Services Offered: Package Design and Analysis Prototyping Pilot Builds SMT Wire Bonding Component Placement Metrology Services Ball Bumping Package Sealing Benefits: We apply ideas and solutions from years of packaging experience so that Palomar Technologies can develop and validate your process before you invest in production equipment. Typical Devices: RF Amplifiers Flip Chip MEMS / MOEMS LEDs Solar Application Categories: Stacked Die Direct Chip Attach 1. Wire Bonding Gold or aluminum wire, round wire or ribbon, and stud bumping needs. Fine pitch, deep access, and large work areas available. 2. Die Attach ח Epoxy, eutectic, thermosonic, and thermocompression attachments. Deep access, large work areas, steady-state, and pulsed heat control. Accuracies up to 1.5 micron, 3 sigma. 3. Test & Metrology Full metrology services including SEM, elemental analysis, SAM, XYZ optical microscopes, wire pull and shear tester, die shear tester.4. Palomar Technology ז partnerships: a. Component handling b. Wafer saw c. Surface mount d. Package sealing e. Failure analysis services i. X-section ii. Elemental analysis iii. X-Ray Microscope Optical Devices Hybrids Implantable Devices Stud Bumping Thermosonic Attach High Bright LEDs Why choose Palomar Microelectronics process development & prototyping services? Achieve a cost-effective alternative to investing in capital equipment. Gain immediate access to manufacturing expertise and increased capacity without making staff increases. Evaluate prototype devices and manufacturing methods quickly and efficiently. Reduce time to market. Increase yield with a volume production solution. Options: Our applications engineers can develop your process in-house, or we can form a research and development partnership with your company. A separate private lab is available to accommodate an engineering team from your company with as much process support as you may require from our Applications team. A comprehensive range of services are offered out of our private lab in Carlsbad. Palomar Technologies Inc. 2728 Loker Avenue West Carlsbad, CA 92010 Phone 760.931.3600 Fax 760.931.5191 >

Component Assembly Work Cell: 1. Information Collection: Customer submits a form providing a detailed scope of their development project. Automated Component Assembly Cell Laser Diode Attach Precision Eutectic Die Bonder RF Component Assembly Cell LED Gang Reflow 2. Evaluation: Palomar Engineers discusses the application and project requirements to determine the overall scope. 3 . Quotations: Palomars applications manager defines a detailed quote including each process required, the piece part price plus the estimated total project price. Wire Bonding Deep Access Wedge Bonders Chain Stitch Bonding...