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MODEL UDB-140B EUTECTIC/THERMOPLASTIC DIE BONDER

MODEL UDB-140B EUTECTIC/THERMOPLASTIC DIE BONDER

MODEL UDB-140B EUTECTIC/THERMOPLASTIC DIE BONDER

Product catalog summary
Overview: The UDB-140B is a semi-automatic die bonder designed for eutectic, thermoplastic, and other die attach media requiring heat at the die pick-up tool or package work stage. It is suitable for continuous production, small production runs, and laboratory applications.
Standard Features:
  • Heated nitrogen cover gas.
  • Black & white CCTV system.
  • Separate preform pick-up tool and cycle.
  • Manual and semi-automatic operation.
  • Adjustable scrub time and amplitude.
  • Single axis scrub with manual X-Y alignment stage.
  • Waffle pack/loose die pick-up pedestal.
  • Pitch and roll adjustment for bond head.
  • Independent head and stage temperature control.
  • PLC Control.
Options:
  • Die ejector systems.
  • Heated N2 cover gas package enclosure.
  • Color CCTV system.
  • Zoom stereo microscope with swivel base.
  • Dual fiber optic illumination system.
  • Dual axis scrub bond head.
  • Lead frame and semi-automatic indexing systems.
  • Remote pendant controls.
  • Variable time ramped temperature generator.
  • Laser diode alignment search height pause.
  • Customization based on specific application.
Specifications:
  • Scrub System: Single Axis (Magnetic coil) and Dual Axis (Motorized).
  • Scrub Amplitude: 0 - 25 mils (0 - 635μm).
  • Bond Time Range: 0 - 15 seconds.
  • Dwell Time: 0 - 15 seconds.
  • Bonding Force Range: 15 - 50gr standard, up to 500gr optional.
  • Temperature Range: Stage (Ambient to 500°C), Collet (Ambient to 250°C).
  • Bondable Die Size Range: 6x6 mils to 750x750 mils.
  • Placement Accuracy: ±1mil (±25.4μm).
  • Bondable Preform Alloys: AuSn, AuSi, AuGe, and others.
  • Bond Head Movement: Motorized, rotational.
  • Bond Actuation: Opto-sensor, cycle activated by footswitch.
  • Z Travel/Vertical Bonding Window: 0.5in./0.125 to 0.500 in.
  • Placement Table Motion: Manual with thumbscrews.
  • Input Power: 120 VAC 50/60Hz @ 10A max.
  • Minimum Bench Space: X & Z = 18in., Y = 22in.
  • Facilities Required: Vacuum (23in.Hg), Inert Gas (60psi).
  • Unit Weight/Shipping Weight: 75lbs/150lbs.
  • Units Per Hour: 90-240 depending on options and settings.
Contact Information: Palomar Technologies, Inc., 2728 Loker Avenue West, Carlsbad, California 92010-6603. Phone: 760.931.3600, Fax: 760.931.5191, Email: [email protected], Website: www.palomartechnologies.com
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Catalog excerpts

MODEL UDB-140B EUTECTIC/THERMOPLASTIC DIE BONDER-1

MODEL UDB-140B EUTECTIC/THERMOPLASTIC DIE BONDER STANDARD FEATURES: ! Heated nitrogen cover gas. ! Black & white CCTV system (as shown). ! Separate preform pick up tool and cycle. ! Manual and semi-automatic operation. ! Adjustable scrub time. ! Single axis scrub. ! Manual X-Y alignment stage. ! Waffle pack/loose die pick up pedestal. ! Pitch and roll adjustment for bond head. ! Independent head and stage temperature control. ! Adjustable scrub amplitude. ! PLC Control. The UDB-140B is a semi-automatic die bonder for eutectic, thermoplastic, and other die attach media where heat is required at the die pick up tool and/or the package work stage. Precise die placement, quick device change over and versatility are integral with the design. The UDB- 140B is rugged enough for continuous production and ideal for small production runs and laboratory applications. Die pick up and placement are facilitated with the aid of dual CCTV cameras and a split screen monitor which incorporates a die and package targeting system. A perform pick up system, a 4:1 X-Y manipulator for package location, and a dual axis adjustable excursion scrub can be added depending on the application. The UDB-140B is modular and easily adapted to various modifications. Custom packages and die can be accommodated by designing in suitable fixtures to fit the application. PALOMAR TECHNOLOGIES

 Open the catalog to page 1
MODEL UDB-140B EUTECTIC/THERMOPLASTIC DIE BONDER-2

Partial List of Available Options: ! Die ejector systems. ! Heated N2 cover gas package enclosure. ! Color CCTV system. ! Zoom stereo microscope with swivel base. ! Dual fiber optic illumination system. ! Dual axis scrub bond head. ! Lead frame indexing systems. ! Semi-automatic indexing systems. ! Remote pendant controls. ! Variable time ramped temperature generator. ! Laser diode alignment search height pause. ! Customization based on specific application. Model Specifications: ! Scrub System: Single Axis: Magnetic coil @ 50/60 Hz. Dual Axis: Motorized ! Scrub Amplitude: 0 - 25 mils (0 - 635Öm)....

 Open the catalog to page 2
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.