MD-P200
2Pages

Catalog excerpts

DEVICE BONDER High quality bonding (High Accuracy, Epoxy Quality etc.) contributes to valuable devices production. Multi small die capability contributes to downsizing of valuable devices. Variety of Epoxy-supplying method (Writing , Stamping , Dual Epoxy etc.) contributes to flexible production. *1 *1 The above described productivity and bonding accuracy may differ depending on the condions of use. * For details, refer to the specification manual.

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Our Solutions, Your Value Unit Level Manufacturing by the Synchro-motion of Dispensing and Bonding Die bonding is carried out immediately after Epoxy ■Proc*ss now Dtagrmi dispensing, thereby making It possible to finish p-i cmm, the bonding operation before the Epoxy is Ep«y-aspens head MK deteriorated over time. This realizes stable and high quality bonding at all bond positions on a substrate. Also, the Bonding Stage Camera enables pre-bonding inspection right after Epoxy dispensing and post-bonding inspection right after the This system allows you to realize manufacturing with real-time...

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