DEVICE BONDER High quality bonding (High Accuracy, Epoxy Quality etc.) contributes to valuable devices production. Multi small die capability contributes to downsizing of valuable devices. Variety of Epoxy-supplying method (Writing , Stamping , Dual Epoxy etc.) contributes to flexible production. *1 *1 The above described productivity and bonding accuracy may differ depending on the condions of use. * For details, refer to the specification manual.

Our Solutions, Your Value Unit Level Manufacturing by the Synchro-motion of Dispensing and Bonding Die bonding is carried out immediately after Epoxy ■Proc*ss now Dtagrmi dispensing, thereby making It possible to finish p-i cmm, the bonding operation before the Epoxy is Ep«y-aspens head MK deteriorated over time. This realizes stable and high quality bonding at all bond positions on a substrate. Also, the Bonding Stage Camera enables pre-bonding inspection right after Epoxy dispensing and post-bonding inspection right after the This system allows you to realize manufacturing with real-time quality-inspection....