Catalog excerpts
High Performance FR4 Standard size warp weft mm Copper foil thickness Laminate thickness Thickness tolerance [ Features ] [ Applications ] . Clear preg available Laminate: R - 1755 Prepreg: R - 1650 Other thicknesses on request . High performance FR4 material for PCB production . Tg 170° C by DSC method . Phenolic cured, excellent heat resistance, low water absorption . Excellent CAF resistance . For lead free assembly . Conforms to the most important international standards IPC-4101B/26/124/129, UL 94, IPC-4562, UL 746 . UV-blocking Computer and peripherial devices, servers, routers, measuring instruments, automotive, semi conductor devices, etc . Workability: with standard FR4 process Thin laminates (excluding Copper foil thickness) 920 x 1220 1160 x 1060 1060 x 1220 1110 x 1220 1060 x 1280 0,018 mm 0,035 mm 0,070 mm according to IPC - 4101 B B - ( C ) according to IPC - 4101 B L - ( M ) Rigid laminates (including Copper foil thickness) Rev. 3 27.11.2007
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