce investment • Auto-calibration technology • Closed-loop splice detection • Hot-swappable during production • Up to 104mm tape width including thin 8mm and 4mm • Auto-loading, splice-free 8mm paper tape feeder* • Deep pocket and large reel options Support station box • Guides operator through setup • Reduces changeover time with off-line feeder cart setup • Combine with PanaCIM Material Verification for accurate setup Intelligent stick feeder • Common with the AM, CM and NPM Series •...

New, evolutionary, multi-recognition camera is the first field-scalable system to combine three unique imaging capabilities - complete with fast, accurate, 3D coplanarity measurement. Vision-based NPI tools Competitive pressures, cost challenges and increased customer expectations are driving improvements in the way manufacturers develop and introduce products to the market. Whether cultivating internally-born ideas as an OEM or responding to customer requirements as an EMS, the new product introduction process is mission-critical to speed up time-to-market and your company's success....

Single-lane board handling Innovation beyond traditional board handling brings additional features, including multi-board staging for smaller boards and board shuffling for LED luminaries nearly 48" long. Automated board support • Programming data automatically positions support pins • Eliminates manual pin placement errors • Reduces changeover time Long-board handling • Process 1,200mm long LED panels without sacrificing ability to handle smaller boards Independent changeover Previously, changeover required that all production be completed before an operator could begin a changeover...

Software and programming Data Generation System AWARD WINNER DGS (Data Generation System) is our intuitive, PC-based programming software. Taking line balance into consideration, it assigns parts from CAD data, optimizes them and then creates the line placement program. Circuits Assembly NPI Award Production Solution Multi-CAD import Global SMT & Pkg Technology Award Best Product, Americas • Retrieves data and allows properties like polarity and position to be verified on-screen Component library • Registers and unifies component mount data • Large library of standard component definitions...

Solutions Providing worldclass solutions for industrial, communications, automotive and more...regardless of company size Printing solutions The rapid growth of electronic devices is driving manufacturers to expand and update facilities or assets, implementing new processes and reducing costs. A balance between costs and output must be struck while maintaining quality. A trending option is low-cost printing material; however, process stability is key. • Twice the positional accuracy of competitive offerings, 5 microns at 6σ (±3σ) ≥2.0 Cpk • Robust to use low-cost materials and...