IC Assembly System catalog Device bonder ● High quality bonding (High Accuracy , Epoxy Quality etc.) contributes to valuable   devices production. ● Multi small die stacking capability contributes to downsizing of valuable devices. ● Variety of Epoxy-supplying method (Writing , Stamping , Dual Epoxy etc.)   contributes to flexible production. ●Flip chip and thermosonic bonding capabilities contribute to higher densification and performance for valuable devices. Model ID Model No. Productivity *1 Placement accuracy *1 Substrate dimensions Die dimensions Number of die types Die supply Adhesive dispenser Bonding load Head heating Substrate heating Number of nozzle Power source *2 Pneumatic source Dimensions Mass MD-P200 NM-EFD1B 0.56 s / IC （Under the fastest conditions） （Including process time of 0.2 seconds. Under the fastest conditions） 0.75 s / IC for thermosonic bonding XY 3σ at PFSC conditions） （ ： ±7 µm （Flip bonding）±15 µm , （With pre-centering） µm , ±25 （Direct bonding） L 50 mm × W 30 mm to L 280 mm × W 140 mm （For thermosonic : L 200 mm × W 150 mm） L 0.25 mm × W 0.25 mm to L 6 mm × W 6mm Up to 12 types （For AWC）UP to 10 types Tray with the palette changer） / （ / Up to 5 types Wafer frame with the palette changer） （ Wafer frame, Pre-expanded ring, Tray Air-powered writing, Stamping pin, Pneumatic head : 0.5 N to 10 N （Option : 1 N to 50 N） VCM head for thermosonic process : 1 N to 50 N （Option : 2 N to 100 N） Constant heating, Up to 250℃ for the pneumatic head, Up to 300℃ for the VCM head Constant heating, Up to 300℃ （ （ Up to 24 nozzles Pickup nozzle, Bonding nozzle, Stamping tool）Not available for the thermosonic nozzle） 3-phase AC 200 V ±10V, 50 / 60 Hz, Up to 4 kVA Up to 7 kVA for heating specification） （ （ 0.5 MPa, 30 L / min A.N.R.）Up to 150 L / min for full-featured machine including cooling air） （ Standard specification Up to 200 mm substrate length. Including loader/unloader） （ （Machine body : W 1 190 mm × D 1 190 mm × H 1 720 mm） W 1 950 mm × D 1 190 mm × H 1 720 mm 2 200 Kg Including loader / unloader） （ *1:The described productivity and placement accuracy may differ depending on the conditions o

Unit Level Manufacturing by the Synchro-motion of Dispensing and Bonding Epoxy Epoxy Epoxy dispensing head Auto Production Screen the Bonding Stage Camera Epoxy dispensing Epoxy dispensing This system allows you to realize manufacturing with real-time quality-inspection. Die bonding Post-bonding inspection Epoxy dispensing Friendly Operation Example screens of the interactive software Graphics screens will guide you to the next step automatically Recognition Teaching Examples Intuitive teaching is possible with friendly operation Ultrasonic monitoring data sample Process parameters during ultrasonic...