IC Assembly System catalog Flip chip bonder ● Contributing to cost-effective production ( high yield, high throughput) of high value-added devices ● Easy bonding tool exchange by customer for process exchange ● Achieving high-speed and high-accuracy bonding through low-gravity point and weight saving of bonding head ● Flip chip bonder for φ300mm wafer supply C4 0.65s/IC ： （including dipping motion） Thermosonic 0.65s/IC , ： （including US process time of 0.2s） Substrate dimensions Up to 12 product types (AWC specifications) Wafer frame 12 inches （Option 8 inches） ： Bonding load Head heating Substrate heating *2 Power source Pneumatic source Constant heating, Up to 200℃ （Heating bonding stage specifications:Max. substrate size L 330 mm × W 220 mm） 3-phase AC 200V ± 10V, 50/60 Hz, Up to 4 kVA （Up to 7 kVA for heating specification） 0.4 Mpa, 50L/min A.N.R.）Up to 150 L/min for full-featured machine including cooling air） （ （ W 1 380 mm × D 1 640 mm × H 1 430 mm without loader / unloader） （ 2 300 kg without loader / unloader） （ *1:The described productivity and placement accuracy may differ depending on the conditions of use. *2:Maximum setting temperature differ depending on the maximum substrate size. Please contact us individually. *3:3-

Easy process exchange Real-time Inspection Bonding processes are available by switching the bonding tools, which can be done by the customer under the configuration of C4 dipping unit. Bonging load 50 N Type The Bonding stage camera enables post-bonding inspection right after the die bonding. (OP) This system allows you to realize manufacturing with real-time quality-inspection. 3 ●Process flow Diagram Bonding stage camera Bonding tool ●Auto production Screen Example display of inspection results ①Recognition of bonding position ②Die bonding ③Post-bonding inspection Pitch-by-pitch movement ④Recognition...