MODEL EDB-140A EPOXY/SILVER GLASS DIE BONDER
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MODEL EDB-140A EPOXY/SILVER GLASS DIE BONDER STANDARD FEATURES: ! Black & white CCTV system (as shown). ! Package depth sensor for consistent and precise bond line thickness. ! Programmable dispense control unit. ! Storage for up to 99 dispense programs. ! Manual X-Y alignment stage. ! Waffle pack/loose die pick up pedestal. ! Pitch and roll adjustment for bond head. ! Custom dispense heads/dispense patterns. ! Custom die collets to match customer die. ! Manual and semi-automatic operation modes. ! PLC Control. HYBOND=s Model EDB-140A is a semiautomatic epoxy/silver glass die bonder which provides uniform epoxy or silver glass dispensing with consistent material thickness and precise die placement. The EDB-140A can be fitted with a waffle pack/gel pack or loose die pedestal or a die ejector for holding die on wafers. The dispense system can be fitted with HYBOND’s micro-dispense head for extremely low volume epoxy dispensing. This die bonder is rugged enough for continuous production and ideal for small production runs and laboratory applications. Die pick up and placement are made easy with the aid of dual CCTV cameras and a split screen monitor which incorporates a die and package visual targeting system. The EDB-140A is modular and easily adapts to modifications to accommodate fixturing for custom packages. PALOMAR TECHNOLOGIES

Partial List of Available Options: ! Die ejector systems. ! Color CCTV system. ! Zoom stereo microscope with swivel base. ! Dual fiber optic illumination system. ! Stir column for silver glass/conductive epoxy. ! Micro-dispensing head and control box. ! Lead frame indexing systems. ! Semi-automatic indexing systems. ! Remote pendant controls. ! Customization based on specific application. Model EDB-140A Specifications: ! Dispense System: Programmable, positive pressure system (standard). ! Bond Line Accuracy: Í0.5mil (Í12,7Öm). ! Bond Time Range: 7 to 15 seconds. ! Bond Force Range: 15 -...