E600
9Pages

Catalog excerpts

2008 Dry Etching Equipment Product News Panasonic Dry Etching Device Suited for The Next Generation Bonding of 3D Lamination, MEMS, High Aspect and Micro Fabrication, and Device Processing of Difficult Etching Materials. Dry Etching System E620 R&D E620 E650 E720 E760

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By the microfabricated technology of the semiconductor, a great number of maciromachines come into the world. Development of micromachines are being remarkably advanced by the fusion of biotechnology and nanotechnology. 3D microprocessing, 3D structure to be built up the silicon plate and self-congured 3D microstructure are also achieved. By applying these technology, a micro optical switch, a micromotor and a superconducting delivery system are researched and developed for practical use. MEMS is applied for mobile devices or computers and it is also greatly expected to contribute to the...

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Rich Lineup Supported for Device Evolution Panasonic Dry etching device to enable TSV (Through-Sivia) processing used for 3D laminated device which is a main of the next generation bonding, deep drilling processing on a silicon plate and metal processing to support various MEMS devices, high aspect and micro fabrication for the power device and processing of dicult etching materials. Simple & Compact High Performance & Compact E600 Series E620 R&D E700 Series E620 E650 E720 E760 ETCH ETCH ETCH LOAD LOCK LOAD LOCK ETCH ETCH LOAD LOCK ETCH ETCH TRANSFER CHAMBER ASH ASH LOAD LOCK TRANSFER...

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Semiconductor Package Development Trend The device such as the mobile product of CMOS/CCD which is represented as the mobile phone is being expected to be undergoing big change. We provide higher accuracy and smaller size devices which are demanded for laminated DRAM and CMOS image sensor, etc essential for mobile equipment. Furthermore, we contribute to produce the higher-level 3D image sensor used in medical and biological eld, DSP and memory, etc. High Performance Jisso Trend Map Wireless Interconnect Si-Interposer Cost Performance TSV Die Stacking FC-BGA T-BGA POP Stacked SiP P-BGA(WB)...

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Excellent Etching Performance (Etched Sample by ICP) Panasonic supports the mass-production of leading-edge thin-lm devices with technologies developed using a variety of semiconductor manufacturing equipment (3 to 8 inches). Provides the industry's top processing performance. MEMS/BOSCH/Deep-Si ( High Aspect & Deep-trench Etching) High Aspect Etching & Deep-trench Etching 0.3µm 1.50µm 0.35µm 0.20µm 100µm 83µm 3.06µm 0.75µm 500µm 86.4˚ 36µm 1.50µm Highest Speed Deep Etching High Aspect Ratio SiO2 Vertical Shape L/S = 100 nm/200 nm Vertical Shape Notch-free SOI substrate High Rate Via...

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Vast Experience Built Up in Mass Production E600 Series E620 R&D E620 E650 Simple & Compact MSC Type ICP MSC Type RIE 75~200 mm Single Chamber E600Series Advanced Function and High-reliability Further Improved with Space-saving Design Easy maintenance made possible by the simple chamber structure. Easily detachable top quartz component and inner chamber. Built-in chamber heater improves process stability by suppressing the attachment/separation of the reaction product. Easy-to-see Graphic Screen Improves Operation and Control The 15-inch color graphic screen makes the operation easier....

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High-performance E700 Series with The Multi-chamber E720 E760 High Performance & Compact Advanced ICP Advanced RIE 75~200 mm Multi Chamber E700 Series High Productivity Achieved by The Multi-chamber System by The High-vacuum Discharge System. 2600 High area productivity Multi-chamber design Use of a slide type gate reduces dust generation. High throughput when using two etching chambers Ease of Maintenance E720 (Two etching chambers) (Sl/h) 60.0 E620 (One etching chamber) 50.0 Easily replaceable quartz plate, inner cover, electrodes etc. make maintenance simple and easy. E720 Series –...

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PLASMA DRY ETCHING SYSTEM Specifications Equipment Specifications E620 R&D E620 E650 E720 E760 Etching & Ash Composition Chart ETCH ETCH ETCH ETCH ETCH ETCH TRANSFER CHAMBER LOAD LOCK ETCH LOAD LOCK LOAD LOCK ASH ASH LOAD LOCK High Cost-Performance TRANSFER CHAMBER ASH LOAD LOCK High Cost-Performance with Precision & Reliability Applications for Various Needs Applications for Various Needs MEMS Maximum 6 Systems Maximum 6 Systems Etching Chamber 1 Tmp + Dry Pump Tmp + Dry Pump Tmp + Dry Pump Tmp + Dry Pump Etching Chamber 2 — — — Tmp + Dry Pump — — Dry Pump Gas Supply Unit Gas Discharge...

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Matsushita Group products are built with the Matsushita group builds Environmental Management System in the factories of the world and acquires the International Environmental Standard ISO 14001:2004. Import and sales of models other than those conforming to the EC machine directive and EMC directive are prohibited in the EC after January 1. 1996. Panasonic Factory Solutions Co., Ltd. Marketing & Sales Coordination Department Osaka: 2-7 Matsuba-cho, Kadoma, Osaka 571-8502, Japan "Changes in specifications and appearance may be made without notice for product improvement. •Recycled paper is...

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