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MD-P300

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MD-P300

Product catalog summary

Specifications Overview:

Model: MD-P300, Model No. NM-EFF1C
Productivity: C4: 0.67s/IC, Thermosonic: 0.70s/IC
Placement Accuracy: ±5 µm (3σ at PFSC conditions)
Substrate Dimensions: L 50 mm × W 50 mm to L 330 mm × W 330 mm
Die Dimensions: L 1 mm × W 1 mm to L 25 mm × W 25 mm
Number of Die Types: Up to 12
Die Supply: Wafer frame 12 inches (Options: 6 inches, 8 inches)
Bonding Load: VCM head: 1N to 50N (Option: 2N to 100N)
Head Heating: Thermosonic up to 300℃
Substrate Heating: Constant heating up to 200℃
Power Source: 3-phase AC 200V ± 10V, 50/60 Hz, Up to 4 kVA
Pneumatic Source: 0.5 Mpa, 30L/min
Dimensions: W 1380 mm × D 1640 mm × H 1430 mm
Mass: 2300 kg

Key Features:

Cost-effective production with high yield and throughput.
Easy bonding tool exchange for process flexibility.
High-speed and high-accuracy bonding through optimized design.
Flip chip bonder suitable for φ300mm wafer supply.
Real-time quality inspection with bonding stage camera.

Procedures and Recommendations:

Bonding processes can be switched by the customer using the C4 dipping unit.
Post-bonding inspection is enabled immediately after die bonding.
Graphics screens guide users through the process with intuitive teaching.
Ultrasonic monitoring data can be viewed in real-time for process parameters.

Environmental and Safety Standards:

Built with environmental considerations, adhering to ISO 14001:2004 standards.
Users are advised to read the User's Manual for safe and effective usage.

Contact Information:

Panasonic Factory Solutions Co., Ltd., Micro Electronics Division
Address: 1375 Kamisukiawara, Showa-cho, Nakakoma-gun, Yamanashi 409-3895, Japan
Phone: +81-55-275-9061
Fax: +81-55-275-9381

Catalog excerpts

2015 1C Assembly System catalog FLIP CHIP BONDER • Contributing to cost-effective production ( high yield, high throughput) of high value-added devices • Easy bonding tool exchange by customer for process exchange • Achieving high-speed and high-accuracy bonding through low-gravity point and weight saving of bonding head • Flip chip bonder for $300mm wafer supply *1:The described productivity and placement accuracy may differ depending on the conditions of use. *2:Maximum setting temperature differ depending on the maximum substrate size. Please contact us individually. *3:3-phase 208 / 220 / 380 / 400 / 415 / 480 For details, please refer to the specification sheet.

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Easy process exchange Real-time Inspection Bonding processes are available by switching the bonding tools, which can be done by the customer under the configuration of C4 dipping unit. Bonging load 50 N Type The Bonding stage camera enables post-bonding inspection right after the die bonding. (OP) This system allows you to realize manufacturing with real-time quality-inspection. 3 ●Process flow Diagram Bonding stage camera Bonding tool ●Auto production Screen Example display of inspection results ①Recognition of bonding position ②Die bonding ③Post-bonding inspection Pitch-by-pitch movement ④Recognition...

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.

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