• Die-attach adhesives with options for electrical and thermal conductivity.
• Panacol offers bond-line control and customized system solutions.

• Excellent thermal conductivity and high glass transition temperature (TG).
• Suitable for long-term storage at +5°C with a long pot life and short curing times.

• Thermal conductivity options: 1-2 W/mK, 2-5 W/mK, >5 W/mK.

• Dispenser, stencil or screen printing, needle or pin transfer.

• Optional thickness control at 40 μm, 75 μm, or 100 μm.
• Ensures consistent bond-line thickness for optimal thermal conductivity and mechanical precision.

• Specially developed for LED assembly with benefits like low ionic content and cost-effective production.
• Single-component adhesives with long pot life (8 to 96 hours) and short cure times (e.g., 10 min at 150°C).

• Six months storage at +5°C without deep-freezing.
• Precision adhesive dispensing and regular, even bonded joints.
• Reduces application errors and variations in component height.

• Filler sizes range from 1-30 μm with content between 65-85%.
• Rheological properties include viscosity and thixotropy, with production-specific adjustments possible.

Note: Operating parameters depend on production characteristics and may differ from the provided information. Panacol reserves the right to modify technical data.